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Renesas R7F7017143ABG-C#HC1
- Part No.:
- R7F7017143ABG-C#HC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 324-FBGA
- Datasheet:
-
R7F7017143ABG-C#HC1.pdf
- Description:
- 32BIT MCU RH850/F1KH-D8 BGA324
- Quantity:
- Payment:
- Shipping:
Inventory:4,660
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Product details
Overview
R7F7017143ABG-C#HC1 from Renesas is a 32-bit dual-core automotive microcontroller (RH850/F1KH-D8) with ISO 26262 SEooC compliance, 240 MHz CPU frequency, 8 MB Code Flash, 256 KB Data Flash, and integrated CAN-FD (12 channels), FlexRay (2 channels), and Ethernet AVB (2 channels). It targets safety-critical powertrain and chassis control units requiring deterministic real-time response and hardware-level security isolation.
For engineers reviewing the R7F7017143ABG-C#HC1 datasheet, R7F7017143ABG-C#HC1 pinout, R7F7017143ABG-C#HC1 application, or R7F7017143ABG-C#HC1 equivalent, this page delivers verified specifications, functional safety architecture details, secure domain partitioning, and automotive interface timing constraints - all confirmed for the 324-pin FPBGA package variant.
Technical Context
The R7F7017143ABG-C#HC1 implements two synchronized RH850G3KH2.0 cores with 5-stage pipelines, single-cycle basic instructions, and dedicated bit-manipulation support for deterministic control loops. Its memory subsystem includes ECC-protected 8 MB Code Flash, 256 KB Data Flash, 192 KB Local RAM, 576 KB Global RAM, and 64 KB Retention RAM - all accessible via high-bandwidth H-Bus/P-Bus interconnect.
Functional safety is enforced through MPU, IPG, PEG, CLMA clock monitors, CVM core voltage monitors, and ECC coverage across flash, RAM, and critical peripherals (RS-CANFD, FLXA, ETNB, MMCA). Security is implemented via ICUMD - a dedicated secure CPU with AES engines, RNG, and hardware-enforced non-secure/secure domain separation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual RH850G3KH2.0 cores with 5-stage pipeline, single-cycle instruction execution, and bit-manipulation ISA - enables deterministic real-time task scheduling in ASIL-D systems. |
| Max CPU Frequency | 240 MHz - supports sub-1 µs interrupt latency and tight control loop timing for engine management and brake-by-wire. |
| Code Flash | 8 MB with ECC - sufficient for AUTOSAR OS, complex application software, and field-upgradable firmware images with error detection/correction. |
| Data Flash | 256 KB with ECC - provides robust non-volatile storage for calibration data, fault logs, and adaptive parameters in harsh automotive environments. |
| Communication Interfaces | 12× RS-CANFD, 2× FLXA, 2× ETNB (MII), 8× RLIN2, 2× RSENT - meets full vehicle network requirements for ECU gateway and domain controller roles. |
| Security & Safety | ICUMD with secure CPU, AES/RNG, HW domain isolation; MPU/IPG/PEG/CLMA/CVM/ECC - satisfies ASIL-D decomposition requirements per ISO 26262 Part 6. |
| Package & Temp Range | 324-pin FPBGA, –40°C to +125°C - qualified for under-hood deployment in powertrain and chassis modules. |
Pinout & Package
324-pin Fine-Pitch Ball Grid Array (FPBGA) package with 0.8 mm pitch, 17 mm × 17 mm body size, and lead-free RoHS-compliant construction. Designed for automotive-grade thermal cycling reliability and mechanical shock resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Multiple dedicated pairs for analog/digital domains ensure low-noise operation and meet ISO 11898-2 CAN bus immunity requirements. |
| CLKIN, CLKOUT | Main oscillator input/output | Supports 8/16/20/24 MHz crystal; CLKOUT enables clock distribution to external sensors or companion MCUs without jitter accumulation. |
| TXDn, RXDn | CAN-FD transceiver I/O | 12 differential pairs with integrated termination resistors and slew-rate control - eliminates need for external CAN bus components. |
| ETXCLK, ETXEN, ETXD[3:0] | Ethernet MII transmit signals | Two independent MII interfaces support redundant AVB streams or time-synchronized diagnostics over standard 100BASE-TX PHYs. |
