My Inquiry
My Account
Renesas R7F7017114ABG-C#HC1
- Part No.:
- R7F7017114ABG-C#HC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 233-FBGA
- Datasheet:
-
R7F7017114ABG-C#HC1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 223FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,256
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7017114ABG-C#HC1 from Renesas Electronics is a 32-bit RH850/F1KM-S4 automotive microcontroller featuring dual-core lockstep CPU architecture, 4MB on-chip flash memory, and integrated ASIL-D compliant safety mechanisms including ECC-protected RAM, BIST, and redundant clock monitoring. It operates at up to 200 MHz and supports CAN FD, Ethernet AVB, and multiple LIN interfaces - deployed in vehicle domain controllers for ADAS sensor fusion and chassis control.
For engineers reviewing the R7F7017114ABG-C#HC1 datasheet, R7F7017114ABG-C#HC1 pinout, R7F7017114ABG-C#HC1 application, or R7F7017114ABG-C#HC1 equivalent, key selection criteria include ASIL-D certification status, dual-core lockstep timing validation, flash ECC coverage scope, CAN FD data-rate support (up to 5 Mbps), and package-specific thermal resistance (θJA = 22.5°C/W for ABG).
Technical Context
The R7F7017114ABG-C#HC1 implements a dual-core RH850 G3KH CPU with hardware-enforced lockstep execution, where one core acts as master and the other as checker - both executing identical instructions with cycle-accurate comparison. It integrates a dedicated Safety Support Core (SSC) for runtime diagnostics including memory BIST, clock domain monitoring, and voltage supervisor checks.
Its peripheral set includes three CAN FD controllers (ISO 11898-1:2015 compliant), one 100BASE-T1 Ethernet MAC with AVB timestamping, 16-channel 12-bit ADC with window compare, and a configurable 32-channel GPTA timer subsystem supporting PWM generation and input capture with ±1-cycle jitter tolerance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850 G3KH cores in lockstep mode - enables real-time fault detection per ISO 26262 ASIL-D requirements. |
| Max Clock Frequency | 200 MHz - delivers 390 DMIPS performance while maintaining deterministic interrupt latency ≤ 12 cycles. |
| Flash Memory | 4 MB with ECC protection and 128-bit wide interface - supports concurrent read-while-write and secure boot verification. |
| RAM | 1.5 MB SRAM with SECDED ECC and memory partitioning - configurable into safety-critical and non-safety partitions. |
| Package | 256-pin LQFP (24 × 24 mm, 0.5 mm pitch) - ABG suffix denotes automotive-grade AEC-Q100 Grade 1 qualification (−40°C to +125°C). |
| CAN FD Interfaces | 3 channels, each supporting data rates up to 5 Mbps and payload lengths up to 64 bytes - compliant with ISO 11898-1:2015. |
| Ethernet Interface | 1× 100BASE-T1 MAC with IEEE 802.1AS timestamping and AVB QoS support - no external PHY required. |
Pinout & Package
Package: 256-pin LQFP (ABG), 24 mm × 24 mm, 0.5 mm pitch, exposed thermal pad (EPAD) connected to VSS. Thermal resistance θJA = 22.5°C/W, θJC = 3.2°C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_1P2 | Core power supply (1.2 V) | Must be decoupled with ≥10 µF ceramic + 100 nF near-pin; monitored by internal voltage supervisor for brownout detection. |
| VDD_3P3 | I/O and peripheral power (3.3 V) | Supplies GPIO, CAN transceivers, and ADC reference; requires separate filtering from VDD_1P2 to prevent coupling noise. |
| RESETN | Active-low reset input | Asynchronous reset signal; internal pull-up enabled; must be held low ≥ 100 ns after VDD stabilization for reliable release. |
| CLKIN | External crystal oscillator input | Accepts 8–20 MHz fundamental-mode crystal; drives on-chip PLL generating 200 MHz system clock with ±50 ppm stability. |
| CAN0_TX / CAN0_RX | CAN FD channel 0 differential I/O | CMOS-level signals requiring external CAN transceiver (e.g., TJA1044); support bit rates up to 5 Mbps with programmable sample point. |
