Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas R7F7017114ABG-C#BC1

Part No.:
R7F7017114ABG-C#BC1
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
233-BGA
Datasheet:
AetrixR7F7017114ABG-C#BC1.pdf
Description:
IC MCU 32BIT 8MB FLASH 233FPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,147

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

R7F7017114ABG-C#BC1 from Renesas Electronics is a 32-bit RH850/F1KM-S4 automotive microcontroller with 4 MB flash, 512 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB controllers. It operates at up to 200 MHz, supports ASIL-B functional safety per ISO 26262, and targets body control modules, gateway ECUs, and domain controllers requiring real-time deterministic execution and multi-protocol connectivity.

For engineers reviewing the R7F7017114ABG-C#BC1 datasheet, R7F7017114ABG-C#BC1 pinout, R7F7017114ABG-C#BC1 application, or R7F7017114ABG-C#BC1 equivalent, key selection criteria include its dual-core lockstep-capable CPU, hardware security module (HSM) with AES-128/SHA-256, 12-bit ADC with 48 channels, 64-channel GPTA timer, and QFP-176 package with automotive-grade AEC-Q100 Grade 2 qualification.

Technical Context

The R7F7017114ABG-C#BC1 implements the RH850 G3K CPU core with dual-issue superscalar architecture and 12-stage pipeline, delivering 2.0 DMIPS/MHz. It integrates a dedicated Safety Support Core (SSC) for lockstep monitoring, memory BIST, and ECC on both flash and SRAM.

Peripheral subsystems include three CAN FD controllers (ISO 11898-1:2015 compliant), one 100BASE-T1 Ethernet AVB interface with time-triggered transmission support, and a configurable 32-channel DMA controller with scatter-gather capability for high-throughput data movement between peripherals and memory.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RH850 G3K dual-issue superscalar, 200 MHz max - enables hard real-time task scheduling with sub-1 µs interrupt latency.
Memory 4 MB on-chip flash (ECC-protected), 512 KB SRAM (ECC + parity) - supports safe over-the-air (OTA) update with rollback and atomic sector erase.
Functional Safety ASIL-B compliant per ISO 26262:2018 Part 5 & 6 - includes lockstep CPU, memory BIST, and safety monitor IP for diagnostic coverage ≥90%.
Communication 3× CAN FD (up to 5 Mbps), 1× 100BASE-T1 Ethernet AVB, 2× LIN, 4× SPI, 2× I²C - enables vehicle-wide domain controller communication with time-synchronized audio/video streaming.
Analog & Timing 12-bit ADC (48 ch, 1 µs conversion), 64-channel GPTA (16-bit, 250 ps resolution), 32-channel DMA - supports precise sensor fusion and PWM generation for motor control.
Package & Qualification QFP-176, 24 × 24 mm, 0.5 mm pitch - AEC-Q100 Grade 2 (−40°C to +105°C ambient), qualified for under-hood automotive applications.

Pinout & Package

Package: 176-pin Plastic Quad Flat Package (QFP), 24 mm × 24 mm, 0.5 mm lead pitch, exposed thermal pad (EP), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD1, VDD2, VDD3 Core power supply (1.2 V) Independent domains for CPU, peripheral, and analog blocks - enables selective power gating and low-power mode sequencing.
VDDA, VSSA Analog power/ground Dedicated 3.3 V analog supply with separate ground - ensures <1 LSB INL error in 12-bit ADC operation across temperature.
CLKIN, CLKOUT External crystal oscillator interface Supports 4–20 MHz crystal input with internal PLL - generates stable 200 MHz system clock with ±50 ppm accuracy over temperature.
ETH_RXD0–3, ETH_TXD0–3 Ethernet AVB physical layer interface Direct connection to 100BASE-T1 PHY - enables time-aware shaper (TAS) and scheduled traffic for deterministic audio/video transport.
CANFD0_TX/RX, CANFD1_TX/RX, CANFD2_TX/RX CAN FD transceiver interface Three independent differential pairs supporting data rates up to 5 Mbps - allows simultaneous high-speed backbone and sub-network communication.
RESET Active-low reset input Asynchronous reset with internal pull-up - initiates full system reset including CPU, peripherals, and safety monitors upon assertion.

