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Renesas R7F7017103ABG-C#HC1
- Part No.:
- R7F7017103ABG-C#HC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 233-FBGA
- Datasheet:
-
R7F7017103ABG-C#HC1.pdf
- Description:
- 32BIT MCU RH850/F1KH-D8
- Quantity:
- Payment:
- Shipping:
Inventory:2,384
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Product details
Overview
R7F7017103ABG-C#HC1 from Renesas is a 32-bit dual-core automotive microcontroller (RH850/F1KH-D8) featuring two RH850G3KH2.0 CPUs running at up to 240 MHz, 8 MB Code Flash, 256 KB Data Flash, and integrated functional safety mechanisms per ISO 26262 ASIL-D requirements. It delivers real-time control for advanced driver assistance systems (ADAS) and vehicle domain controllers.
For engineers reviewing the R7F7017103ABG-C#HC1 datasheet, R7F7017103ABG-C#HC1 pinout, R7F7017103ABG-C#HC1 application, or R7F7017103ABG-C#HC1 equivalent, this page provides verified specifications, package mapping, safety architecture details, and automotive interface support including CAN-FD (8 channels), FlexRay (2 channels), Ethernet AVB (1 channel), and hardware cryptographic acceleration via ICUMD.
Technical Context
The R7F7017103ABG-C#HC1 implements a dual-RH850G3KH2.0 core architecture with independent MPU, FPU, and interrupt controllers (INTC1/INTC2), enabling lockstep or split-mode operation for ASIL-D compliance. Its system interconnect supports concurrent access to 8 MB Code Flash (with ECC), 576 KB Global RAM, and 192 KB Local RAM per core.
Peripheral integration includes RS-CANFD (8 channels), FLXA (2-channel FlexRay), ETNB (1-channel MII Ethernet AVB), and dual A/D converters (ADCA0: 34 ch total; ADCA1: 36 ch total), all protected by ECC and clock monitors (CLMA). The ICUMD subsystem provides AES/RNG-based secure boot and domain-isolated execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual RH850G3KH2.0 cores with 5-stage pipeline, single-cycle basic instructions, and bit-manipulation support for deterministic real-time control. |
| Max Clock Frequency | 240 MHz - enables sub-microsecond interrupt latency and high-throughput signal processing in motor control and ADAS sensor fusion. |
| Memory | 8 MB Code Flash (ECC-protected), 256 KB Data Flash, 576 KB Global RAM, 192 KB Local RAM per core, 64 KB Retention RAM - supports OTA updates and ASIL-D runtime data integrity. |
| Automotive Interfaces | 8× RS-CANFD, 2× FLXA (FlexRay A/B), 1× ETNB (MII Ethernet AVB), 5× CSIH, 5× CSIG, 2× RSENT, 2× RIIC - meets centralized gateway and zonal ECU communication requirements. |
| Safety & Security | ISO 26262 ASIL-D SEooC certification; ECC on Flash/RAM/peripherals; CLMA clock monitors; ICUMD with secure CPU, AES engine, RNG, and HW domain isolation. |
| Power Management | DeepSTOP mode disables non-essential circuits; Low Power Sampler (LPS) performs autonomous analog sampling without CPU wake-up - extends battery life in always-on vehicle modules. |
Pinout & Package
Package: 233-pin Fine-Pitch Ball Grid Array (FPBGA), 15 mm × 15 mm, 0.8 mm pitch, RoHS-compliant, rated for –40°C to +125°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated power domains for CPU core (REG0VCC), I/O buffers (VPOC to 5.5 V), and A/D converters (3.0–5.5 V) enable noise-isolated mixed-signal operation. |
| CLKIN, CLKOUT | External clock input/output | Accepts 8/16/20/24 MHz crystal or oscillator input; FOUT pin provides programmable clock output for trace/debug synchronization. |
| RESET, RESETOUT | Reset control | Asynchronous reset input with internal POR/LVI; RESETOUT drives external peripherals during controlled system initialization sequences. |
| TDI, TDO, TCK, TMS | JTAG boundary scan | IEEE 1149.1-compliant debug interface supporting on-chip debug (OCD), flash programming, and structural test across full temperature range. |
| ETX0–ETX3, ERX0–ERX3 | Ethernet physical layer I/O | MII interface pins for 10/100 Mbps Ethernet AVB - require external PHY; supports time-sensitive networking for audio/video streaming and diagnostics. |
| CAN0TX–CAN7TX, CAN0RX–CAN7RX | CAN-FD transceiver I/O | Eight independent CAN-FD channels with bit rates up to 5 Mbps - each pair supports flexible data-rate arbitration and payload transmission in body control and chassis networks. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep mode | Enables ASIL-D fault detection via hardware comparison of CPU outputs - eliminates need for software-based redundancy checks in safety-critical paths. |
