Renesas R7FA2E2A52DBY#HC1
- Part No.:
- R7FA2E2A52DBY#HC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 16-UFBGA, WLCSP
- Datasheet:
-
R7FA2E2A52DBY#HC1.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 16WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,000
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Product details
Overview
R7FA2E2A52DBY#HC1 from Renesas Electronics is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 32-KB code flash, 8-KB SRAM, 12-bit ADC and DAC, integrated CAN interface, and hardware security (AES128/256, TRNG), designed for industrial sensor nodes and battery-powered edge devices.
For engineers reviewing the R7FA2E2A52DBY#HC1 datasheet, R7FA2E2A52DBY#HC1 pinout, R7FA2E2A52DBY#HC1 application, or R7FA2E2A52DBY#HC1 equivalent, key selection criteria include its WLCSP-16 package, -40°C to +85°C temperature grade, 1.6–5.5 V wide supply range, dual low-power timers (AGTW), and I3C/SPI/SCI connectivity for compact embedded control.
Technical Context
The R7FA2E2A52DBY#HC1 implements the Armv8-M architecture with Memory Protection Unit (MPU) and CoreSight™ debug support, enabling secure, scalable firmware execution in resource-constrained environments. Its clock system integrates HOCO/MOCO/LOCO oscillators with trim capability and a dedicated IWDT oscillator for fail-safe timing.
System-level features include Event Link Controller (ELC) for CPU-free peripheral coordination, Data Transfer Controller (DTC) for autonomous data movement, and safety mechanisms such as SRAM ECC, flash area protection, ADC self-diagnosis, and CAC for clock accuracy validation-targeting functional safety-aware designs without external supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M23 @ 48 MHz max; supports Armv8-M TrustZone-ready execution with MPU and single-cycle multiplier. |
| Memory | 32-KB code flash (100k P/E cycles), 2-KB data flash, 8-KB SRAM with ECC/parity; enables firmware updates and robust data logging. |
| Analog Peripherals | 12-bit ADC12 (8-channel), 12-bit DAC12, on-die temperature sensor (TSN); supports precision sensing and analog actuation. |
| Connectivity | SCI × 1 (UART/IIC/SPI/Smart Card), SPI × 1, I3C × 1, CAN module; provides flexible serial communication for sensor fusion and bus integration. |
| Timers & Control | GPT16 × 6 (12 PWM outputs), AGTW × 2, WDT/IWDT, RTC; delivers motor control, pulse generation, and time-critical event handling. |
| Power & Safety | 1.6–5.5 V operation, low-power modes, LVD (3 thresholds), CAC, CRC calculator, DOC; ensures reliability across voltage fluctuations and aging conditions. |
| Security | AES128/256 acceleration, True Random Number Generator (TRNG); enables secure boot, encrypted communication, and key derivation. |
Pinout & Package
Package: 16-pin WLCSP (1.84 mm × 1.87 mm, 0.4 mm pitch), exposed die pad recommended for VSS connection; rated for -40°C to +85°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P400 | CACREF / AGTIO1 | Measurement reference clock input or AGTW event input; critical for clock calibration and low-power timing. |
| P401 | VCL | Internal LDO stabilization pin; requires 4.7 µF capacitor to VSS for stable analog/low-power domain regulation. |
| VSS | Analog/Digital Ground | Common return path for digital logic, ADC, and internal regulators; must be low-impedance and decoupled. |
| VCC | Main Power Supply | 1.6–5.5 V input powering core, peripherals, and I/O; requires local 0.1 µF ceramic decoupling. |
| RES | Active-Low Reset Input | Asynchronous reset assertion; synchronously released by internal POR/LVD circuits for deterministic startup. |
| P201/MD | Mode Control | Selects single-chip or SCI boot mode at power-up; must remain static during reset release. |
| P300/SWCLK | SWD Clock | Serial Wire Debug clock input; enables non-intrusive programming and real-time trace via standard ARM debug interface. |
| P108/SWDIO | SWD Data I/O | Bidirectional debug data line; shares pin with GPIO but disabled during debug session. |
| P109 | CLKOUT | Programmable clock output (HOCO/MOCO/LOCO/IRC); used for external timing verification or peripheral synchronization. |
| P110 | SCI9 CTS/RTS or SS9 | Hardware flow control or SPI chip select; configurable per peripheral mode to reduce host intervention. |
| P103 | AGTOA0 | AGTW channel 0 output compare A; generates precise pulses or triggers events without CPU overhead. |
