Renesas R7FA2E2A53CBY#HC1

Overview

R7FA2E2A53CBY#HC1 from Renesas Electronics is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 32-KB code flash, 8-KB SRAM, 12-bit ADC and DAC, integrated CAN interface, and hardware security including AES-128/256 and TRNG. It targets battery-powered industrial sensors and smart metering endpoints requiring functional safety and secure firmware updates.

For engineers reviewing the R7FA2E2A53CBY#HC1 datasheet, R7FA2E2A53CBY#HC1 pinout, R7FA2E2A53CBY#HC1 application, or R7FA2E2A53CBY#HC1 equivalent, key selection criteria include its WLCSP-16 package with 11 GPIOs, -40°C to +105°C industrial temperature grade, 1.6–5.5 V wide supply range, and support for I3C, SPI, SCI (UART/I²C/SPI), and CAN bus interfaces in a single-chip solution.

Technical Context

The R7FA2E2A53CBY#HC1 implements the Armv8-M architecture with Memory Protection Unit (MPU) and CoreSight™ debug infrastructure, enabling secure, scalable embedded designs. Its system-level features include Event Link Controller (ELC) for CPU-free peripheral coordination, Data Transfer Controller (DTC) for autonomous data movement, and Clock Frequency Accuracy Measurement Circuit (CAC) for real-time clock calibration.

Power management integrates Low Power Asynchronous General Purpose Timers (AGTW × 2), multiple clock sources (HOCO/MOCO/LOCO/IWDT-OSC), and configurable low-voltage detection (LVD0/LVD1/LVD2). Safety mechanisms include ECC in SRAM, flash area protection, ADC self-diagnosis, and Independent Watchdog Timer (IWDT) with dedicated 15-kHz oscillator.

Key Specifications

Pinout & Package

Package: 16-pin Wafer-Level Chip-Scale Package (WLCSP), 1.84 mm × 1.87 mm, 0.4 mm pitch, exposed die pad recommended to be connected to VSS or left open.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA2E2A53CNJ#AA0, the R7FA2E2A53CBY#HC1 offers superior board-area efficiency and thermal performance in sealed environments but requires advanced SMT assembly; versus R7FA2E1A53CBY#HC0, it adds CAN physical layer support and AES-256 acceleration-critical for interoperability with industrial fieldbuses and compliance with UL 2900-1 cybersecurity standards.

Availability

R7FA2E2A53CBY#HC1 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, BLDC motor controllers, and secure IoT edge gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R7FA2E2A53CBY#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with annual revenue exceeding $10 billion and design centers worldwide.

The RA2E2 Group targets ultra-low-power, cost-optimized industrial and consumer applications requiring functional safety (IEC 61508 SIL2), security (PSA Level 2), and seamless scalability across pin- and software-compatible MCUs.

FAQ

What is the maximum operating frequency of the R7FA2E2A53CBY#HC1?

The R7FA2E2A53CBY#HC1 operates at a maximum frequency of 48 MHz using its Arm Cortex-M23 core. This speed is achievable across the full industrial temperature range (-40°C to +105°C) when powered within the specified 1.6–5.5 V supply range and using the high-speed on-chip oscillator (HOCO) with appropriate clock trimming. The device maintains timing compliance per its datasheet AC characteristics under these conditions.

Does the R7FA2E2A53CBY#HC1 support CAN FD or only classical CAN 2.0B?

The R7FA2E2A53CBY#HC1 implements a classical CAN 2.0B controller compliant with ISO 11898-1:2003, supporting bit rates up to 1 Mbps and standard/extended frame formats. It does not support CAN FD features such as flexible data-rate or increased payload length. For CAN FD requirements, designers should consider higher-tier RA-family MCUs like the RA6M5 series.

How many analog input channels does the 12-bit ADC support on the R7FA2E2A53CBY#HC1?

The R7FA2E2A53CBY#HC1's ADC12 module supports up to seven analog input channels (AN005, AN006, AN009, AN010, AN019–AN022), as confirmed by the RA2E2 function comparison table and pin list for the WLCSP-16 variant. This count excludes the internal temperature sensor and VREFH0 inputs, which are additional selectable sources for conversion but not dedicated external pins.

Is the R7FA2E2A53CBY#HC1 pin-compatible with other RA2E2 group members in WLCSP-16 packages?

Yes, all RA2E2 WLCSP-16 variants-including R7FA2E2A53CBY#HC1, R7FA2E2A73CBY#HC1, and R7FA2E2A33CBY#HC1-share identical pin assignments and mechanical footprint. Differences are limited to flash size (32 KB vs. 64 KB vs. 16 KB) and corresponding feature enablement (e.g., ADC channel count), allowing hardware reuse across product tiers during design-in and qualification.

What debug interface does the R7FA2E2A53CBY#HC1 use, and what pins are required?

The R7FA2E2A53CBY#HC1 uses the standard Arm Serial Wire Debug (SWD) interface, requiring two pins: SWDIO (P108) and SWCLK (P300). These pins support full programming, debugging, and real-time trace capabilities via J-Link, CMSIS-DAP, or Renesas E2 studio debug probes. No additional reset or UART pins are needed for basic debug functionality.