Renesas R7F7017113ABG-C#AC1

Overview

R7F7017113ABG-C#AC1 from Renesas Electronics is a 32-bit RH850/F1KM-S4 automotive microcontroller featuring dual-core lockstep CPU, ASIL-D functional safety compliance, 4MB on-chip flash, 512KB SRAM, and integrated CAN FD, LIN, and Ethernet AVB interfaces. It targets engine control units (ECUs), transmission control modules, and chassis domain controllers requiring high-integrity real-time processing.

For engineers reviewing the R7F7017113ABG-C#AC1 datasheet, R7F7017113ABG-C#AC1 pinout, R7F7017113ABG-C#AC1 application, or R7F7017113ABG-C#AC1 equivalent, key selection criteria include ASIL-D certification status, dual-core lockstep fault detection latency, flash ECC coverage, CAN FD data rate support up to 5 Mbps, and temperature grade (-40°C to +125°C) for under-hood deployment.

Technical Context

The R7F7017113ABG-C#AC1 implements two synchronized RH850 G3KH cores operating in lockstep mode with hardware-based comparison logic and error injection for diagnostic coverage validation. It integrates a Safety Support Core (SSC) for independent monitoring of CPU, memory, and peripheral integrity.

Memory subsystem includes 4MB flash with single-bit error correction and double-bit error detection (SEC-DED), 512KB SRAM with parity protection, and 64KB TCM (Tightly Coupled Memory) for deterministic interrupt response. Peripheral safety features include self-testable DMA, watchdog timers with independent clock sources, and configurable error signaling via FIT (Fault Injection Test) registers.

Key Specifications

Pinout & Package

Package: 256-pin LQFP (24mm × 24mm, 0.5mm pitch), thermally enhanced with exposed thermal pad. Compliant with JEDEC MS-026D, RoHS and REACH.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Compared with R7F7017113ABG-C#AC1, the R7F7017114ABG-C#AC1 offers extended temperature capability and flash headroom for future firmware growth, while the TC397XP demands full hardware and software requalification due to architectural and interface differences.

Availability

R7F7017113ABG-C#AC1 is available at Aetrix Electronics and suitable for engine control units, brake control modules, and chassis domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for R7F7017113ABG-C#AC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The RH850/F1KM product line delivers ASIL-D-certified MCUs for safety-critical automotive domains including powertrain, chassis, and advanced driver assistance systems (ADAS).

FAQ

What is the maximum CAN FD data rate supported by the R7F7017113ABG-C#AC1?

The R7F7017113ABG-C#AC1 supports CAN FD up to 5 Mbps in the data phase, with programmable bit timing and sample point configuration. All four integrated CAN FD controllers meet ISO 11898-1:2015 requirements and include hardware CRC, bit stuffing, and error confinement logic. This capability enables high-bandwidth ECU-to-ECU communication in modern vehicle architectures without requiring external protocol accelerators.

Does the R7F7017113ABG-C#AC1 include hardware support for ISO 26262 ASIL-D compliance?

Yes, the R7F7017113ABG-C#AC1 includes dedicated hardware for ASIL-D compliance, including dual-core lockstep with cycle-accurate comparison, Safety Support Core (SSC) for independent monitoring, SEC-DED flash ECC, parity-protected SRAM, and FIT registers for diagnostic test coverage validation. Renesas provides a certified FMEDA report, safety manual, and hardware abstraction layer (HAL) to accelerate ISO 26262 development.

What is the operating temperature range and qualification standard for the R7F7017113ABG-C#AC1?

The R7F7017113ABG-C#AC1 is qualified per AEC-Q100 Grade 1, with an operating ambient temperature range of -40°C to +125°C. It meets automotive reliability requirements for under-hood applications, including thermal cycling, humidity bias, and mechanical shock testing. The device is manufactured in Renesas' certified automotive wafer fab and assembled in TS 16949-compliant facilities.

How does the R7F7017113ABG-C#AC1 handle memory safety for safety-critical applications?

The R7F7017113ABG-C#AC1 enforces memory safety through multiple hardware mechanisms: 4MB flash with SEC-DED ECC, 512KB SRAM with parity checking, 64KB TCM with lockstep access control, and MPU with 16 configurable regions supporting privilege levels and execute-never attributes. These features collectively prevent silent data corruption and unauthorized code execution, satisfying ASIL-D memory integrity requirements.

Is the R7F7017113ABG-C#AC1 pin-compatible with other RH850/F1KM variants?

The R7F7017113ABG-C#AC1 uses the 256-pin LQFP package shared across the RH850/F1KM-S4 family, including R7F7017114ABG-C#AC1 and R7F7017115ABG-C#AC1. Pin functions are identical for all S4 variants; differences reside in flash size, temperature grade, and optional peripheral enablement - verified in Renesas' "RH850/F1KM Pin Function" documentation section 2B.2.