| Intelligent Cryptographic Unit Master D (ICUMD) | Includes dedicated secure RH850 G3K CPU, AES-128/256 engines, TRNG, and hardware-enforced memory domain separation - accelerates secure boot and OTA key management. |
| Low Power Sampler (LPS) | Autonomously samples up to 34 analog inputs (ADCA0) at configurable intervals without CPU intervention - reduces active power by >40% in always-monitoring vehicle subsystems. |
| Error Correction Coding (ECC) | End-to-end ECC coverage on Code Flash, Data Flash, Local/Global/Retention RAM, and critical peripherals (RS-CANFD, FLXA, ETNB) - prevents silent data corruption in long-life automotive deployments. |
| PWM-Diagnostic (PWM-Diag) | 80-channel PWM generation with built-in diagnostic feedback (open-load, short-to-ground, short-to-VDD) - simplifies motor driver validation and reduces external BOM in EPS and HVAC actuators. |
Applications
| Advanced Driver Assistance Systems (ADAS) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Sensor fusion unit aggregating radar, camera, and ultrasonic inputs for adaptive cruise control and automatic emergency braking. IC Role / Device Role / Timing Role: Central real-time controller executing ASIL-D safety kernels, managing CAN-FD/FlexRay sensor backbones, and synchronizing timestamped data via OSTM and RTCA. Use Value: Dual-core lockstep and ECC-protected memory ensure deterministic response under fault conditions; 240 MHz clock sustains <100 µs control loop timing for steering actuator commands. |
Use Scenario: High-precision torque and angle control module interfacing with three-phase inverter drivers and torque sensors. IC Role / Device Role / Timing Role: Motor control MCU generating synchronized PWM-Diag signals, monitoring phase currents via ADCA0/ADCA1, and communicating status over CAN-FD to vehicle network. Use Value: 80-channel PWM-Diag enables full bridge diagnostics without external comparators; TAUB/TAUJ timers deliver <50 ns PWM resolution for field-oriented control. |
| Vehicle Domain Controller | Body Control Module (BCM) |
|
Use Scenario: Zonal gateway consolidating LIN, CAN-FD, and Ethernet traffic between cockpit, chassis, and powertrain domains. IC Role / Device Role / Timing Role: Network hub with 8× CAN-FD, 2× FlexRay, 1× Ethernet AVB, and 16× RLIN2 interfaces - routing time-critical messages with hardware-accelerated filtering. Use Value: Hardware packet filtering and priority queuing in ETNB/RS-CANFD reduce CPU load by >60%; ICUMD secures firmware updates against replay attacks. |
Use Scenario: Centralized lighting, door lock, and climate control unit managing 96+ GPIOs and PWM outputs across vehicle body systems. IC Role / Device Role / Timing Role: High-I/O MCU driving LED matrix displays, solenoid locks, and HVAC fans via PWM-Diag while monitoring switch returns (KR) and analog sensors. Use Value: 96-channel PWM-Diag and 8-channel Key Return (KR) simplify wiring harness design; LPS autonomously polls door position sensors during sleep mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017113ABG-C | Same RH850/F1KH-D8 family, identical 233-pin FPBGA package and 8 MB/256 KB memory, but rated for –40°C to +105°C (vs. +125°C for R7F7017103ABG-C#HC1). | Targeted at cabin electronics and infotainment where ambient temperature stress is lower than under-hood environments. | Select R7F7017113ABG-C when extended temperature qualification is not required and cost optimization is prioritized. |
| R7F7016503ABG-C | RH850/F1KM-S4 single-core variant in same 233-pin FPBGA; 4 MB Code Flash, 256 KB Data Flash, 32 KB Trace RAM, no ETNB or FlexRay. | Suitable for mid-tier ADAS cameras or gateway nodes requiring CAN-FD/LIN/Ethernet but not dual-core redundancy or ASIL-D certification. | Choose R7F7016503ABG-C for non-safety-critical applications needing lower BOM cost and reduced software complexity. |
Compared with R7F7017103ABG-C#HC1, R7F7017113ABG-C offers identical functionality at a lower temperature grade, while R7F7016503ABG-C trades dual-core safety and FlexRay/Ethernet AVB for cost and simplicity in less demanding automotive domains.
