Renesas R7FA2E1A93CDA#HC0

Overview

R7FA2E1A93CDA#HC0 from Renesas is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 128-KB code flash, 16-KB SRAM, a 12-bit ADC, capacitive touch sensing (CTSU2), and integrated security (AES128/256, TRNG). It targets battery-powered HMI, sensor nodes, and industrial control where low power, secure firmware execution, and analog integration are critical.

For engineers reviewing the R7FA2E1A93CDA#HC0 datasheet, R7FA2E1A93CDA#HC0 pinout, R7FA2E1A93CDA#HC0 application, or R7FA2E1A93CDA#HC0 equivalent, key selection criteria include its 25-pin WLCSP package, -40°C to +85°C industrial temperature grade, 1.6–5.5 V operation, CTSU2 support for up to 10 touch channels, and dual watchdog timers (WDT/IWDT) with independent clock sources.

Technical Context

The R7FA2E1A93CDA#HC0 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting eight regions, enabling secure partitioning of firmware and data. Its system-level timing relies on multiple clock sources including HOCO (48 MHz), SOSC (32.768 kHz), and IWDT-dedicated 15 kHz oscillator.

Analog subsystem integration includes ADC12 with 8 selectable input channels, two low-power analog comparators (ACMPLP), and a die temperature sensor (TSN) routed to ADC input. The CTSU2 unit supports mutual- and self-capacitance sensing with up to 10 electrodes, optimized for low-noise, low-power touch applications.

Key Specifications

Pinout & Package

Package: 25-pin Wafer-Level Chip Scale Package (WLCSP), 2.14 mm × 2.27 mm, 0.4 mm pitch, exposed die pad recommended to connect to VSS.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA2E1A92DDA#HC0, the R7FA2E1A93CDA#HC0 offers identical packaging and feature set but is designated for industrial temperature operation; versus R7FA2E1A73CDA#HC0, it provides 64 KB more flash and one additional CTSU2 channel-critical for complex touch UIs or field-upgradable firmware.

Availability

R7FA2E1A93CDA#HC0 is available at Aetrix Electronics and suitable for smart wearable controls, industrial sensor nodes, and home appliance touch panels requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for R7FA2E1A93CDA#HC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RA2E1 Group, including R7FA2E1A93CDA#HC0, is designed for ultra-low-power, cost-sensitive embedded applications demanding security, analog integration, and compact packaging-especially in battery-operated HMI and sensor edge devices.

FAQ

What is the maximum operating frequency of the R7FA2E1A93CDA#HC0?

The R7FA2E1A93CDA#HC0 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable with the high-speed on-chip oscillator (HOCO) or external crystal, and is sustained across its full industrial temperature range (-40°C to +85°C) and 1.6–5.5 V supply voltage. The R7FA2E1A93CDA#HC0 maintains timing compliance under all specified conditions without derating.

Does the R7FA2E1A93CDA#HC0 support hardware encryption?

Yes, the R7FA2E1A93CDA#HC0 integrates a dedicated hardware AES engine supporting both AES128 and AES256 block ciphers, plus a True Random Number Generator (TRNG). These modules operate independently of the CPU, enabling secure boot, encrypted firmware updates, and authenticated communication without performance penalty. The R7FA2E1A93CDA#HC0 uses these features to meet basic IoT security requirements out of the box.

How many capacitive touch channels does the R7FA2E1A93CDA#HC0 support?

The R7FA2E1A93CDA#HC0 supports up to 10 capacitive touch sensing channels via its CTSU2 peripheral. This is confirmed in Table 1.13 of the datasheet for the DA (WLCSP 25-pin) package variant. The R7FA2E1A93CDA#HC0 allocates TS00, TS02-CFC, TS04–TS07, TS08-CFC–TS16-CFC, TS17, TS18, TS21–TS25, and TS26-CFC–TS28-CFC for touch input, enabling multi-button or slider interfaces in minimal board area.

What is the pin count and package type of the R7FA2E1A93CDA#HC0?

The R7FA2E1A93CDA#HC0 uses a 25-pin Wafer-Level Chip Scale Package (WLCSP) with dimensions 2.14 mm × 2.27 mm and 0.4 mm pitch. Its package code "DA" is defined in Figure 1.2 of the datasheet, and the mechanical drawing SUBG0025LB-A confirms the land pattern and solder mask layout. The R7FA2E1A93CDA#HC0 exposes a die pad recommended to connect to VSS for thermal and electrical performance.

Does the R7FA2E1A93CDA#HC0 include a temperature sensor?

Yes, the R7FA2E1A93CDA#HC0 integrates an on-die Temperature Sensor (TSN) whose output voltage is linearly proportional to junction temperature. This analog output is internally routed to the ADC12 module, allowing software to digitize and compensate for thermal drift in precision measurements. The R7FA2E1A93CDA#HC0 datasheet specifies TSN accuracy as ±3°C over the full -40°C to +85°C range, validated per production test.