Renesas R7F7017623AFP-C#KA1
- Part No.:
- R7F7017623AFP-C#KA1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R7F7017623AFP-C#KA1.pdf
- Description:
- 32BIT MCU RH850/F1KM-S2 2MB LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,796
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7017623AFP-C#KA1 from Renesas is a 32-bit automotive-grade dual-core MCU (RH850/F1KM-S2 family) with single RH850G3KH2.0 CPU core, 2 MB Code Flash, 128 KB Data Flash, and ISO 26262 SEooC compliance for ASIL-B system integration. It delivers 240 MHz max CPU frequency, single-precision FPU, and integrated safety mechanisms including ECC on flash/RAM, clock monitors (CLMA), and memory protection unit (MPU). Used in body control modules requiring functional safety and secure boot.
For engineers reviewing the R7F7017623AFP-C#KA1 datasheet, R7F7017623AFP-C#KA1 pinout, R7F7017623AFP-C#KA1 application, or R7F7017623AFP-C#KA1 equivalent, this page provides verified specifications, package mapping, automotive peripheral support (CAN-FD, LIN, SENT), functional safety architecture, and validated alternative options for ECU design and BOM optimization.
Technical Context
The R7F7017623AFP-C#KA1 implements the RH850G3KH2.0 core with 5-stage pipeline, one-cycle basic instruction execution, and bit manipulation extensions optimized for real-time automotive control. It integrates dedicated safety hardware including CLMA clock monitors, CVM core voltage monitors, LVI low-voltage indicator, and PEG/MPU/IPG protection units.
Peripheral subsystems include RS-CANFD (8 channels), RLIN3 (6 channels), RLIN2 (6 channels), CSIH (4 channels), RSENT (2 channels), TAUD/TAUB/TAUJ timers, OSTM (5 units), ADCA0 (34-channel 12/10-bit ADC with T&H), and ICUMD cryptographic engine supporting AES and RNG - all accessible via H-bus/P-bus interconnect with DMA (32 channels).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RH850G3KH2.0 single-core, 240 MHz max, 5-stage pipeline, one-cycle basic instructions |
| Memory | 2 MB Code Flash (reprogrammable in-system), 128 KB Data Flash, 128 KB Local RAM, 96 KB Global RAM, 32 KB Retention RAM |
| Safety Features | ECC on Code/Data Flash, Local/Global/Retention RAM; CLMA clock monitors; MPU, IPG, PEG protection units; ISO 26262 SEooC compliant |
| Automotive Interfaces | 8× RS-CANFD, 6× RLIN3, 6× RLIN2, 4× CSIH, 2× RSENT, 2× FlexRay, no Ethernet AVB |
| Analog & Timing | ADCA0: 34 physical channels (16× 12-bit + 18× 10-bit, with sample-and-hold); TAUD (1 unit), TAUB (1 unit), TAUJ (4 units), OSTM (5 units) |
| Security & Debug | ICUMD with secure CPU, AES engine, RNG; on-chip debug (OCD); boundary scan; HW domain separation between secure/non-secure |
Pinout & Package
This device uses a 144-pin LQFP package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per Renesas R01DS0442EJ0100 Rev.1.00 Section 1B.2 and Figure 1B.2 block diagram.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated pins for REG0VCC (AWO), REG1VCC (ISO), I/O buffers (3.0–5.5 V), and A/D converter supplies |
| RESET / RESETOUT | Reset input / output | Asynchronous reset assertion; RESETOUT enables system-level reset propagation to peripherals |
| CLK / SUBOSC | External clock / sub-oscillator | Supports 8/16/20/24 MHz MainOSC; 32.768 kHz SubOSC for RTCA and low-power timing |
| TXDn / RXDn | LIN/UART serial interface | RLIN3 channel pairs (6 total) support LIN 2.2A/2.2B and UART modes with automatic baud rate detection |
| TXD_CAN / RXD_CAN | CAN-FD transceiver interface | RS-CANFD physical layer interface (8 channels) with programmable bit timing, loopback, and error counters |
| AD00–AD33 | Analog input channels | ADCA0 inputs supporting 12-bit/10-bit resolution, external multiplexer extension, and sample-and-hold for synchronous sampling |
Key Features
| Feature | Design Value |
|---|---|
| Dual-domain security architecture | HW-enforced separation between secure (ICUMD-controlled) and non-secure domains; flash/RAM partitioning prevents unauthorized access |
| Functional safety co-processing | Integrated CLMA clock monitors, CVM, LVI, and POC detect and report faults before system-level failure; ECC corrects single-bit errors in real time |
| Low-power signal acquisition | Low Power Sampler (LPS) autonomously polls up to 32 analog/digital inputs without CPU wake-up, reducing active power by >40% in sleep states |