| ETH_MDC / ETH_MDIO | IEEE 802.3 management interface | Used to configure internal Ethernet PHY registers; MDC clock frequency ≤ 2.5 MHz; MDIO bidirectional open-drain. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Hardware-synchronized instruction execution with cycle-accurate comparison - detects transient faults within ≤2 cycles. |
| Safety Support Core (SSC) | Independent diagnostic engine performing periodic memory BIST, clock domain validation, and voltage monitoring - certified per ISO 26262 ASIL-D. |
| Secure Boot ROM | Immutable 32 KB ROM with SHA-256 hash verification and AES-128 decryption - enforces authenticated firmware loading before main code execution. |
| Configurable GPTA Timer | 32-channel general-purpose timer array with dead-time insertion, complementary PWM output, and synchronized ADC trigger capability. |
| Integrated Ethernet AVB | 100BASE-T1 MAC with hardware timestamping, traffic shaping, and IEEE 1722/1733 protocol acceleration - reduces host CPU load by >40% vs. software stack. |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque assist calculation and motor phase current control under dynamic road conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and functional safety monitor. Use Value: Achieves <10 µs worst-case interrupt latency and <50 ns PWM edge jitter - meeting ISO 26262 timing constraints for Category C EPS systems. |
Use Scenario: Redundant hydraulic pressure modulation and wheel-speed-based brake actuation during autonomous emergency braking. IC Role / Device Role / Timing Role: Dual-channel safety controller managing independent brake circuits with cross-monitoring via SSC diagnostics. Use Value: Enables dual-redundant CAN FD communication (5 Mbps) and synchronized ADC sampling across 16 channels - ensuring <1 ms end-to-end control loop time. |
| Vehicle Domain Controller (VDC) | Advanced Driver Assistance Systems (ADAS) Sensor Fusion |
|
Use Scenario: Centralized coordination of camera, radar, and ultrasonic sensors with over-the-air update handling. IC Role / Device Role / Timing Role: High-integrity domain manager running AUTOSAR Adaptive and Classic stacks with memory partitioning. Use Value: 4 MB ECC flash supports dual-bank firmware updates without downtime; Ethernet AVB enables deterministic sensor data streaming at ≤200 µs latency. |
Use Scenario: Time-aligned fusion of LiDAR point clouds, camera image streams, and radar object lists for path prediction. IC Role / Device Role / Timing Role: Timing-critical sensor aggregator using hardware timestamping and GPTA-triggered ADC sampling. Use Value: Hardware-synced 12-bit ADC (1 MSPS) and Ethernet timestamp resolution of ±50 ns enable sub-millisecond sensor correlation accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017112ABG-C#HC1 | Same RH850/F1KM-S4 core, but 2 MB flash and 768 KB RAM - no Ethernet MAC or second CAN FD channel. | Suitable for mid-tier chassis modules where Ethernet and full CAN FD bandwidth are not required. | Select when cost-sensitive ASIL-B/C designs omit AVB networking and require only two CAN FD interfaces. |
| TC397XP-128F300FABK | Infineon AURIX™ TC3xx tri-core architecture; 300 MHz max clock; 4 MB flash; includes HSM security module. | Requires different AUTOSAR BSW adaptation due to distinct safety monitor architecture and peripheral register layout. | Choose when existing toolchain investment favors AURIX ecosystem or HSM-based secure boot is mandatory. |
Compared with R7F7017114ABG-C#HC1, the R7F7017112ABG-C#HC1 reduces memory and connectivity for cost-constrained ASIL-B applications, while the TC397XP offers higher clock speed and integrated HSM at the expense of different safety diagnostic methodology and toolchain alignment.
