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Renesas R7FA2E2A33CBY#HC1

Part No.:
R7FA2E2A33CBY#HC1
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
16-UFBGA, WLCSP
Datasheet:
AetrixR7FA2E2A33CBY#HC1.pdf
Description:
IC MCU 32BIT 16KB FLASH 16WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

R7FA2E2A33CBY#HC1 from Renesas Electronics is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 16-KB code flash, 8-KB SRAM, 12-bit ADC and DAC, integrated CAN interface, and hardware security including AES-128/256 and TRNG. It targets battery-powered industrial sensors and smart metering endpoints requiring functional safety support and extended temperature operation.

For engineers reviewing the R7FA2E2A33CBY#HC1 datasheet, R7FA2E2A33CBY#HC1 pinout, R7FA2E2A33CBY#HC1 application, or R7FA2E2A33CBY#HC1 equivalent, key selection criteria include its WLCSP-16 package, -40°C to +105°C operating range, 16-KB flash memory size, I3C/SPI/SCI connectivity, and integrated safety features such as ECC in SRAM, CAC, and IWDT.

Technical Context

The R7FA2E2A33CBY#HC1 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting eight regions, enabling secure partitioning of firmware and data. Its clock system integrates HOCO/MOCO/LOCO oscillators with trim capability and a dedicated 15-kHz IWDT oscillator for fail-safe timing independence.

Analog subsystem includes a 12-bit ADC with up to four input channels, on-die temperature sensor, and low-power analog comparators with selectable speed modes. The Event Link Controller (ELC) enables autonomous peripheral-to-peripheral triggering without CPU intervention, reducing active power consumption in sensor polling and motor control tasks.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M23, 48 MHz max - delivers deterministic real-time response with TrustZone-enabled security isolation
Memory 16-KB code flash / 2-KB data flash / 8-KB SRAM with ECC - supports field firmware updates and robust data logging
Analog 12-bit ADC (4-channel), 12-bit DAC, TSN - enables precision sensor signal acquisition and closed-loop analog output control
Connectivity CAN 2.0B, I3C, SPI, SCI (UART/IIC/SPI modes) - provides interoperability with automotive, industrial, and IoT bus ecosystems
Safety & Security ECC in SRAM, CAC, IWDT, register write protection, DOC, CRC - meets IEC 61508 SIL2 and ISO 26262 ASIL-B readiness requirements
Power & Temp 1.6–5.5 V supply, -40°C to +105°C, WLCSP-16 (1.84 × 1.87 mm) - suitable for space-constrained, wide-temperature embedded nodes

Pinout & Package

Package: 16-pin WLCSP (SUBG0016LB-A), 1.84 mm × 1.87 mm, 0.4 mm pitch, exposed die pad recommended to be connected to VSS.

Pin/Terminal Circuit Role Design Meaning
P400 CACREF / AGTIO1 Measurement reference clock input for Clock Accuracy Check; external event input for AGTW timer
P401 VCL Internal LDO stabilization capacitor connection point - requires 4.7 µF ceramic capacitor to VSS
VSS Ground Digital ground reference; must be decoupled with 0.1 µF capacitor near pin
VCC Power Supply Main supply (1.6–5.5 V); powers digital core and peripherals - requires local 0.1 µF decoupling
RES Reset Input Active-low asynchronous reset - initiates full system initialization and register reset
P201/MD Mode Control Selects single-chip or SCI boot mode during reset assertion - determines startup vector source
P300/SWCLK Debug Clock SWD debug interface clock input - enables non-intrusive programming and real-time trace
P108/SWDIO Debug Data I/O Serial Wire Debug bidirectional data line - supports flash programming and live register inspection

Key Features

Feature Design Value
Low-Power Asynchronous Timers (AGTW × 2) Independent 32-bit timers running from LOCO (32.768 kHz) enable wake-up from deep sleep without CPU involvement
Event Link Controller (ELC) Hardware routing matrix connects 32+ peripheral events directly - eliminates software overhead in sensor-triggered actions
Data Transfer Controller (DTC) Autonomous DMA engine transfers data between memory and peripherals on interrupt - reduces CPU load and power
Capacitive Touch Sensing Unit (CTSU2) On-chip charge-transfer engine supports up to 32 touch electrodes - enables button/slider interfaces without external ICs
Security Accelerators (AES/TRNG) Hardware AES-128/256 encryption and true random number generation - accelerate secure boot and TLS handshake

Applications

Industrial Sensor Node Smart Utility Meter

Use Scenario: Battery-powered temperature/humidity/pressure sensor node deployed in HVAC ducts or remote substations.

IC Role / Device Role / Timing Role: Main controller executing sensor readout, data preprocessing, CAN/I3C communication, and low-power state management.

Use Value: 16-KB flash stores sensor fusion algorithms; 12-bit ADC achieves ±1 LSB INL for calibrated analog inputs; -40°C to +105°C rating ensures reliability across environmental extremes.

Use Scenario: Electricity/water/gas meter with tamper detection, pulse counting, and secure data upload via PLC or RF.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC, real-time clock, secure firmware updates, and communication stack.

Use Value: Integrated CAC validates clock integrity for time-stamped billing; ECC SRAM prevents corruption of accumulated kWh values; AES accelerates encrypted data transmission.

Motor Control Edge Node IoT Gateway Subsystem

Use Scenario: Compact BLDC fan or pump controller with Hall-effect feedback and PWM-driven gate drivers.

IC Role / Device Role / Timing Role: Real-time motor commutation engine using GPT16 timers and POEG for safe PWM output disable.

Use Value: Six GPT16 timers generate synchronized 3-phase PWM waveforms; AGTW timers measure rotor position intervals; 5-V-tolerant pins interface directly with Hall sensors.

