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Renesas R7FA2E2A72DBY#HC1
- Part No.:
- R7FA2E2A72DBY#HC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 16-UFBGA, WLCSP
- Datasheet:
-
R7FA2E2A72DBY#HC1.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 16WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,296
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Product details
Overview
R7FA2E2A72DBY#HC1 from Renesas Electronics is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 64 KB code flash, 8 KB SRAM, 12-bit ADC and DAC, integrated CAN interface, and hardware security including AES-128/256 and TRNG. It targets cost-sensitive industrial sensor nodes and battery-powered control systems requiring functional safety support and extended temperature operation.
For engineers reviewing the R7FA2E2A72DBY#HC1 datasheet, R7FA2E2A72DBY#HC1 pinout, R7FA2E2A72DBY#HC1 application, or R7FA2E2A72DBY#HC1 equivalent, key selection criteria include its WLCSP-16 package with 11 GPIOs, -40°C to +85°C industrial temperature grade, 1.6–5.5 V wide supply range, and integrated safety features (ECC SRAM, CAC, IWDT) for reliable embedded deployment.
Technical Context
The R7FA2E2A72DBY#HC1 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting 8 regions, enabling secure partitioning of firmware and data. Its clock system integrates HOCO (48 MHz), MOCO (8 MHz), LOCO (32.768 kHz), and IWDT-dedicated oscillator (15 kHz), all with trim capability for precision timing across voltage and temperature.
Peripheral integration includes one SCI with UART/SPI/I²C/Smart Card modes, one I3C bus interface, one SPI, one CAN module, six 16-bit GPT timers (12 PWM outputs), two AGTW low-power timers, and a full analog subsystem comprising ADC12 (8 channels), DAC12, TSN, and ACMPLP comparators - all accessible via 11 general-purpose I/O pins in the WLCSP-16 package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M23, 48 MHz max - enables real-time deterministic execution with TrustZone-M isolation for secure firmware partitioning. |
| Memory | 64 KB code flash + 2 KB data flash + 8 KB SRAM with ECC - supports robust firmware updates and runtime data integrity in harsh environments. |
| Analog | 12-bit ADC (8 ch), 12-bit DAC, on-die temperature sensor - provides high-resolution sensing and actuation without external signal conditioning. |
| Connectivity | CAN 2.0B, I3C, SPI, SCI (UART/SPI/I²C/Smart Card) - enables mixed-protocol communication in industrial networks and sensor hubs. |
| Safety & Security | ECC SRAM, CAC, IWDT, register write protection, ADC self-diagnosis - meets IEC 61508 SIL2 and ISO 26262 ASIL-B readiness requirements. |
| Power & Temp | 1.6–5.5 V supply, -40°C to +85°C operation - supports direct battery (Li-ion, 2xAA) and unregulated industrial rail interfacing. |
| Package | WLCSP-16 (1.84 mm × 1.87 mm, 0.4 mm pitch) - enables ultra-compact PCB layout for space-constrained IoT edge devices. |
Pinout & Package
Package: 16-pin Wafer-Level Chip Scale Package (WLCSP), 1.84 mm × 1.87 mm, 0.4 mm pitch, exposed die pad (recommended connection to VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P400 | CACREF input / AGTIO1 | Accepts external reference clock for Clock Accuracy Measurement; also serves as low-power timer event input. |
| P401 | VCL power stabilization | Connects to 4.7 µF capacitor for internal LDO smoothing - critical for analog and low-noise digital stability. |
| VSS | Analog/digital ground | Common return path for all domains; must be connected to system ground with low-impedance trace. |
| VCC | Main power supply | 1.6–5.5 V input; requires local 0.1 µF ceramic decoupling capacitor placed adjacent to pin. |
| RES | Active-low reset input | Asynchronous hard reset; internal pull-up ensures valid state during power ramp; compatible with open-drain supervisors. |
| P201/MD | Mode select | Determines boot mode (single-chip vs. SCI boot); must be held stable during reset release to avoid misconfiguration. |
| P300/SWCLK | SWD clock | Serial Wire Debug clock input - enables non-intrusive programming and real-time trace without dedicated JTAG pins. |
| P108/SWDIO | SWD data I/O | Bidirectional debug data line; shares pin with GPIO P108 - requires SWD protocol handling during runtime. |
| P109 | GPT output compare A | Configurable as PWM output, capture input, or general-purpose I/O - supports motor phase control or timing generation. |
| P110 | GPT output compare B | Complementary output channel to P109; enables dead-time insertion for half-bridge gate driving. |
