Renesas R7FA2E2A32DBY#HC1

Overview

R7FA2E2A32DBY#HC1 from Renesas Electronics is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 16 KB code flash, 8 KB SRAM, 12-bit ADC with 4 input channels, 12-bit DAC, integrated temperature sensor, and hardware AES-128/256 encryption. It targets battery-powered industrial sensors and smart metering endpoints requiring secure, low-power operation across -40°C to +85°C.

For engineers reviewing the R7FA2E2A32DBY#HC1 datasheet, R7FA2E2A32DBY#HC1 pinout, R7FA2E2A32DBY#HC1 application, or R7FA2E2A32DBY#HC1 equivalent, key selection criteria include its WLCSP-16 package footprint, 11 GPIOs (including 2 × 5-V-tolerant), I3C/SPI/SCI interfaces, dual AGTW timers for wake-up timing, and ECC-protected SRAM for functional safety compliance in Class B designs.

Technical Context

The R7FA2E2A32DBY#HC1 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting 8 regions, enabling secure partitioning of firmware and data. Its clock system integrates HOCO/MOCO/LOCO oscillators with trim capability and includes a dedicated IWDT oscillator (15 kHz) for fail-safe reset independent of main clock integrity.

System-level features include Event Link Controller (ELC) for CPU-free peripheral triggering, Data Transfer Controller (DTC) for autonomous memory transfers, and Cyclic Redundancy Check (CRC) calculator with snoop function for serial buffer monitoring-enabling deterministic real-time response in resource-constrained edge nodes.

Key Specifications

Pinout & Package

Package: 16-pin WLCSP (1.84 mm × 1.87 mm, 0.4 mm pitch), exposed die pad recommended to be connected to VSS or left floating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA2E2A32DBY#HC1, the R7FA2E1A32DBJ#HC0 sacrifices I3C/CAN and reduces flash but retains WLCSP compatibility, while R7FA2E2A52DNJ#HC0 expands memory and I/O in a larger HWQFN package-making it ideal for design evolution rather than drop-in replacement.

Availability

R7FA2E2A32DBY#HC1 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart utility meters, and medical wearables requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for R7FA2E2A32DBY#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RA2E2 group is designed specifically for cost-sensitive, ultra-low-power applications demanding security and functional safety-targeting battery-operated sensors, smart meters, and portable medical devices.

FAQ

What is the maximum operating frequency of the R7FA2E2A32DBY#HC1?

The R7FA2E2A32DBY#HC1 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable with the high-speed on-chip oscillator (HOCO) configured at 48 MHz, and the device maintains timing integrity across its full operating voltage range (1.6–5.5 V) and temperature range (-40°C to +85°C). The R7FA2E2A32DBY#HC1 supports dynamic clock scaling to reduce power during low-activity periods without compromising real-time responsiveness.

Does the R7FA2E2A32DBY#HC1 support hardware encryption?

Yes, the R7FA2E2A32DBY#HC1 integrates a dedicated hardware AES-128 and AES-256 encryption engine alongside a True Random Number Generator (TRNG). These modules operate independently of the CPU, enabling secure key generation, encrypted firmware updates, and authenticated communication without degrading application performance. The R7FA2E2A32DBY#HC1 uses these features to meet FIPS 140-2 Level 1 and IEC 62443-3-3 cybersecurity requirements for endpoint devices.

What analog peripherals are included in the R7FA2E2A32DBY#HC1?

The R7FA2E2A32DBY#HC1 includes a 12-bit successive approximation ADC with 4 selectable input channels (AN019–AN022), a 12-bit DAC, an on-die temperature sensor (TSN), and two low-power analog comparators (ACMPLP0/1). The ADC supports internal reference voltage and temperature sensor inputs, and the DAC provides buffered output for precision actuator control. All analog functions share the same VREFH0/VREFL0 reference rails, ensuring consistent accuracy across mixed-signal operations in the R7FA2E2A32DBY#HC1.

Which communication interfaces does the R7FA2E2A32DBY#HC1 support?

The R7FA2E2A32DBY#HC1 supports Serial Communications Interface (SCI) with UART, IIC, SPI, and Smart Card modes; one dedicated SPI channel; one I3C bus interface compliant with MIPI I3C v1.1; and a CAN 2.0B module. These interfaces operate concurrently and can be routed to multiple pin sets via the Event Link Controller (ELC), allowing flexible signal routing without hardware multiplexing conflicts in the R7FA2E2A32DBY#HC1.

What is the package type and pin count of the R7FA2E2A32DBY#HC1?

The R7FA2E2A32DBY#HC1 uses a 16-pin Wafer-Level Chip Scale Package (WLCSP) measuring 1.84 mm × 1.87 mm with 0.4 mm pitch. This ultra-compact package contains 11 general-purpose I/O pins (including 2 × 5-V-tolerant), 2 analog inputs, SWD debug pins, power/ground, reset, and mode configuration pins. The exposed die pad is recommended to be connected to VSS for thermal and electrical stability in the R7FA2E2A32DBY#HC1.