| Real-time deterministic I/O | PWM-Diag (64 channels) supports synchronized edge generation, fault injection, and diagnostic feedback for motor/solenoid control loops |
| Automotive communication scalability | 8 CAN-FD channels with flexible data-rate switching (up to 5 Mbps), 6 LIN master/slave interfaces with auto-sync and checksum offload |
Applications
| Body Control Module (BCM) | Door Module |
|---|---|
Use Scenario: Centralized control of lighting, windows, locks, mirrors, and HVAC actuators in passenger vehicles. IC Role / Device Role / Timing Role: Primary controller executing ASIL-B safety-critical diagnostics, LIN/CAN gateway logic, and PWM-driven actuator sequencing. Use Value: Integrated 64-channel PWM-Diag enables concurrent drive and health monitoring of 12+ solenoids/motors without external ICs; ECC-protected flash ensures firmware integrity over 15-year vehicle lifecycle. |
Use Scenario: Smart door module managing window lift, mirror fold, keyless entry, and intrusion detection. IC Role / Device Role / Timing Role: Real-time sensor fusion hub processing capacitive touch, Hall effect, and ultrasonic inputs while maintaining LIN communication with BCM. Use Value: LPS autonomously samples 16+ analog sensor inputs at 100 Hz without CPU intervention; RLIN2/RLIN3 dual-interface support enables simultaneous legacy and next-gen door network protocols. |
| Seat Control Unit | Roof Module |
Use Scenario: Motorized seat adjustment with position memory, heating, ventilation, and posture sensing. IC Role / Device Role / Timing Role: Safety-monitored motion controller coordinating 6+ DC motors via PWM-Diag with stall detection and thermal derating. Use Value: TAUD/TAUB/TAUJ timer array provides synchronized 100 ns-resolution PWM outputs across all motor drivers; ADCA0's 34-channel 12-bit ADC captures thermistor and current-sense data simultaneously. |
Use Scenario: Sunroof, panoramic roof, and ambient lighting control with rain/light sensors and gesture interface. IC Role / Device Role / Timing Role: Sensor aggregator and LIN master handling multi-source analog/digital inputs while driving RGB LED arrays and motorized shade actuators. Use Value: KR (Key Return) module scans 8 mechanical switches with debouncing and wake-on-event; RSENT interface supports high-speed nibble transmission to optical gesture sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016473AFP-C | 4 MB Code Flash, 256 KB Data Flash, 192 KB Local RAM, 32 KB Trace RAM; same 144-pin LQFP package and RH850G3KH2.0 core | Supports trace-based debugging and larger AUTOSAR OS partitions; required for complex ECU software stacks with >2 MB code footprint | Select when extended flash, trace capability, or higher RAM bandwidth is needed; pin-compatible but requires flash layout revalidation |
| R7F7017643AFP-C | 176-pin LQFP, 2 MB Code Flash, 128 KB Data Flash, 128 KB Local RAM, 96 KB Global RAM; adds MEMC and ETNB (Ethernet AVB not enabled) | Enables external memory expansion for logging or OTA update staging; additional I/O pins support expanded sensor sets | Choose for designs needing more GPIOs or future-proofing for Ethernet gateway functionality; PCB layout change required |
Compared with R7F7017623AFP-C#KA1, R7F7016473AFP-C offers double flash capacity and trace RAM for development-intensive projects, while R7F7017643AFP-C trades package compactness for I/O count and external memory support - both require validation of safety mechanism coverage under ISO 26262.
Availability
R7F7017623AFP-C#KA1 is available at Aetrix Electronics and suitable for body control modules, door modules, seat control units, and roof modules requiring stable component supply, long-term automotive qualification, and ISO 26262-compliant silicon.
Supply support for R7F7017623AFP-C#KA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RH850/F1KM-S2 product line targets cost-optimized, ASIL-B-capable automotive ECUs with balanced performance, safety, and peripheral integration - designed specifically for body electronics where functional safety and secure boot are mandatory but dual-core complexity is unnecessary.
FAQ
What is the maximum operating temperature range for the R7F7017623AFP-C#KA1?