| P102 | AGTO0 / AN020 / ADTRG0 | Multi-function pin: AGTW pulse output, ADC input channel 20, or external ADC start trigger-enables tight analog-timing coupling. |
| P101 | AGTEE0 / GTETRGB | AGTW event enable or GPT external trigger B; allows asynchronous wake-up or synchronized timer capture. |
| P100 | AGTIO0 / GTETRGA | AGTW event input or GPT external trigger A; supports edge-triggered wake-up from deep sleep or signal capture. |
| P015 | IRQ7 / AN019 | Interrupt request input or ADC channel 19; enables interrupt-driven sampling or fast response to external events. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-Low-Power Operation | Multiple low-power modes with sub-μA retention current; AGTW runs independently on LOCO (32.768 kHz) for always-on timing. |
| Integrated CAN Interface | Dedicated CAN module compliant with ISO 11898-1; supports 1 Mbps operation and message filtering for industrial fieldbus integration. |
| Hardware Security Engine | AES128/256 encryption/decryption and TRNG accelerate secure boot, OTA updates, and TLS stack offload. |
| Robust Analog Subsystem | 12-bit ADC with internal reference, temperature sensor, and self-diagnostic function-validates ADC integrity before critical measurements. |
| Event-Driven Architecture | ELC links peripheral events (e.g., ADC end-of-conversion → DTC transfer → GPT update) without CPU involvement, reducing latency and power. |
Applications
| Industrial Sensor Node | Smart Metering Endpoint |
|---|---|
Use Scenario: Battery-powered temperature/humidity/pressure sensor node with wireless backhaul in factory automation. IC Role / Device Role / Timing Role: Main controller executing sensor acquisition, local preprocessing, CAN bus reporting, and low-power scheduling via AGTW. Use Value: 32-KB flash stores firmware + calibration tables; 1.6–5.5 V operation accommodates aging batteries; WLCSP-16 enables PCB space savings in compact enclosures. | Use Scenario: Electricity/water/gas meter with tamper detection, pulse counting, and secure data logging. IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC, real-time billing counters, AES-encrypted storage, and optical/IR communication interface. Use Value: Integrated CRC/DOC validates meter register integrity; CAC confirms clock accuracy for time-stamped billing; ECC SRAM prevents data corruption over 15+ year lifetime. |
| Medical Wearable Monitor | Home Appliance Control |
Use Scenario: Portable ECG/PPG patch with motion compensation, Bluetooth LE interface, and rechargeable battery management. IC Role / Device Role / Timing Role: Signal processor acquiring analog biosignals via ADC12, applying digital filters using DTC-assisted transfers, and triggering BLE events via ELC. Use Value: Low-voltage operation (1.6 V) extends runtime; TRNG seeds secure pairing keys; TSN monitors die temperature to prevent thermal drift in analog front-end. | Use Scenario: Smart HVAC controller with touch interface, fan speed regulation, and environmental sensing. IC Role / Device Role / Timing Role: Central MCU driving capacitive touch (CTSU2), generating 3-phase BLDC motor PWM via GPT, and reading thermistors via ADC12. Use Value: CTSU2 enables seamless glass-front UI; GPT16 channels deliver precise 3-phase commutation; 5-V-tolerant pins simplify interfacing with legacy appliance sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA2E2A52DNJ | 20-pin HWQFN package; same memory, peripherals, and specs; adds 4 extra GPIOs and one more ADC channel (AN005–AN010). | Suitable where board layout permits larger footprint and additional analog/digital I/O is required for expanded sensor sets. | Select when needing >11 GPIOs or >4 ADC inputs; not pin-compatible due to different package and pin count. |
| R7FA2E2A53CBY | Same WLCSP-16 package; higher temp grade (-40°C to +105°C); identical memory, peripherals, and electrical specs. | Required for extended ambient temperature environments such as enclosed outdoor equipment or under-hood automotive accessories. | Choose for thermal ruggedness without changing PCB layout; direct drop-in replacement if temperature margin is insufficient. |
Compared with R7FA2E2A52DBY#HC1, R7FA2E2A52DNJ offers more I/O in a larger package while R7FA2E2A53CBY maintains identical form factor with extended temperature rating-enabling design reuse across industrial tiers without firmware changes.
