Renesas R7FA2E2A52DNK#HA0
- Part No.:
- R7FA2E2A52DNK#HA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
R7FA2E2A52DNK#HA0.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 24HWQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R7FA2E2A52DNK#HA0 from Renesas is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 32-KB code flash, 8-KB SRAM, 12-bit ADC and DAC, integrated CAN interface, and hardware AES/256 + TRNG for secure edge sensing. It targets battery-powered industrial sensors and smart metering nodes requiring functional safety support and extended temperature operation.
For engineers reviewing the R7FA2E2A52DNK#HA0 datasheet, R7FA2E2A52DNK#HA0 pinout, R7FA2E2A52DNK#HA0 application, or R7FA2E2A52DNK#HA0 equivalent, key selection criteria include its 24-pin HWQFN package with 19 GPIOs (2 × 5-V tolerant), dual low-power timers (AGTW), event-link controller (ELC), and -40°C to +85°C industrial temperature grade.
Technical Context
The R7FA2E2A52DNK#HA0 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting 8 regions, enabling secure partitioning of firmware and data. Its clock system integrates HOCO/MOCO/LOCO oscillators with trim capability and includes dedicated IWDT and CAC for clock accuracy monitoring.
Analog subsystem integration includes ADC12 with 7 selectable input channels, on-die temperature sensor (TSN), and low-power analog comparators (ACMPLP). Communication peripherals comprise SCI (UART/IIC/SPI/Smart Card), I3C, SPI, and CAN - all accessible via shared pins under ELC-driven event routing to minimize CPU overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M23 @ 48 MHz max; supports Armv8-M security extensions and MPU for memory isolation. |
| Memory | 32-KB code flash (100k erase cycles), 2-KB data flash, 8-KB SRAM with ECC/parity for ASIL-B compliance. |
| Analog Peripherals | 12-bit ADC12 (7-channel), 12-bit DAC12, TSN, and two low-power analog comparators (ACMPLP). |
| Timers | GPT16 × 6 (11 PWM outputs), AGTW × 2, WDT/IWDT, RTC with calendar mode and binary count. |
| Communication | SCI × 1 (UART/IIC/SPI/Smart Card), I3C × 1, SPI × 1, CAN × 1 - all pin-multiplexed with ELC support. |
| Package & Temp | 24-pin HWQFN (4 mm × 4 mm, 0.5 mm pitch); rated for -40°C to +85°C industrial operation. |
| Power Supply | VCC = 1.6 V to 5.5 V; includes LVD (3 thresholds), POR, and multiple low-power modes (SNOOZE, DEEP-SNOOZE). |
| Security | AES128/256 accelerator, TRNG, CRC calculator, DOC, register write protection, illegal access detection. |
Pinout & Package
Package: 24-pin HWQFN (4 mm × 4 mm, 0.5 mm pitch), exposed die pad recommended connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P400 | CACREF / AGTIO1 | Measurement reference clock input for CAC; external event input for AGTW timer 1. |
| P401 | VCL | Internal LDO stabilization pin; requires 4.7 µF capacitor to VSS for stable analog supply. |
| P205 | AGTOA1 | Output compare match A output for AGTW timer 1; used for precise pulse generation in sensor wake-up. |
| P201/MD | Mode Control | Boot mode selection during reset; determines single-chip vs. SCI boot configuration. |
| P108/SWDIO | Debug Interface | Serial Wire Debug data I/O; enables non-intrusive firmware debugging and programming. |
| P300/SWCLK | Debug Clock | Serial Wire Debug clock input; synchronizes debug communication with host debugger. |
| P010/VREFH0 | Analog Reference | High-side ADC reference voltage input; must be tied to VCC0 when ADC not used. |
| P011/VREFL0 | Analog Ground | Low-side ADC reference ground; requires 0.1 µF decoupling to VSS for noise immunity. |
| P109 | GTIOC7A / SCK9 | GPT channel A input capture/output compare; also serves as SCI9 clock in synchronous mode. |
| P110 | GTIOC7B / CTS9_RTS9 | GPT channel B input capture/output compare; also controls flow in SCI9 asynchronous mode. |
| P111 | GTIOC6A / RXD9 | GPT channel A for timing-critical signal capture; doubles as SCI9 receive data input. |
| P112 | GTIOC6B / TXD9 | GPT channel B for synchronized waveform generation; also transmits SCI9 serial data. |
| P103 | AGTOB0 / GTOWUP | Output compare match B for AGTW timer 0; also drives positive phase U of 3-phase BLDC motor control. |
| P102 | AGTO0 / GTOWLO | AGTW timer 0 pulse output; also provides negative phase U output for BLDC motor drive. |
| P101 | AGTEE0 / GTETRGB | External event enable for AGTW timer 0; also accepts RGB trigger for GPT timer group B. |
| P100 | AGTIO0 / GTETRGA | External event input for AGTW timer 0; also triggers GPT timer group A for synchronized timing. |
| P015 | AN019 | Analog input channel 19 for ADC12; supports internal TSN and VREFH0 sampling. |