Use Scenario: Edge concentrator aggregating data from multiple BLE/Zigbee sub-devices before forwarding via Ethernet or cellular.

IC Role / Device Role / Timing Role: Protocol bridge and local decision engine handling I3C sensor aggregation, SPI flash storage, and CAN backbone interfacing.

Use Value: I3C interface supports multi-drop high-speed sensor reads; DTC offloads SPI flash writes; 16-KB flash hosts lightweight MQTT/CoAP stacks and OTA update logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA2E1A33CBY#HC1 RA2E1 series, same WLCSP-16 package and -40°C to +105°C rating, but Cortex-M23 @ 24 MHz, 16-KB flash, no CAN or I3C Lacks CAN and I3C interfaces; lower clock frequency limits real-time throughput in motor control or high-rate sensor fusion Select when CAN/I3C are unnecessary and cost sensitivity outweighs performance headroom
R7FA2E2A53CBY#HC1 Same RA2E2 family, identical package and temperature grade, but 32-KB flash, 2-KB data flash, and full 8-channel ADC Higher memory capacity supports larger protocol stacks; additional ADC channels enable multi-sensor simultaneous sampling Select when firmware complexity exceeds 16-KB or analog channel count >4 is required

Compared with R7FA2E2A33CBY#HC1, the R7FA2E1A33CBY#HC1 offers reduced cost and power at the expense of real-time capability and bus compatibility, while the R7FA2E2A53CBY#HC1 extends memory and analog resources without altering footprint or thermal envelope.

Availability

R7FA2E2A33CBY#HC1 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart utility meters, and motor control edge devices requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R7FA2E2A33CBY#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets with emphasis on energy efficiency and functional safety.

The RA2E2 group is designed for ultra-low-power, cost-sensitive embedded applications demanding Arm TrustZone security, integrated analog peripherals, and extended temperature operation - targeting industrial sensing, metering, and control.

FAQ

What is the maximum operating frequency of the R7FA2E2A33CBY#HC1?

The R7FA2E2A33CBY#HC1 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable with the high-speed on-chip oscillator (HOCO) configured at 48 MHz, and the device maintains full functionality-including ADC sampling, CAN transmission, and cryptographic operations-at this rate within its specified voltage (1.6–5.5 V) and temperature (-40°C to +105°C) ranges.

Does the R7FA2E2A33CBY#HC1 support CAN communication?

Yes, the R7FA2E2A33CBY#HC1 integrates a full CAN 2.0B module compliant with ISO 11898-1. It supports bit rates up to 1 Mbps, message filtering, FIFO buffering, and loopback self-test mode. The CAN peripheral shares pins with other functions and requires external transceiver circuitry; no additional MCU-side protocol stack is needed for basic frame transmission and reception.

What package type and dimensions does the R7FA2E2A33CBY#HC1 use?

The R7FA2E2A33CBY#HC1 uses a 16-pin WLCSP (Wafer-Level Chip Scale Package) with part code BY, designated SUBG0016LB-A. Its physical dimensions are 1.84 mm × 1.87 mm with 0.4 mm pitch. The package includes an exposed die pad recommended to be connected to VSS for thermal and electrical stability, and supports reflow soldering per JEDEC J-STD-020 standards.

How much flash and SRAM memory does the R7FA2E2A33CBY#HC1 have?

The R7FA2E2A33CBY#HC1 contains 16 KB of on-chip code flash memory, 2 KB of data flash memory (rated for 100,000 program/erase cycles), and 8 KB of SRAM with built-in ECC error correction. The code flash supports block erase and page programming; the data flash is optimized for frequent parameter storage; and the ECC-protected SRAM ensures runtime data integrity in safety-critical applications.

What safety and security features are integrated into the R7FA2E2A33CBY#HC1?

The R7FA2E2A33CBY#HC1 includes ECC in SRAM, Clock Frequency Accuracy Measurement Circuit (CAC), Independent Watchdog Timer (IWDT), register write protection, Data Operation Circuit (DOC), Cyclic Redundancy Check (CRC) calculator, and hardware AES-128/256 with True Random Number Generator (TRNG). These features collectively support functional safety certification paths (IEC 61508 SIL2) and secure boot/data handling requirements.

R7FA2E2A33CBY#HC1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
16-UFBGA, WLCSP
Series:
RA2E2
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, I3C, SCI, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
11
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 4x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA2E2A33CBY#HC1 FAQ

1.How can I place an order for R7FA2E2A33CBY#HC1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7FA2E2A33CBY#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7FA2E2A33CBY#HC1 reliable?

The price and inventory of R7FA2E2A33CBY#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA2E2A33CBY#HC1 is usually 5 days.

3.What payment methods are accepted for R7FA2E2A33CBY#HC1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA2E2A33CBY#HC1 transactions.

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4.How is shipping managed for R7FA2E2A33CBY#HC1?

R7FA2E2A33CBY#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA2E2A33CBY#HC1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA2E2A33CBY#HC1?

For technical support, including R7FA2E2A33CBY#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA2E2A33CBY#HC1 requirements.

6.How does Aetrix verify that R7FA2E2A33CBY#HC1 is sourced from the original manufacturer or authorized distributors?

All R7FA2E2A33CBY#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA2E2A33CBY#HC1 meets industry standards.

7.What is the process for return or replacement of R7FA2E2A33CBY#HC1?

All R7FA2E2A33CBY#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA2E2A33CBY#HC1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA2E2A33CBY#HC1 part is unused and in its original packaging.

Return procedure for R7FA2E2A33CBY#HC1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R7FA2E2A33CBY#HC1 Tags

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