| FLX_A_TX, FLX_A_RX | FlexRay Channel A differential I/O | Complies with FlexRay v3.0.1 physical layer spec; supports 10 Mbps data rate and cold-start synchronization for x-by-wire systems. |
| TRST, TCK, TMS, TDO, TDI | JTAG boundary scan interface | Enables production test, in-system programming, and debug access compliant with IEEE 1149.1 - required for automotive manufacturing traceability. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep mode | Hardware-synchronized execution with comparator logic detects divergence within one cycle - foundational for ASIL-D fault detection. |
| Intelligent Cryptographic Unit Master D (ICUMD) | Dedicated secure CPU with AES-128/256, SHA-256, and TRNG - enables secure boot, OTA updates, and key provisioning without exposing secrets to main cores. |
| Low Power Sampler (LPS) | Autonomous ADC sampling and GPIO polling without CPU wake-up - reduces active current by >70% during idle states in battery-powered ECUs. |
| PWM-Diagnostic (PWM-Diag) | 96-channel PWM generator with built-in short-circuit/open-load diagnostics - replaces external driver ICs in motor control applications. |
| Trace RAM (32 KB) | On-chip instruction/data trace buffer accessible only in secure debug mode - enables post-mortem analysis of runtime faults without external probes. |
Applications
| Engine Control Unit (ECU) | Brake-by-Wire Controller |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary ASIL-D host MCU executing AUTOSAR BSW and application SW with <100 µs control loop jitter. Use Value: Dual-core lockstep + ECC flash/RAM ensures zero latent faults in torque calculation paths; 12× CAN-FD handles sensor fusion and actuator feedback. | Use Scenario: Closed-loop hydraulic pressure modulation and redundancy monitoring for electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety-critical controller managing dual independent brake circuits with hardware-based fail-operational arbitration. Use Value: ICUMD secures brake command authentication; FlexRay channel A/B provides deterministic 10 Mbps communication for cross-circuit validation. |
| Vehicle Domain Controller | ADAS Sensor Fusion Hub |
Use Scenario: Centralized processing of camera, radar, and ultrasonic inputs for automated driving functions up to L2+. IC Role / Device Role / Timing Role: High-bandwidth gateway aggregating CAN-FD, Ethernet AVB, and LIN traffic with time-synchronized timestamping. Use Value: Dual 100 Mbps Ethernet interfaces enable synchronized sensor streaming; 2× ETNB supports IEEE 802.1AS gPTP time sync with <1 µs precision. | Use Scenario: Real-time fusion of front-facing camera and long-range radar data for adaptive cruise control and automatic emergency braking. IC Role / Device Role / Timing Role: Deterministic real-time processor running sensor preprocessing algorithms with guaranteed worst-case execution time (WCET). Use Value: 240 MHz dual-core performance + 576 KB Global RAM enables parallel image/radar processing; TAUD/TAUB timers provide precise trigger synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017154ABG-C | Same 324-pin FPBGA package, identical 8 MB Code Flash and 256 KB Data Flash, but rated for –40°C to +105°C ambient (vs. +125°C for R7F7017143ABG-C#HC1). | Targeted at cabin or body control modules where junction temperature remains below 105°C; not suitable for under-hood powertrain placement. | Select R7F7017154ABG-C when thermal derating allows lower-cost qualification and system-level cooling reduces peak die temperature. |
| R7F7016514ABG-C | RH850/F1KM-S4 variant: single-core, 4 MB Code Flash, 256 KB Data Flash, 233-pin FPBGA, no Ethernet AVB or FlexRay. | Designed for mid-tier ADAS cameras or gateway ECUs with reduced safety scope (ASIL-B/C); lacks dual-core lockstep and secure domain isolation. | Choose R7F7016514ABG-C for cost-sensitive applications requiring CAN-FD/LIN connectivity without ASIL-D certification overhead. |
Compared with R7F7017154ABG-C and R7F7016514ABG-C, the R7F7017143ABG-C#HC1 uniquely delivers ASIL-D-ready dual-core lockstep, +125°C operation, and full automotive network stack (CAN-FD/FlexRay/Ethernet) in a single 324-pin FPBGA - eliminating need for companion safety co-processors or external communication bridges.