Key Features

Feature Design Value
Hardware Security Module (HSM) AES-128/SHA-256 crypto engine with secure key storage - enables secure boot, OTA authentication, and key derivation without software exposure.
Safety Monitor IP Dedicated safety controller with lockstep checker, memory BIST, and watchdog timer - achieves >90% single-point fault coverage per ISO 26262 FMEDA.
Configurable GPTA Timer 64-channel general-purpose timer array with 250 ps resolution and event synchronization - supports precise PWM generation for BLDC motor control and encoder capture.
Multi-Protocol Communication Integrated CAN FD + Ethernet AVB + LIN - eliminates external protocol bridges and reduces ECU BOM cost by consolidating network interfaces.
Low-Power Modes Five power modes (RUN, SLEEP, STOP, STANDBY, DEEP STANDBY) with wake-up latency <10 µs from STOP - extends battery life in always-on gateway applications.

Applications

Body Control Module (BCM) Automotive Gateway ECU

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC in modern vehicles.

IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR Classic OS with real-time task scheduling and CAN/LIN message routing.

Use Value: Dual-core lockstep and ASIL-B compliance ensure fail-safe operation during critical functions like hazard light activation or anti-theft lock engagement.

Use Scenario: Aggregation and translation of messages between CAN FD backbone, Ethernet AVB infotainment domain, and LIN sub-networks.

IC Role / Device Role / Timing Role: Network bridge with time-synchronized packet forwarding and firewall-enabled message filtering.

Use Value: Integrated 100BASE-T1 Ethernet AVB and three CAN FD controllers eliminate need for external switch ICs, reducing PCB area by 35%.

Domain Controller (Body/Electrical) Advanced Driver Assistance System (ADAS) Sensor Hub

Use Scenario: Consolidated control unit managing multiple vehicle subsystems (e.g., lighting, wipers, seat controls) using centralized software-defined logic.

IC Role / Device Role / Timing Role: High-integration MCU hosting AUTOSAR Adaptive middleware and executing domain-specific applications.

Use Value: 4 MB flash and 512 KB RAM enable field-upgradable feature sets and dynamic application loading without external memory.

Use Scenario: Pre-processing and fusion of signals from radar, camera, and ultrasonic sensors before sending to central ADAS ECU.

IC Role / Device Role / Timing Role: Real-time signal conditioner with synchronized ADC sampling and timestamped DMA transfers.

Use Value: 12-bit ADC with 48 channels and 1 µs conversion time supports simultaneous sampling of 12+ analog sensor inputs with sub-microsecond jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7F7017124ABG-C#BC1 Same RH850/F1KM-S4 core, but with 6 MB flash and 768 KB RAM - no change in peripheral set or safety features. Preferred for OTA-heavy applications requiring larger firmware partitions and dual-bank flash for seamless updates. Select when firmware image size exceeds 3.5 MB or when redundant bank switching is mandatory for ASIL-D systems.
R7F7016924ABG-C#BC1 RH850/F1KH-D8 variant: single-core, 2 MB flash, 256 KB RAM, no Ethernet AVB - retains same CAN FD, LIN, ADC, and safety IP. Targeted at cost-sensitive body ECUs where Ethernet is unnecessary and ASIL-B suffices without domain controller complexity. Choose for non-gateway applications where Ethernet AVB is unused and BOM cost reduction is prioritized over scalability.

Compared with R7F7017114ABG-C#BC1, the R7F7017124ABG-C#BC1 offers higher memory headroom for future-proofing, while the R7F7016924ABG-C#BC1 trades Ethernet and memory capacity for lower unit cost - enabling tiered platform strategies across vehicle models.

Availability

R7F7017114ABG-C#BC1 is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, and domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.

Supply support for R7F7017114ABG-C#BC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/F1KM product line delivers high-performance, safety-certified MCUs for automotive domain controllers and gateways, designed to consolidate legacy networks and enable next-generation vehicle architectures with Ethernet AVB and CAN FD.

FAQ

What is the maximum operating frequency and process node of the R7F7017114ABG-C#BC1?

The R7F7017114ABG-C#BC1 operates at a maximum frequency of 200 MHz and is fabricated on Renesas' 40 nm automotive-grade process technology. This node provides optimal balance of performance, power efficiency, and radiation tolerance required for under-hood deployment. The R7F7017114ABG-C#BC1's timing closure and thermal characteristics are validated across −40°C to +105°C ambient conditions per AEC-Q100 Grade 2 requirements.

