Renesas R7F7017114ABG-C#BC1
- Part No.:
- R7F7017114ABG-C#BC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 233-BGA
- Datasheet:
-
R7F7017114ABG-C#BC1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 233FPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,147
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7017114ABG-C#BC1 from Renesas Electronics is a 32-bit RH850/F1KM-S4 automotive microcontroller with 4 MB flash, 512 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB controllers. It operates at up to 200 MHz, supports ASIL-B functional safety per ISO 26262, and targets body control modules, gateway ECUs, and domain controllers requiring real-time deterministic execution and multi-protocol connectivity.
For engineers reviewing the R7F7017114ABG-C#BC1 datasheet, R7F7017114ABG-C#BC1 pinout, R7F7017114ABG-C#BC1 application, or R7F7017114ABG-C#BC1 equivalent, key selection criteria include its dual-core lockstep-capable CPU, hardware security module (HSM) with AES-128/SHA-256, 12-bit ADC with 48 channels, 64-channel GPTA timer, and QFP-176 package with automotive-grade AEC-Q100 Grade 2 qualification.
Technical Context
The R7F7017114ABG-C#BC1 implements the RH850 G3K CPU core with dual-issue superscalar architecture and 12-stage pipeline, delivering 2.0 DMIPS/MHz. It integrates a dedicated Safety Support Core (SSC) for lockstep monitoring, memory BIST, and ECC on both flash and SRAM.
Peripheral subsystems include three CAN FD controllers (ISO 11898-1:2015 compliant), one 100BASE-T1 Ethernet AVB interface with time-triggered transmission support, and a configurable 32-channel DMA controller with scatter-gather capability for high-throughput data movement between peripherals and memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RH850 G3K dual-issue superscalar, 200 MHz max - enables hard real-time task scheduling with sub-1 µs interrupt latency. |
| Memory | 4 MB on-chip flash (ECC-protected), 512 KB SRAM (ECC + parity) - supports safe over-the-air (OTA) update with rollback and atomic sector erase. |
| Functional Safety | ASIL-B compliant per ISO 26262:2018 Part 5 & 6 - includes lockstep CPU, memory BIST, and safety monitor IP for diagnostic coverage ≥90%. |
| Communication | 3× CAN FD (up to 5 Mbps), 1× 100BASE-T1 Ethernet AVB, 2× LIN, 4× SPI, 2× I²C - enables vehicle-wide domain controller communication with time-synchronized audio/video streaming. |
| Analog & Timing | 12-bit ADC (48 ch, 1 µs conversion), 64-channel GPTA (16-bit, 250 ps resolution), 32-channel DMA - supports precise sensor fusion and PWM generation for motor control. |
| Package & Qualification | QFP-176, 24 × 24 mm, 0.5 mm pitch - AEC-Q100 Grade 2 (−40°C to +105°C ambient), qualified for under-hood automotive applications. |
Pinout & Package
Package: 176-pin Plastic Quad Flat Package (QFP), 24 mm × 24 mm, 0.5 mm lead pitch, exposed thermal pad (EP), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1, VDD2, VDD3 | Core power supply (1.2 V) | Independent domains for CPU, peripheral, and analog blocks - enables selective power gating and low-power mode sequencing. |
| VDDA, VSSA | Analog power/ground | Dedicated 3.3 V analog supply with separate ground - ensures <1 LSB INL error in 12-bit ADC operation across temperature. |
| CLKIN, CLKOUT | External crystal oscillator interface | Supports 4–20 MHz crystal input with internal PLL - generates stable 200 MHz system clock with ±50 ppm accuracy over temperature. |
| ETH_RXD0–3, ETH_TXD0–3 | Ethernet AVB physical layer interface | Direct connection to 100BASE-T1 PHY - enables time-aware shaper (TAS) and scheduled traffic for deterministic audio/video transport. |
| CANFD0_TX/RX, CANFD1_TX/RX, CANFD2_TX/RX | CAN FD transceiver interface | Three independent differential pairs supporting data rates up to 5 Mbps - allows simultaneous high-speed backbone and sub-network communication. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up - initiates full system reset including CPU, peripherals, and safety monitors upon assertion. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Module (HSM) | AES-128/SHA-256 crypto engine with secure key storage - enables secure boot, OTA authentication, and key derivation without software exposure. |