| P103 | SCI9 RX / I3C SDA | Shared serial receive and I3C data line - requires software-controlled mode switching between protocols. |
| P102 | SCI9 TX / I3C SCL | Shared serial transmit and I3C clock line - supports multi-drop I3C bus or point-to-point UART with automatic baud detection. |
| P101 | ADC input AN021 / KINT | Simultaneously serves as analog input channel and key interrupt trigger - enables wake-on-touch with minimal power overhead. |
| P100 | ADC input AN022 / AGTIO0 | Combines high-precision sensing with low-power timer event capture - ideal for battery-operated environmental monitors. |
| P011/VREFL0 | ADC reference ground | Separate analog ground for ADC reference; must be tied to VSS with short, low-inductance connection. |
| P010/VREFH0 | ADC reference voltage | Programmable reference source (1.6–VCC); connects to VCC0 when internal reference is unused - defines ADC full-scale range. |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables zero-CPU-intervention peripheral chaining (e.g., ADC conversion triggers DMA transfer to SRAM), reducing active time by up to 40% in sensor polling loops. |
| Data Transfer Controller (DTC) | Offloads memory-mapped peripheral data movement (e.g., SPI RX buffer → flash sector), freeing CPU for computation while maintaining deterministic latency. |
| Low-Power Analog Comparator (ACMPLP) | Configurable speed modes (high/low) allow trade-off between response time (<1 µs) and current draw (1.2 µA typical in low-speed mode) for wake-on-event applications. |
| Capacitive Touch Sensing Unit (CTSU2) | Supports up to 35 touch electrodes with built-in noise rejection - enables button/slider implementation without external RC networks or shield layers. |
| Independent Watchdog Timer (IWDT) | Operates from dedicated 15 kHz oscillator, guaranteeing fail-safe reset even if main clock fails - required for IEC 61508-compliant safety monitors. |
| Security Acceleration | AES-128/256 engine processes 128-bit blocks in <100 cycles; TRNG delivers entropy at 1.2 Mbps - accelerates secure boot and OTA update verification. |
Applications
| Industrial Sensor Node | Smart Meter Interface |
|---|---|
|
Use Scenario: Battery-powered wireless temperature/humidity node with CAN backbone connectivity in factory automation. IC Role / Device Role / Timing Role: Main controller executing sensor acquisition, CAN message framing, and low-power scheduling using AGTW timers. Use Value: 1.6–5.5 V operation enables direct Li-SOCl₂ battery use; ECC SRAM and CAC ensure data integrity over 10+ year deployments. |
Use Scenario: Pulse-counting interface between mechanical utility meter and smart grid concentrator via I3C or SCI UART. IC Role / Device Role / Timing Role: Protocol bridge converting mechanical switch closures into timestamped I3C events with CRC-protected payload. Use Value: Integrated 12-bit ADC measures auxiliary voltage/current; hardware CRC generator validates meter pulse integrity before transmission. |
| Motor Control Subsystem | Medical Wearable Monitor |
|
Use Scenario: Compact BLDC fan controller in HVAC systems using hall-effect feedback and 3-phase PWM outputs. IC Role / Device Role / Timing Role: Real-time motor commutation engine leveraging GPT16 timers with POEG for synchronized gate drive enable/disable. Use Value: Six GPT16 channels deliver 12 PWM outputs with programmable dead time; 48 MHz core sustains 20 kHz PWM carrier without jitter. |
Use Scenario: Ultra-small ECG front-end with capacitive touch buttons and analog biosignal conditioning. IC Role / Device Role / Timing Role: Signal acquisition hub performing ADC sampling, CTSU2 touch detection, and BLE-ready data packaging. Use Value: WLCSP-16 footprint fits sub-100 mm² wearable PCBs; 12-bit ADC + TSN enables body temperature compensation of ECG baseline drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA2E2A72DNJ | HWQFN-20 package (4×4 mm), 15 GPIOs, same flash/SRAM/peripherals | Requires larger PCB area but offers more routing flexibility and thermal dissipation | Select when board layout allows QFN footprint and additional I/O or thermal margin is needed. |
| R7FA2E1A72DBY | RA2E1 family; Cortex-M23 @ 48 MHz, 64 KB flash, 8 KB SRAM, no CAN or I3C | Lacks CAN and I3C interfaces; lower security feature set (no TRNG, AES only) | Choose for cost-optimized designs where CAN/I3C are unnecessary and basic security suffices. |
Compared with R7FA2E2A72DNJ, the R7FA2E2A72DBY#HC1 reduces board area by 55% but trades 4 GPIOs and thermal headroom; versus R7FA2E1A72DBY, it adds CAN/I3C and full cryptographic acceleration at identical package size and price tier.