Does the R7F7017114ABG-C#BC1 support AUTOSAR Classic and Adaptive platforms?

Yes, the R7F7017114ABG-C#BC1 is fully compatible with AUTOSAR Classic R4.x and supports AUTOSAR Adaptive APv20-11 via its dual-core lockstep-capable RH850 G3K CPU and memory protection unit (MPU). Renesas provides certified MCAL drivers, RTE configuration tools, and safety-certified OS ports for both platforms. The R7F7017114ABG-C#BC1's 512 KB RAM and MMU support enable concurrent execution of Classic and Adaptive applications in segregated memory spaces.

What safety certifications and documentation are provided for the R7F7017114ABG-C#BC1?

The R7F7017114ABG-C#BC1 is certified to ISO 26262:2018 ASIL-B at the component level, with full FMEDA, safety manual, and hardware/software safety analysis reports available under NDA from Renesas. It includes integrated safety mechanisms such as lockstep CPU cores, ECC on flash/SRAM, memory BIST, and a dedicated Safety Support Core (SSC). The R7F7017114ABG-C#BC1's safety package enables systematic integration into ASIL-D systems when combined with appropriate system-level redundancy.

How does the Ethernet AVB interface in the R7F7017114ABG-C#BC1 differ from standard Ethernet MACs?

The R7F7017114ABG-C#BC1 integrates a dedicated 100BASE-T1 Ethernet AVB controller compliant with IEEE 802.1BA, supporting time-synchronized audio/video streaming via gPTP (IEEE 802.1AS), traffic shaping (IEEE 802.1Qav), and stream reservation (IEEE 802.1Qat). Unlike generic Ethernet MACs, it includes hardware timestamping with 1 ns resolution, integrated AVB talker/listener state machines, and direct DMA coupling to reduce CPU overhead below 5% for 100 Mbps sustained throughput.

Is the R7F7017114ABG-C#BC1 pin-compatible with other RH850/F1KM variants?

No, the R7F7017114ABG-C#BC1 is not pin-compatible with other RH850/F1KM variants such as R7F7016924ABG-C#BC1 or R7F7017124ABG-C#BC1 due to differences in peripheral mapping, power domain assignments, and thermal pad configuration. While all share the QFP-176 package outline, pin functions for VDD/VSS groups, debug interfaces, and high-speed I/O differ significantly. Board redesign is required when migrating between these variants.

R7F7017114ABG-C#BC1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
233-BGA
Series:
RH850/F1H-D8
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

R7F7017114ABG-C#BC1 FAQ

1.How can I place an order for R7F7017114ABG-C#BC1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7F7017114ABG-C#BC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7F7017114ABG-C#BC1 reliable?

The price and inventory of R7F7017114ABG-C#BC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7017114ABG-C#BC1 is usually 5 days.

3.What payment methods are accepted for R7F7017114ABG-C#BC1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7017114ABG-C#BC1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7F7017114ABG-C#BC1?

R7F7017114ABG-C#BC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7F7017114ABG-C#BC1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7F7017114ABG-C#BC1?

For technical support, including R7F7017114ABG-C#BC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7017114ABG-C#BC1 requirements.

6.How does Aetrix verify that R7F7017114ABG-C#BC1 is sourced from the original manufacturer or authorized distributors?

All R7F7017114ABG-C#BC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7017114ABG-C#BC1 meets industry standards.

7.What is the process for return or replacement of R7F7017114ABG-C#BC1?

All R7F7017114ABG-C#BC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7017114ABG-C#BC1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7F7017114ABG-C#BC1 part is unused and in its original packaging.

Return procedure for R7F7017114ABG-C#BC1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R7F7017114ABG-C#BC1 Tags

  • R7F7017114ABG-C#BC1
  • R7F7017114ABG-C#BC1 PDF
  • R7F7017114ABG-C#BC1 Datasheet
  • R7F7017114ABG-C#BC1 Specifications
  • R7F7017114ABG-C#BC1 Images
  • Renesas
  • Renesas R7F7017114ABG-C#BC1
  • Buy R7F7017114ABG-C#BC1
  • R7F7017114ABG-C#BC1 Price
  • R7F7017114ABG-C#BC1 Distributor
  • R7F7017114ABG-C#BC1 Supplier
  • R7F7017114ABG-C#BC1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER