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Renesas R7FA2E2A52DNK#HA0

Part No.:
R7FA2E2A52DNK#HA0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
24-WFQFN Exposed Pad
Datasheet:
AetrixR7FA2E2A52DNK#HA0.pdf
Description:
IC MCU 32BIT 32KB FLASH 24HWQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,969

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Product details

Overview

R7FA2E2A52DNK#HA0 from Renesas is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 32-KB code flash, 8-KB SRAM, 12-bit ADC and DAC, integrated CAN interface, and hardware AES/256 + TRNG for secure edge sensing. It targets battery-powered industrial sensors and smart metering nodes requiring functional safety support and extended temperature operation.

For engineers reviewing the R7FA2E2A52DNK#HA0 datasheet, R7FA2E2A52DNK#HA0 pinout, R7FA2E2A52DNK#HA0 application, or R7FA2E2A52DNK#HA0 equivalent, key selection criteria include its 24-pin HWQFN package with 19 GPIOs (2 × 5-V tolerant), dual low-power timers (AGTW), event-link controller (ELC), and -40°C to +85°C industrial temperature grade.

Technical Context

The R7FA2E2A52DNK#HA0 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting 8 regions, enabling secure partitioning of firmware and data. Its clock system integrates HOCO/MOCO/LOCO oscillators with trim capability and includes dedicated IWDT and CAC for clock accuracy monitoring.

Analog subsystem integration includes ADC12 with 7 selectable input channels, on-die temperature sensor (TSN), and low-power analog comparators (ACMPLP). Communication peripherals comprise SCI (UART/IIC/SPI/Smart Card), I3C, SPI, and CAN - all accessible via shared pins under ELC-driven event routing to minimize CPU overhead.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M23 @ 48 MHz max; supports Armv8-M security extensions and MPU for memory isolation.
Memory32-KB code flash (100k erase cycles), 2-KB data flash, 8-KB SRAM with ECC/parity for ASIL-B compliance.
Analog Peripherals12-bit ADC12 (7-channel), 12-bit DAC12, TSN, and two low-power analog comparators (ACMPLP).
TimersGPT16 × 6 (11 PWM outputs), AGTW × 2, WDT/IWDT, RTC with calendar mode and binary count.
CommunicationSCI × 1 (UART/IIC/SPI/Smart Card), I3C × 1, SPI × 1, CAN × 1 - all pin-multiplexed with ELC support.
Package & Temp24-pin HWQFN (4 mm × 4 mm, 0.5 mm pitch); rated for -40°C to +85°C industrial operation.
Power SupplyVCC = 1.6 V to 5.5 V; includes LVD (3 thresholds), POR, and multiple low-power modes (SNOOZE, DEEP-SNOOZE).
SecurityAES128/256 accelerator, TRNG, CRC calculator, DOC, register write protection, illegal access detection.

Pinout & Package

Package: 24-pin HWQFN (4 mm × 4 mm, 0.5 mm pitch), exposed die pad recommended connected to VSS.

Pin/TerminalCircuit RoleDesign Meaning
P400CACREF / AGTIO1Measurement reference clock input for CAC; external event input for AGTW timer 1.
P401VCLInternal LDO stabilization pin; requires 4.7 µF capacitor to VSS for stable analog supply.
P205AGTOA1Output compare match A output for AGTW timer 1; used for precise pulse generation in sensor wake-up.
P201/MDMode ControlBoot mode selection during reset; determines single-chip vs. SCI boot configuration.
P108/SWDIODebug InterfaceSerial Wire Debug data I/O; enables non-intrusive firmware debugging and programming.
P300/SWCLKDebug ClockSerial Wire Debug clock input; synchronizes debug communication with host debugger.
P010/VREFH0Analog ReferenceHigh-side ADC reference voltage input; must be tied to VCC0 when ADC not used.
P011/VREFL0Analog GroundLow-side ADC reference ground; requires 0.1 µF decoupling to VSS for noise immunity.
P109GTIOC7A / SCK9GPT channel A input capture/output compare; also serves as SCI9 clock in synchronous mode.
P110GTIOC7B / CTS9_RTS9GPT channel B input capture/output compare; also controls flow in SCI9 asynchronous mode.
P111GTIOC6A / RXD9GPT channel A for timing-critical signal capture; doubles as SCI9 receive data input.
P112GTIOC6B / TXD9GPT channel B for synchronized waveform generation; also transmits SCI9 serial data.
P103AGTOB0 / GTOWUPOutput compare match B for AGTW timer 0; also drives positive phase U of 3-phase BLDC motor control.
P102AGTO0 / GTOWLOAGTW timer 0 pulse output; also provides negative phase U output for BLDC motor drive.
P101AGTEE0 / GTETRGBExternal event enable for AGTW timer 0; also accepts RGB trigger for GPT timer group B.
P100AGTIO0 / GTETRGAExternal event input for AGTW timer 0; also triggers GPT timer group A for synchronized timing.
P015AN019Analog input channel 19 for ADC12; supports internal TSN and VREFH0 sampling.
P014AN009Analog input channel 9; configurable for differential or single-ended acquisition with programmable gain.
P011VREFL0Analog ground reference for ADC/DAC; must be decoupled with 0.1 µF capacitor near pin.
P010VREFH0Analog high reference for ADC/DAC; supports external reference or internal VCC0 connection.
RESReset InputActive-low asynchronous reset pin; initiates full system reset including peripheral registers and clocks.
VCCPower SupplyMain digital power supply (1.6–5.5 V); requires 0.1 µF ceramic capacitor to VSS near pin.
VSSGroundDigital ground reference; connects to PCB ground plane and decouples all VCC pins.