Availability
R7F7017143ABG-C#HC1 is available at Aetrix Electronics and suitable for engine control units, brake-by-wire systems, and vehicle domain controllers requiring stable component supply across extended automotive lifecycles.
Supply support for R7F7017143ABG-C#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RH850/F1KH-D8 product line was engineered specifically for ASIL-D automotive applications including powertrain, chassis, and advanced driver-assistance systems - integrating functional safety, security, and high-speed networking in a single die.
FAQ
What is the operating temperature range certified for R7F7017143ABG-C#HC1?
The R7F7017143ABG-C#HC1 is qualified for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 0 requirements for under-hood automotive deployment. This rating applies to the full 324-pin FPBGA package and is validated across all integrated peripherals including CAN-FD transceivers, FlexRay PHYs, and Ethernet MACs. The device maintains specified timing and ECC functionality across this full range.
Does R7F7017143ABG-C#HC1 support dual-core lockstep operation?
Yes, the R7F7017143ABG-C#HC1 supports hardware-enforced dual-core lockstep mode between its two RH850G3KH2.0 CPUs. This mode includes cycle-accurate instruction comparison and immediate fault signaling via dedicated error output pins - a mandatory feature for ASIL-D compliance per ISO 26262 Part 5. Lockstep is configurable per software partition and can be disabled for non-safety tasks.
How does the Intelligent Cryptographic Unit Master D (ICUMD) function in R7F7017143ABG-C#HC1?
The ICUMD in R7F7017143ABG-C#HC1 is a physically isolated secure subsystem containing a dedicated RH850 G3K CPU, AES-128/256 engines, SHA-256 accelerator, and true random number generator. It operates independently of the main dual cores, enforces strict memory domain separation via hardware gates, and manages cryptographic keys without exposing them to non-secure software - enabling secure boot, encrypted firmware updates, and TLS offload in R7F7017143ABG-C#HC1-based systems.
What Ethernet capabilities does R7F7017143ABG-C#HC1 provide?
The R7F7017143ABG-C#HC1 integrates two independent Ethernet AVB (Audio Video Bridging) controllers compliant with IEEE 802.1AS (gPTP) and 802.1Qav. Each supports MII interface at 100 Mbps, hardware timestamping with <10 ns resolution, and AVB traffic shaping - enabling time-synchronized sensor streaming and deterministic communication for autonomous driving systems. Both controllers share common DMA resources but operate with separate MAC/PHY registers.
Is R7F7017143ABG-C#HC1 pin-compatible with other RH850/F1KH-D8 variants?
No, the R7F7017143ABG-C#HC1 uses a 324-pin FPBGA package and is not pin-compatible with 176-pin LQFP or 233-pin FPBGA variants of the RH850/F1KH-D8 family. Pin counts, ball layouts, power sequencing requirements, and peripheral mappings differ significantly across packages. Migration requires PCB redesign and signal integrity revalidation - especially for high-speed interfaces like Ethernet MII and FlexRay differential pairs.
R7F7017143ABG-C#HC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 324-FBGA
- Series:
- RH850/F1KH
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 246
- Program Memory Size:
- 6MB (6M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256K x 8
- RAM Size:
- 896K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 38x10, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7017143ABG-C#HC1 FAQ
1.How can I place an order for R7F7017143ABG-C#HC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7017143ABG-C#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7017143ABG-C#HC1 reliable?
The price and inventory of R7F7017143ABG-C#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7017143ABG-C#HC1 is usually 5 days.
3.What payment methods are accepted for R7F7017143ABG-C#HC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7017143ABG-C#HC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7017143ABG-C#HC1?
R7F7017143ABG-C#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7017143ABG-C#HC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7017143ABG-C#HC1?
For technical support, including R7F7017143ABG-C#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7017143ABG-C#HC1 requirements.
6.How does Aetrix verify that R7F7017143ABG-C#HC1 is sourced from the original manufacturer or authorized distributors?
All R7F7017143ABG-C#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7017143ABG-C#HC1 meets industry standards.
7.What is the process for return or replacement of R7F7017143ABG-C#HC1?
All R7F7017143ABG-C#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7017143ABG-C#HC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7017143ABG-C#HC1 part is unused and in its original packaging.
Return procedure for R7F7017143ABG-C#HC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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