Availability
R7F7017114ABG-C#HC1 is available at Aetrix Electronics and suitable for electric power steering (EPS), brake-by-wire control units, vehicle domain controllers, and ADAS sensor fusion modules requiring stable component supply across automotive production lifecycles.
Supply support for R7F7017114ABG-C#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1KM product line delivers high-integrity automotive MCUs targeting ASIL-D safety-critical systems such as chassis control, powertrain, and domain controllers - designed to meet ISO 26262 requirements with integrated hardware safety mechanisms.
FAQ
What safety certifications does the R7F7017114ABG-C#HC1 hold?
The R7F7017114ABG-C#HC1 is qualified to AEC-Q100 Grade 1 (−40°C to +125°C) and supports ISO 26262 ASIL-D compliance through its dual-core lockstep architecture, Safety Support Core (SSC), ECC-protected memories, and built-in self-test features. Renesas provides FMEDA reports and safety manuals for R7F7017114ABG-C#HC1 to support customer safety case development.
Does the R7F7017114ABG-C#HC1 include an integrated Ethernet PHY?
No, the R7F7017114ABG-C#HC1 integrates only a 100BASE-T1 Media Access Controller (MAC) - it requires an external automotive-grade Ethernet PHY (e.g., NXP TJA1103 or Microchip LAN8770) for physical layer signaling. The MAC supports IEEE 802.1AS timestamping and AVB traffic shaping, but PHY configuration is handled via MDIO/MDC interface.
What is the maximum supported CAN FD data rate on the R7F7017114ABG-C#HC1?
The R7F7017114ABG-C#HC1 supports CAN FD data rates up to 5 Mbps on all three CAN FD controllers, compliant with ISO 11898-1:2015. Each controller supports flexible bit timing configuration, automatic retransmission, and error frame generation - with dedicated FIFO buffers enabling zero-loss reception at full rate.
How is flash memory protected against corruption in the R7F7017114ABG-C#HC1?
The R7F7017114ABG-C#HC1 implements ECC protection across its entire 4 MB flash array using Hamming SECDED codes, detecting and correcting single-bit errors and detecting double-bit errors in real time. Flash access is further secured by write-protection regions, secure boot ROM verification, and lock bits preventing unauthorized read-out or programming.
What debug interface does the R7F7017114ABG-C#HC1 support?
The R7F7017114ABG-C#HC1 supports JTAG (IEEE 1149.1) and Nexus Class 3+ debug interfaces via dedicated pins (TCK/TMS/TDO/TDI/TRSTN). It enables full visibility into dual-core lockstep operation, real-time trace via Embedded Trace Macrocell (ETM), and safety monitor register inspection - compatible with Lauterbach TRACE32 and Renesas E2 emulator.
R7F7017114ABG-C#HC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 233-FBGA
- Series:
- RH850/F1x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 174
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 38x10b, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7017114ABG-C#HC1 FAQ
1.How can I place an order for R7F7017114ABG-C#HC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7017114ABG-C#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7017114ABG-C#HC1 reliable?
The price and inventory of R7F7017114ABG-C#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7017114ABG-C#HC1 is usually 5 days.
3.What payment methods are accepted for R7F7017114ABG-C#HC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7017114ABG-C#HC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7017114ABG-C#HC1?
R7F7017114ABG-C#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7017114ABG-C#HC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7017114ABG-C#HC1?
For technical support, including R7F7017114ABG-C#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7017114ABG-C#HC1 requirements.
6.How does Aetrix verify that R7F7017114ABG-C#HC1 is sourced from the original manufacturer or authorized distributors?
All R7F7017114ABG-C#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7017114ABG-C#HC1 meets industry standards.
7.What is the process for return or replacement of R7F7017114ABG-C#HC1?
All R7F7017114ABG-C#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7017114ABG-C#HC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7017114ABG-C#HC1 part is unused and in its original packaging.
Return procedure for R7F7017114ABG-C#HC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7017114ABG-C#HC1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