Availability
R7FA2E2A52DBY#HC1 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart metering endpoints, medical wearables, and home appliance control requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for R7FA2E2A52DBY#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.
The RA2E2 Group targets cost-sensitive, ultra-low-power embedded applications with Arm Cortex-M23 cores, integrated security, and rich analog/peripheral sets-designed to accelerate development of certified, production-ready edge devices.
FAQ
What is the maximum operating frequency of the R7FA2E2A52DBY#HC1?
The R7FA2E2A52DBY#HC1 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable with the high-speed on-chip oscillator (HOCO) or external crystal sources, and is maintained across its full 1.6–5.5 V supply range and -40°C to +85°C temperature grade. The R7FA2E2A52DBY#HC1 includes clock accuracy measurement (CAC) to validate timing integrity in real time.
Does the R7FA2E2A52DBY#HC1 support CAN communication?
Yes, the R7FA2E2A52DBY#HC1 integrates a dedicated CAN module compliant with ISO 11898-1, supporting bit rates up to 1 Mbps. It includes message filtering, FIFO buffering, and error handling features. The R7FA2E2A52DBY#HC1 does not require external transceivers for physical layer interfacing-only a standard CAN transceiver IC (e.g., TJA1042) is needed for bus connection.
What package type and pin count does the R7FA2E2A52DBY#HC1 use?
The R7FA2E2A52DBY#HC1 uses a 16-pin Wafer-Level Chip-Scale Package (WLCSP) measuring 1.84 mm × 1.87 mm with 0.4 mm pitch. Its part number suffix "BY" explicitly denotes this WLCSP variant, and "D" indicates consumer-grade qualification with -40°C to +85°C operating temperature. The R7FA2E2A52DBY#HC1 exposes 11 GPIOs, including 2 with 5-V tolerance (P400, P401).
How much flash and RAM memory does the R7FA2E2A52DBY#HC1 include?
The R7FA2E2A52DBY#HC1 includes 32 KB of code flash memory (with 100,000 program/erase cycles), 2 KB of data flash memory, and 8 KB of on-chip SRAM with optional ECC or parity protection. These memory resources are sufficient for RTOS-based firmware, sensor fusion algorithms, and secure cryptographic operations-all while maintaining ultra-low active and standby power consumption.
Is the R7FA2E2A52DBY#HC1 suitable for applications requiring functional safety certification?
The R7FA2E2A52DBY#HC1 includes multiple hardware safety features-SRAM ECC, flash area protection, ADC self-diagnosis, CAC, CRC calculator, and independent watchdog (IWDT)-that support IEC 61508 SIL2 and ISO 13849 PLd development. While the R7FA2E2A52DBY#HC1 itself is not pre-certified, its integrated mechanisms reduce effort for end-equipment certification when implemented per Renesas functional safety manuals.
R7FA2E2A52DBY#HC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 16-UFBGA, WLCSP
- Series:
- RA2E2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M23
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, I3C, SCI, SmartCard, SPI, UART/USART
- Peripherals:
- AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
- Number of I/O:
- 11
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 4x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA2E2A52DBY#HC1 FAQ
1.How can I place an order for R7FA2E2A52DBY#HC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA2E2A52DBY#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA2E2A52DBY#HC1 reliable?
The price and inventory of R7FA2E2A52DBY#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA2E2A52DBY#HC1 is usually 5 days.
3.What payment methods are accepted for R7FA2E2A52DBY#HC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA2E2A52DBY#HC1 transactions.
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4.How is shipping managed for R7FA2E2A52DBY#HC1?
R7FA2E2A52DBY#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA2E2A52DBY#HC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA2E2A52DBY#HC1?
For technical support, including R7FA2E2A52DBY#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA2E2A52DBY#HC1 requirements.
6.How does Aetrix verify that R7FA2E2A52DBY#HC1 is sourced from the original manufacturer or authorized distributors?
All R7FA2E2A52DBY#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA2E2A52DBY#HC1 meets industry standards.
7.What is the process for return or replacement of R7FA2E2A52DBY#HC1?
All R7FA2E2A52DBY#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA2E2A52DBY#HC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA2E2A52DBY#HC1 part is unused and in its original packaging.
Return procedure for R7FA2E2A52DBY#HC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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