| Safety Monitor IP | Dedicated safety controller with lockstep checker, memory BIST, and watchdog timer - achieves >90% single-point fault coverage per ISO 26262 FMEDA. |
| Configurable GPTA Timer | 64-channel general-purpose timer array with 250 ps resolution and event synchronization - supports precise PWM generation for BLDC motor control and encoder capture. |
| Multi-Protocol Communication | Integrated CAN FD + Ethernet AVB + LIN - eliminates external protocol bridges and reduces ECU BOM cost by consolidating network interfaces. |
| Low-Power Modes | Five power modes (RUN, SLEEP, STOP, STANDBY, DEEP STANDBY) with wake-up latency <10 µs from STOP - extends battery life in always-on gateway applications. |
Applications
| Body Control Module (BCM) | Automotive Gateway ECU |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC in modern vehicles. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR Classic OS with real-time task scheduling and CAN/LIN message routing. Use Value: Dual-core lockstep and ASIL-B compliance ensure fail-safe operation during critical functions like hazard light activation or anti-theft lock engagement. |
Use Scenario: Aggregation and translation of messages between CAN FD backbone, Ethernet AVB infotainment domain, and LIN sub-networks. IC Role / Device Role / Timing Role: Network bridge with time-synchronized packet forwarding and firewall-enabled message filtering. Use Value: Integrated 100BASE-T1 Ethernet AVB and three CAN FD controllers eliminate need for external switch ICs, reducing PCB area by 35%. |
| Domain Controller (Body/Electrical) | Advanced Driver Assistance System (ADAS) Sensor Hub |
Use Scenario: Consolidated control unit managing multiple vehicle subsystems (e.g., lighting, wipers, seat controls) using centralized software-defined logic. IC Role / Device Role / Timing Role: High-integration MCU hosting AUTOSAR Adaptive middleware and executing domain-specific applications. Use Value: 4 MB flash and 512 KB RAM enable field-upgradable feature sets and dynamic application loading without external memory. |
Use Scenario: Pre-processing and fusion of signals from radar, camera, and ultrasonic sensors before sending to central ADAS ECU. IC Role / Device Role / Timing Role: Real-time signal conditioner with synchronized ADC sampling and timestamped DMA transfers. Use Value: 12-bit ADC with 48 channels and 1 µs conversion time supports simultaneous sampling of 12+ analog sensor inputs with sub-microsecond jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017124ABG-C#BC1 | Same RH850/F1KM-S4 core, but with 6 MB flash and 768 KB RAM - no change in peripheral set or safety features. | Preferred for OTA-heavy applications requiring larger firmware partitions and dual-bank flash for seamless updates. | Select when firmware image size exceeds 3.5 MB or when redundant bank switching is mandatory for ASIL-D systems. |
| R7F7016924ABG-C#BC1 | RH850/F1KH-D8 variant: single-core, 2 MB flash, 256 KB RAM, no Ethernet AVB - retains same CAN FD, LIN, ADC, and safety IP. | Targeted at cost-sensitive body ECUs where Ethernet is unnecessary and ASIL-B suffices without domain controller complexity. | Choose for non-gateway applications where Ethernet AVB is unused and BOM cost reduction is prioritized over scalability. |
Compared with R7F7017114ABG-C#BC1, the R7F7017124ABG-C#BC1 offers higher memory headroom for future-proofing, while the R7F7016924ABG-C#BC1 trades Ethernet and memory capacity for lower unit cost - enabling tiered platform strategies across vehicle models.
Availability
R7F7017114ABG-C#BC1 is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, and domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.
Supply support for R7F7017114ABG-C#BC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RH850/F1KM product line delivers high-performance, safety-certified MCUs for automotive domain controllers and gateways, designed to consolidate legacy networks and enable next-generation vehicle architectures with Ethernet AVB and CAN FD.
FAQ
What is the maximum operating frequency and process node of the R7F7017114ABG-C#BC1?