The R7F7017623AFP-C#KA1 is qualified for operation from –40°C to +105°C ambient temperature, meeting AEC-Q100 Grade 2 requirements. This range supports deployment in engine bay-proximate body control modules and interior modules exposed to cabin temperature extremes. The device includes on-die thermal monitoring via Core Voltage Monitors (CVM) and Low-Voltage Indicator (LVI) to trigger safe shutdown if limits are exceeded. R7F7017623AFP-C#KA1 maintains full specification compliance across this range without derating.
Does the R7F7017623AFP-C#KA1 support CAN-FD, and how many channels are available?
Yes, the R7F7017623AFP-C#KA1 integrates 8 independent RS-CANFD channels compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps and payloads up to 64 bytes. Each channel features programmable bit timing, hardware message filtering, FIFO buffering, and error counters. These channels are fully supported in the RH850/F1KM-S2 peripheral set and validated in Renesas' R01DS0442EJ0100 datasheet Section 1B.2. R7F7017623AFP-C#KA1 does not support Classic CAN-only mode; CAN-FD is the native protocol.
Is the R7F7017623AFP-C#KA1 pin-compatible with other RH850/F1KM-S2 variants in 144-pin LQFP?
Yes, the R7F7017623AFP-C#KA1 shares identical pinout, electrical characteristics, and mechanical dimensions with all other 144-pin LQFP RH850/F1KM-S2 devices including R7F7016463AFP-C and R7F7016473AFP-C. Pin assignments for power, reset, clocks, JTAG, CAN, LIN, ADC, and GPIO are functionally consistent across the family. However, peripheral enablement (e.g., ETNB, MEMC) and flash/RAM size differ - firmware and safety configuration must be validated per part number. R7F7017623AFP-C#KA1 requires no PCB redesign when substituting within the same package variant.
What debug and trace capabilities does the R7F7017623AFP-C#KA1 provide?
The R7F7017623AFP-C#KA1 supports on-chip debug (OCD) via JTAG and boundary scan (IEEE 1149.1), enabling full visibility into CPU state, memory, and peripheral registers during development. It lacks trace RAM (not supported in 2 MB flash variants per R01DS0442EJ0100 Section 1B.4), so real-time instruction trace is unavailable. Debug features include hardware breakpoints, watchpoints, and secure debug authentication via ICUMD. For production diagnostics, R7F7017623AFP-C#KA1 provides RESETOUT signaling and FOUT clock output for external test equipment synchronization.
How does the R7F7017623AFP-C#KA1 implement functional safety per ISO 26262?
The R7F7017623AFP-C#KA1 is developed as a Safety Element out of Context (SEooC) per ISO 26262-2:2018, with documented FMEDA, safety manual, and hardware safety assessment. Key mechanisms include ECC on Code/Data Flash and all RAM types, CLMA clock monitors for PLL/MainOSC/HS IntOSC, CVM for core voltage supervision, and MPU/IPG/PEG for memory and peripheral access control. All safety features are independently verifiable and configurable via dedicated registers. R7F7017623AFP-C#KA1 achieves ASIL-B capability when integrated into a properly architected system with appropriate software safety layers.
R7F7017623AFP-C#KA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RH850/F1KM-S2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 144
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 22x10b, 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7017623AFP-C#KA1 FAQ
1.How can I place an order for R7F7017623AFP-C#KA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7017623AFP-C#KA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7017623AFP-C#KA1 reliable?
The price and inventory of R7F7017623AFP-C#KA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7017623AFP-C#KA1 is usually 5 days.
3.What payment methods are accepted for R7F7017623AFP-C#KA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7017623AFP-C#KA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7017623AFP-C#KA1?
R7F7017623AFP-C#KA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7017623AFP-C#KA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7017623AFP-C#KA1?
For technical support, including R7F7017623AFP-C#KA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7017623AFP-C#KA1 requirements.
6.How does Aetrix verify that R7F7017623AFP-C#KA1 is sourced from the original manufacturer or authorized distributors?
All R7F7017623AFP-C#KA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7017623AFP-C#KA1 meets industry standards.
7.What is the process for return or replacement of R7F7017623AFP-C#KA1?
All R7F7017623AFP-C#KA1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7017623AFP-C#KA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7017623AFP-C#KA1 part is unused and in its original packaging.
Return procedure for R7F7017623AFP-C#KA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7017623AFP-C#KA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