Key Features

FeatureDesign Value
Ultra-Low-Power OperationSupports DEEP-SNOOZE mode with sub-μA current draw while retaining SRAM and RTC; ideal for battery life extension in remote sensors.
Functional Safety SupportIncludes ECC on SRAM, ADC self-diagnosis, CAC for clock monitoring, IWDT with independent oscillator - enables IEC 61508 SIL2 design.
Hardware Security AccelerationDedicated AES128/256 engine and TRNG eliminate software crypto bottlenecks and reduce attack surface in secure boot and OTA updates.
Event-Driven ArchitectureELC enables direct peripheral-to-peripheral triggering (e.g., ADC conversion start → DMA transfer → CRC calculation) without CPU intervention.
Flexible Analog IntegrationADC12 supports scan mode across 7 channels with internal TSN and VREFH0 sampling; DAC12 provides rail-to-rail output for sensor biasing or calibration.
Robust Industrial ConnectivityCAN 2.0B interface with message RAM and filtering; I3C supports multi-drop topology and dynamic address assignment for sensor hubs.

Applications

Industrial Sensor NodeSmart Energy Meter

Use Scenario: Battery-powered wireless temperature/humidity/pressure sensor deployed in factory automation with 10-year lifespan.

IC Role / Device Role / Timing Role: Main controller executing sensor fusion, BLE/Wi-Fi stack, and secure OTA updates; AGTW timers manage periodic wake-up and low-power ADC sampling.

Use Value: Sub-μA DEEP-SNOOZE current and integrated TRNG/AES enable long-life operation with cryptographic integrity for firmware validation.

Use Scenario: DIN-rail mounted electricity meter with metrology, tamper detection, and HAN communication via PLC or RF.

IC Role / Device Role / Timing Role: System management MCU handling real-time clock, tariff switching, secure storage, and CAN-based communication with concentrator.

Use Value: Hardware CRC, DOC, and register write protection ensure data integrity and prevent unauthorized configuration changes in revenue-critical applications.

Motor Control Edge NodeBuilding Automation Controller

Use Scenario: Compact fan/pump controller with brushless DC motor drive, thermal monitoring, and Modbus RTU over RS-485.

IC Role / Device Role / Timing Role: Real-time motor commutation using GPT16 PWM outputs and Hall sensor inputs (GTIU/GTIV/GTIW); SCI9 handles Modbus protocol.

Use Value: Six GPT16 timers with 11 PWM outputs and POEG support enable precise 3-phase BLDC control without external gate drivers.

Use Scenario: HVAC zone controller integrating CO₂, occupancy, and ambient light sensing with DALI lighting control and BACnet/IP gateway.

IC Role / Device Role / Timing Role: Central processing unit managing multi-sensor polling, PID loop execution, and I3C-based sensor hub coordination.

Use Value: I3C interface reduces wiring complexity versus I²C; ELC links ADC triggers to DTC transfers, minimizing CPU load during concurrent sensor reads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA2E2A52DNJ#HA020-pin HWQFN package; 15 GPIOs (vs. 19), no CAN module, same core/peripherals otherwise.Lacks CAN interface and 2 × 5-V tolerant pins; suitable only where CAN is unused and board space is constrained.Select only if CAN is unnecessary and footprint reduction outweighs loss of robust industrial connectivity.
R7FA2E2A72DNK#HA064-KB flash (vs. 32 KB), identical package, temperature grade, and peripheral set.Enables larger firmware images (e.g., dual-bank OTA, advanced encryption stacks) without layout change.Choose when future firmware expansion or enhanced security features require additional code space.