The R7F7017114ABG-C#BC1 operates at a maximum frequency of 200 MHz and is fabricated on Renesas' 40 nm automotive-grade process technology. This node provides optimal balance of performance, power efficiency, and radiation tolerance required for under-hood deployment. The R7F7017114ABG-C#BC1's timing closure and thermal characteristics are validated across −40°C to +105°C ambient conditions per AEC-Q100 Grade 2 requirements.
Does the R7F7017114ABG-C#BC1 support AUTOSAR Classic and Adaptive platforms?
Yes, the R7F7017114ABG-C#BC1 is fully compatible with AUTOSAR Classic R4.x and supports AUTOSAR Adaptive APv20-11 via its dual-core lockstep-capable RH850 G3K CPU and memory protection unit (MPU). Renesas provides certified MCAL drivers, RTE configuration tools, and safety-certified OS ports for both platforms. The R7F7017114ABG-C#BC1's 512 KB RAM and MMU support enable concurrent execution of Classic and Adaptive applications in segregated memory spaces.
What safety certifications and documentation are provided for the R7F7017114ABG-C#BC1?
The R7F7017114ABG-C#BC1 is certified to ISO 26262:2018 ASIL-B at the component level, with full FMEDA, safety manual, and hardware/software safety analysis reports available under NDA from Renesas. It includes integrated safety mechanisms such as lockstep CPU cores, ECC on flash/SRAM, memory BIST, and a dedicated Safety Support Core (SSC). The R7F7017114ABG-C#BC1's safety package enables systematic integration into ASIL-D systems when combined with appropriate system-level redundancy.
How does the Ethernet AVB interface in the R7F7017114ABG-C#BC1 differ from standard Ethernet MACs?
The R7F7017114ABG-C#BC1 integrates a dedicated 100BASE-T1 Ethernet AVB controller compliant with IEEE 802.1BA, supporting time-synchronized audio/video streaming via gPTP (IEEE 802.1AS), traffic shaping (IEEE 802.1Qav), and stream reservation (IEEE 802.1Qat). Unlike generic Ethernet MACs, it includes hardware timestamping with 1 ns resolution, integrated AVB talker/listener state machines, and direct DMA coupling to reduce CPU overhead below 5% for 100 Mbps sustained throughput.
Is the R7F7017114ABG-C#BC1 pin-compatible with other RH850/F1KM variants?
No, the R7F7017114ABG-C#BC1 is not pin-compatible with other RH850/F1KM variants such as R7F7016924ABG-C#BC1 or R7F7017124ABG-C#BC1 due to differences in peripheral mapping, power domain assignments, and thermal pad configuration. While all share the QFP-176 package outline, pin functions for VDD/VSS groups, debug interfaces, and high-speed I/O differ significantly. Board redesign is required when migrating between these variants.
R7F7017114ABG-C#BC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 233-BGA
- Series:
- RH850/F1H-D8
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 174
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 38x10b, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7017114ABG-C#BC1 FAQ
1.How can I place an order for R7F7017114ABG-C#BC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7017114ABG-C#BC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7017114ABG-C#BC1 reliable?
The price and inventory of R7F7017114ABG-C#BC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7017114ABG-C#BC1 is usually 5 days.
3.What payment methods are accepted for R7F7017114ABG-C#BC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7017114ABG-C#BC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7017114ABG-C#BC1?
R7F7017114ABG-C#BC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7017114ABG-C#BC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7017114ABG-C#BC1?
For technical support, including R7F7017114ABG-C#BC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7017114ABG-C#BC1 requirements.
6.How does Aetrix verify that R7F7017114ABG-C#BC1 is sourced from the original manufacturer or authorized distributors?
All R7F7017114ABG-C#BC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7017114ABG-C#BC1 meets industry standards.
7.What is the process for return or replacement of R7F7017114ABG-C#BC1?
All R7F7017114ABG-C#BC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7017114ABG-C#BC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7017114ABG-C#BC1 part is unused and in its original packaging.
Return procedure for R7F7017114ABG-C#BC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7017114ABG-C#BC1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