Availability
R7F7017103ABG-C#HC1 is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), electric power steering (EPS), and vehicle domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-D functional safety compliance.
Supply support for R7F7017103ABG-C#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RH850/F1KH-D8 product line was designed specifically for ASIL-D automotive safety-critical applications including ADAS, chassis control, and domain controllers - integrating dual-core lockstep, ECC memory, and hardware security to meet ISO 26262 requirements out-of-the-box.
FAQ
What is the operating temperature range for R7F7017103ABG-C#HC1?
R7F7017103ABG-C#HC1 is qualified for operation from –40°C to +125°C, making it suitable for under-hood automotive applications such as engine control units and electric power steering modules where thermal stress is extreme. This extended temperature rating is confirmed in Table 1A.2 of the R01DS0442EJ0100 datasheet and distinguishes it from the +105°C variant R7F7017113ABG-C.
Does R7F7017103ABG-C#HC1 support Ethernet AVB, and what interface does it use?
Yes, R7F7017103ABG-C#HC1 integrates one Ethernet AVB (ETNB) channel compliant with IEEE 802.1AS and 802.1Qat standards, implemented via a Media Independent Interface (MII) with dedicated ETX0–ETX3 and ERX0–ERX3 pins. It requires an external PHY and supports time-synchronized audio/video streaming and diagnostics in vehicle networks.
How many CAN-FD channels does R7F7017103ABG-C#HC1 provide, and are they fully independent?
R7F7017103ABG-C#HC1 provides eight fully independent RS-CANFD channels, each with dedicated TX/RX pins, message RAM, and filtering logic. All channels support bit rates up to 5 Mbps, flexible data-rate arbitration, and ISO 11898-1:2015 compliance - enabling simultaneous communication across multiple vehicle domains without resource contention.
What security features are implemented in the Intelligent Cryptographic Unit Master D (ICUMD) of R7F7017103ABG-C#HC1?
The ICUMD in R7F7017103ABG-C#HC1 includes a dedicated secure RH850 G3K CPU, AES-128/256 encryption/decryption engines, true random number generator (TRNG), and hardware-enforced memory domain isolation. It enables secure boot, encrypted OTA updates, and cryptographic key protection - all verified under ISO 26262 ASIL-D development processes.
Is R7F7017103ABG-C#HC1 pin-compatible with other RH850/F1KH-D8 variants in the 233-pin FPBGA package?
Yes, R7F7017103ABG-C#HC1 shares identical 233-pin FPBGA mechanical and electrical pinout with other RH850/F1KH-D8 members in the same package (e.g., R7F7017113ABG-C, R7F7017104ABG-C), including consistent power, ground, clock, reset, JTAG, and peripheral pin assignments - enabling hardware reuse across temperature and memory variants.
R7F7017103ABG-C#HC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 233-FBGA
- Series:
- RH850/F1KM-D8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 174
- Program Memory Size:
- 6MB (6M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 896K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 38x10b, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7017103ABG-C#HC1 FAQ
1.How can I place an order for R7F7017103ABG-C#HC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7017103ABG-C#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7017103ABG-C#HC1 reliable?
The price and inventory of R7F7017103ABG-C#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7017103ABG-C#HC1 is usually 5 days.
3.What payment methods are accepted for R7F7017103ABG-C#HC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7017103ABG-C#HC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7017103ABG-C#HC1?
R7F7017103ABG-C#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7017103ABG-C#HC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7017103ABG-C#HC1?
For technical support, including R7F7017103ABG-C#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7017103ABG-C#HC1 requirements.
6.How does Aetrix verify that R7F7017103ABG-C#HC1 is sourced from the original manufacturer or authorized distributors?
All R7F7017103ABG-C#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7017103ABG-C#HC1 meets industry standards.
7.What is the process for return or replacement of R7F7017103ABG-C#HC1?
All R7F7017103ABG-C#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7017103ABG-C#HC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7017103ABG-C#HC1 part is unused and in its original packaging.
Return procedure for R7F7017103ABG-C#HC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7017103ABG-C#HC1 Tags
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