| P014 | AN009 | Analog input channel 9; configurable for differential or single-ended acquisition with programmable gain. |
| P011 | VREFL0 | Analog ground reference for ADC/DAC; must be decoupled with 0.1 µF capacitor near pin. |
| P010 | VREFH0 | Analog high reference for ADC/DAC; supports external reference or internal VCC0 connection. |
| RES | Reset Input | Active-low asynchronous reset pin; initiates full system reset including peripheral registers and clocks. |
| VCC | Power Supply | Main digital power supply (1.6–5.5 V); requires 0.1 µF ceramic capacitor to VSS near pin. |
| VSS | Ground | Digital ground reference; connects to PCB ground plane and decouples all VCC pins. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-Low-Power Operation | Supports DEEP-SNOOZE mode with sub-μA current draw while retaining SRAM and RTC; ideal for battery life extension in remote sensors. |
| Functional Safety Support | Includes ECC on SRAM, ADC self-diagnosis, CAC for clock monitoring, IWDT with independent oscillator - enables IEC 61508 SIL2 design. |
| Hardware Security Acceleration | Dedicated AES128/256 engine and TRNG eliminate software crypto bottlenecks and reduce attack surface in secure boot and OTA updates. |
| Event-Driven Architecture | ELC enables direct peripheral-to-peripheral triggering (e.g., ADC conversion start → DMA transfer → CRC calculation) without CPU intervention. |
| Flexible Analog Integration | ADC12 supports scan mode across 7 channels with internal TSN and VREFH0 sampling; DAC12 provides rail-to-rail output for sensor biasing or calibration. |
| Robust Industrial Connectivity | CAN 2.0B interface with message RAM and filtering; I3C supports multi-drop topology and dynamic address assignment for sensor hubs. |
Applications
| Industrial Sensor Node | Smart Energy Meter |
|---|---|
Use Scenario: Battery-powered wireless temperature/humidity/pressure sensor deployed in factory automation with 10-year lifespan. IC Role / Device Role / Timing Role: Main controller executing sensor fusion, BLE/Wi-Fi stack, and secure OTA updates; AGTW timers manage periodic wake-up and low-power ADC sampling. Use Value: Sub-μA DEEP-SNOOZE current and integrated TRNG/AES enable long-life operation with cryptographic integrity for firmware validation. | Use Scenario: DIN-rail mounted electricity meter with metrology, tamper detection, and HAN communication via PLC or RF. IC Role / Device Role / Timing Role: System management MCU handling real-time clock, tariff switching, secure storage, and CAN-based communication with concentrator. Use Value: Hardware CRC, DOC, and register write protection ensure data integrity and prevent unauthorized configuration changes in revenue-critical applications. |
| Motor Control Edge Node | Building Automation Controller |
Use Scenario: Compact fan/pump controller with brushless DC motor drive, thermal monitoring, and Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Real-time motor commutation using GPT16 PWM outputs and Hall sensor inputs (GTIU/GTIV/GTIW); SCI9 handles Modbus protocol. Use Value: Six GPT16 timers with 11 PWM outputs and POEG support enable precise 3-phase BLDC control without external gate drivers. | Use Scenario: HVAC zone controller integrating CO₂, occupancy, and ambient light sensing with DALI lighting control and BACnet/IP gateway. IC Role / Device Role / Timing Role: Central processing unit managing multi-sensor polling, PID loop execution, and I3C-based sensor hub coordination. Use Value: I3C interface reduces wiring complexity versus I²C; ELC links ADC triggers to DTC transfers, minimizing CPU load during concurrent sensor reads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA2E2A52DNJ#HA0 | 20-pin HWQFN package; 15 GPIOs (vs. 19), no CAN module, same core/peripherals otherwise. | Lacks CAN interface and 2 × 5-V tolerant pins; suitable only where CAN is unused and board space is constrained. | Select only if CAN is unnecessary and footprint reduction outweighs loss of robust industrial connectivity. |
| R7FA2E2A72DNK#HA0 | 64-KB flash (vs. 32 KB), identical package, temperature grade, and peripheral set. | Enables larger firmware images (e.g., dual-bank OTA, advanced encryption stacks) without layout change. | Choose when future firmware expansion or enhanced security features require additional code space. |
Compared with R7FA2E2A52DNK#HA0, R7FA2E2A52DNJ#HA0 sacrifices CAN and I/O count for smaller size, while R7FA2E2A72DNK#HA0 retains full compatibility but doubles flash capacity - making it ideal for scalable firmware development across product tiers.