Compared with R7FA2E2A52DNK#HA0, R7FA2E2A52DNJ#HA0 sacrifices CAN and I/O count for smaller size, while R7FA2E2A72DNK#HA0 retains full compatibility but doubles flash capacity - making it ideal for scalable firmware development across product tiers.

Availability

R7FA2E2A52DNK#HA0 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, motor control edge devices, and building automation controllers requiring stable component supply across extended temperature ranges.

Supply support for R7FA2E2A52DNK#HA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The RA2E2 Group is designed for cost-sensitive, ultra-low-power general-purpose applications demanding security, functional safety, and rich analog integration - targeting battery-operated and energy-harvesting systems.

FAQ

What is the maximum operating frequency of the R7FA2E2A52DNK#HA0?

The R7FA2E2A52DNK#HA0 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable with the high-speed on-chip oscillator (HOCO) configured at 48 MHz or via external crystal input. The device maintains timing compliance across its full industrial temperature range (-40°C to +85°C) and supply voltage range (1.6 V to 5.5 V), as verified in the R01DS0387EJ0150 datasheet revision 1.50.

Does the R7FA2E2A52DNK#HA0 support CAN communication?

Yes, the R7FA2E2A52DNK#HA0 integrates a full CAN 2.0B module compliant with ISO 11898-1, supporting bit rates up to 1 Mbps and message RAM with filtering. It uses dedicated pins (P103, P102, P101, P100) for CAN_TX, CAN_RX, and associated control signals. This capability is confirmed in Table 1.7 and Figure 1.3 of the R01DS0387EJ0150 datasheet, and applies specifically to the NK-package variants like R7FA2E2A52DNK#HA0.

What package type and pin count does the R7FA2E2A52DNK#HA0 use?

The R7FA2E2A52DNK#HA0 uses a 24-pin HWQFN package measuring 4 mm × 4 mm with 0.5 mm pitch and an exposed die pad. This is confirmed by the part numbering scheme (NK = 24-pin HWQFN) in Figure 1.2 and validated in Table 1.11 and Figure 1.3 of the R01DS0387EJ0150 datasheet. The package supports 19 general-purpose I/O pins, including two 5-V tolerant ports (P400 and P401).

How much flash and SRAM memory does the R7FA2E2A52DNK#HA0 include?

The R7FA2E2A52DNK#HA0 includes 32-KB of code flash memory and 8-KB of on-chip SRAM with parity/ECC protection. It also provides 2-KB of data flash memory rated for 100,000 program/erase cycles. These values are explicitly listed in Table 1.11 and Section 1.1 of the R01DS0387EJ0150 datasheet, and distinguish it from higher-flash variants like R7FA2E2A72DNK#HA0 (64 KB).

What security and safety features are integrated into the R7FA2E2A52DNK#HA0?

The R7FA2E2A52DNK#HA0 integrates AES128/256 acceleration, True Random Number Generator (TRNG), CRC calculator, Data Operation Circuit (DOC), SRAM ECC/parity, flash area protection, ADC self-diagnosis, Clock Accuracy Measurement (CAC), and Independent Watchdog Timer (IWDT). These features collectively support IEC 61508 SIL2 and ISO/SAE 21434 compliance, as detailed in Sections 1.1 and Table 1.7 of the R01DS0387EJ0150 datasheet.

R7FA2E2A52DNK#HA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
24-WFQFN Exposed Pad
Series:
RA2E2
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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The price and inventory of R7FA2E2A52DNK#HA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA2E2A52DNK#HA0 is usually 5 days.

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5.How can I obtain technical support or documentation for R7FA2E2A52DNK#HA0?

For technical support, including R7FA2E2A52DNK#HA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA2E2A52DNK#HA0 requirements.

6.How does Aetrix verify that R7FA2E2A52DNK#HA0 is sourced from the original manufacturer or authorized distributors?

All R7FA2E2A52DNK#HA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA2E2A52DNK#HA0 meets industry standards.

7.What is the process for return or replacement of R7FA2E2A52DNK#HA0?

All R7FA2E2A52DNK#HA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA2E2A52DNK#HA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA2E2A52DNK#HA0 part is unused and in its original packaging.

Return procedure for R7FA2E2A52DNK#HA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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