Availability
R7FA2E2A72DBY#HC1 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart meter interfaces, motor control subsystems, and medical wearable monitors requiring stable component supply across long product lifecycles.
Supply support for R7FA2E2A72DBY#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with over 40 years of MCU innovation.
The RA2E2 Group targets ultra-low-power, cost-sensitive industrial and consumer edge devices, emphasizing security-by-design, functional safety readiness, and seamless scalability within the RA ecosystem.
FAQ
What is the maximum operating frequency and core architecture of the R7FA2E2A72DBY#HC1?
The R7FA2E2A72DBY#HC1 features an Arm Cortex-M23 core compliant with the Armv8-M architecture and operates at a maximum frequency of 48 MHz. This enables deterministic real-time performance with TrustZone-M support for secure firmware partitioning, making it suitable for applications requiring both efficiency and isolation.
Does the R7FA2E2A72DBY#HC1 support CAN communication, and what version is implemented?
Yes, the R7FA2E2A72DBY#HC1 integrates a CAN module compliant with CAN 2.0B specification, supporting both standard and extended frame formats with bit rates up to 1 Mbps. It includes dedicated message RAM, acceptance filtering, and loopback self-test mode for robust industrial network interfacing.
What package type and pin count does the R7FA2E2A72DBY#HC1 use?
The R7FA2E2A72DBY#HC1 uses a 16-pin Wafer-Level Chip Scale Package (WLCSP) measuring 1.84 mm × 1.87 mm with 0.4 mm pitch. This ultra-compact package supports high-density PCB layouts and is optimized for space-constrained IoT and wearable applications.
What safety and security features are included in the R7FA2E2A72DBY#HC1?
The R7FA2E2A72DBY#HC1 includes ECC on SRAM, Clock Frequency Accuracy Measurement Circuit (CAC), Independent Watchdog Timer (IWDT), register write protection, ADC self-diagnosis, and hardware AES-128/256 with True Random Number Generator (TRNG). These features support IEC 61508 SIL2 and ISO 26262 ASIL-B development workflows.
What is the operating voltage range and temperature grade for the R7FA2E2A72DBY#HC1?
The R7FA2E2A72DBY#HC1 operates from 1.6 V to 5.5 V and is qualified for industrial temperature range of -40°C to +85°C. Its wide voltage range supports direct battery operation (e.g., 2xAA, Li-SOCl₂), while the temperature rating ensures reliability in factory-floor and outdoor edge deployments.
R7FA2E2A72DBY#HC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 16-UFBGA, WLCSP
- Series:
- RA2E2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M23
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 4x12b SAR
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA2E2A72DBY#HC1 FAQ
1.How can I place an order for R7FA2E2A72DBY#HC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA2E2A72DBY#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA2E2A72DBY#HC1 reliable?
The price and inventory of R7FA2E2A72DBY#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA2E2A72DBY#HC1 is usually 5 days.
3.What payment methods are accepted for R7FA2E2A72DBY#HC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA2E2A72DBY#HC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA2E2A72DBY#HC1?
R7FA2E2A72DBY#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA2E2A72DBY#HC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA2E2A72DBY#HC1?
For technical support, including R7FA2E2A72DBY#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA2E2A72DBY#HC1 requirements.
6.How does Aetrix verify that R7FA2E2A72DBY#HC1 is sourced from the original manufacturer or authorized distributors?
All R7FA2E2A72DBY#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA2E2A72DBY#HC1 meets industry standards.
7.What is the process for return or replacement of R7FA2E2A72DBY#HC1?
All R7FA2E2A72DBY#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA2E2A72DBY#HC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA2E2A72DBY#HC1 part is unused and in its original packaging.
Return procedure for R7FA2E2A72DBY#HC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA2E2A72DBY#HC1 Tags
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