Availability
R7FA2E2A52DNK#HA0 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, motor control edge devices, and building automation controllers requiring stable component supply across extended temperature ranges.
Supply support for R7FA2E2A52DNK#HA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The RA2E2 Group is designed for cost-sensitive, ultra-low-power general-purpose applications demanding security, functional safety, and rich analog integration - targeting battery-operated and energy-harvesting systems.
FAQ
What is the maximum operating frequency of the R7FA2E2A52DNK#HA0?
The R7FA2E2A52DNK#HA0 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable with the high-speed on-chip oscillator (HOCO) configured at 48 MHz or via external crystal input. The device maintains timing compliance across its full industrial temperature range (-40°C to +85°C) and supply voltage range (1.6 V to 5.5 V), as verified in the R01DS0387EJ0150 datasheet revision 1.50.
Does the R7FA2E2A52DNK#HA0 support CAN communication?
Yes, the R7FA2E2A52DNK#HA0 integrates a full CAN 2.0B module compliant with ISO 11898-1, supporting bit rates up to 1 Mbps and message RAM with filtering. It uses dedicated pins (P103, P102, P101, P100) for CAN_TX, CAN_RX, and associated control signals. This capability is confirmed in Table 1.7 and Figure 1.3 of the R01DS0387EJ0150 datasheet, and applies specifically to the NK-package variants like R7FA2E2A52DNK#HA0.
What package type and pin count does the R7FA2E2A52DNK#HA0 use?
The R7FA2E2A52DNK#HA0 uses a 24-pin HWQFN package measuring 4 mm × 4 mm with 0.5 mm pitch and an exposed die pad. This is confirmed by the part numbering scheme (NK = 24-pin HWQFN) in Figure 1.2 and validated in Table 1.11 and Figure 1.3 of the R01DS0387EJ0150 datasheet. The package supports 19 general-purpose I/O pins, including two 5-V tolerant ports (P400 and P401).
How much flash and SRAM memory does the R7FA2E2A52DNK#HA0 include?
The R7FA2E2A52DNK#HA0 includes 32-KB of code flash memory and 8-KB of on-chip SRAM with parity/ECC protection. It also provides 2-KB of data flash memory rated for 100,000 program/erase cycles. These values are explicitly listed in Table 1.11 and Section 1.1 of the R01DS0387EJ0150 datasheet, and distinguish it from higher-flash variants like R7FA2E2A72DNK#HA0 (64 KB).
What security and safety features are integrated into the R7FA2E2A52DNK#HA0?
The R7FA2E2A52DNK#HA0 integrates AES128/256 acceleration, True Random Number Generator (TRNG), CRC calculator, Data Operation Circuit (DOC), SRAM ECC/parity, flash area protection, ADC self-diagnosis, Clock Accuracy Measurement (CAC), and Independent Watchdog Timer (IWDT). These features collectively support IEC 61508 SIL2 and ISO/SAE 21434 compliance, as detailed in Sections 1.1 and Table 1.7 of the R01DS0387EJ0150 datasheet.
R7FA2E2A52DNK#HA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 24-WFQFN Exposed Pad
- Series:
- RA2E2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M23
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 20
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 8x12b SAR
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA2E2A52DNK#HA0 FAQ
1.How can I place an order for R7FA2E2A52DNK#HA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA2E2A52DNK#HA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R7FA2E2A52DNK#HA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA2E2A52DNK#HA0 is usually 5 days.
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5.How can I obtain technical support or documentation for R7FA2E2A52DNK#HA0?
For technical support, including R7FA2E2A52DNK#HA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA2E2A52DNK#HA0 requirements.
6.How does Aetrix verify that R7FA2E2A52DNK#HA0 is sourced from the original manufacturer or authorized distributors?
All R7FA2E2A52DNK#HA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA2E2A52DNK#HA0 meets industry standards.
7.What is the process for return or replacement of R7FA2E2A52DNK#HA0?
All R7FA2E2A52DNK#HA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA2E2A52DNK#HA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA2E2A52DNK#HA0 part is unused and in its original packaging.
Return procedure for R7FA2E2A52DNK#HA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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