Renesas R7FA2E3052DNH#HA0

Overview

R7FA2E3052DNH#HA0 from Renesas is an ultra-low-power 32-bit Arm® Cortex®-M23 microcontroller operating at up to 48 MHz, featuring 32-KB code flash, 16-KB SRAM, 12-bit ADC with 10 input channels, and integrated safety functions including SRAM parity, CAC, CRC, and IWDT. It targets battery-powered industrial sensors and smart metering endpoints requiring functional safety compliance and extended runtime.

For engineers reviewing the R7FA2E3052DNH#HA0 datasheet, R7FA2E3052DNH#HA0 pinout, R7FA2E3052DNH#HA0 application, or R7FA2E3052DNH#HA0 equivalent, key selection criteria include its 32-pin HWQFN package (5 mm × 5 mm), -40°C to +85°C industrial temperature grade, 1.6–5.5 V wide supply range, and hardware-based safety features aligned with IEC 61508 SIL-2 support requirements.

Technical Context

The R7FA2E3052DNH#HA0 implements the Armv8-M architecture with Memory Protection Unit (MPU) supporting 8 regions, enabling secure partitioning of firmware and data. Its clock system integrates HOCO (48 MHz), LOCO (32.768 kHz), and SOSC for RTC, with Clock Frequency Accuracy Measurement Circuit (CAC) providing real-time oscillator drift monitoring.

Safety-critical operation is reinforced by independent watchdog timer (IWDT) with dedicated 15-kHz oscillator, SRAM parity error detection, Flash area protection, ADC self-diagnosis, and register write protection via PRCR. The Event Link Controller (ELC) enables autonomous peripheral-to-peripheral triggering without CPU intervention, reducing latency in time-sensitive control loops.

Key Specifications

Pinout & Package

Package: 32-pin HWQFN (PWQN0032KE-A), 5 mm × 5 mm body, 0.5 mm pitch, exposed thermal pad (soldered to PCB ground plane for thermal and EMI performance).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA2E3052DFJ, the R7FA2E3052DNH#HA0 offers superior thermal performance and smaller footprint for automated manufacturing; versus R7FA2E3072DNH, it trades flash capacity for lower unit cost while retaining identical safety architecture and real-time response.

Availability

R7FA2E3052DNH#HA0 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart utility meters, and home appliance control boards requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.

Supply support for R7FA2E3052DNH#HA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for industrial, automotive, and IoT markets.

The RA2E3 Group targets cost-sensitive, ultra-low-power embedded applications demanding functional safety certification - designed specifically for battery-operated sensors, smart meters, and white goods where energy efficiency and safety compliance are non-negotiable.

FAQ

What is the maximum operating frequency and core architecture of the R7FA2E3052DNH#HA0?

The R7FA2E3052DNH#HA0 features an Arm Cortex-M23 core compliant with the Armv8-M architecture and operates at a maximum frequency of 48 MHz. This core includes a Memory Protection Unit (MPU) with 8 regions, single-cycle integer multiplier, and hardware divide support - delivering deterministic real-time performance with security extensions essential for certified safety applications. The R7FA2E3052DNH#HA0 achieves this speed across its full 1.6–5.5 V supply range.

Does the R7FA2E3052DNH#HA0 support functional safety standards such as IEC 61508?

Yes, the R7FA2E3052DNH#HA0 integrates multiple hardware safety mechanisms required for IEC 61508 SIL-2 development, including SRAM parity checking, Flash area protection, Clock Frequency Accuracy Measurement Circuit (CAC), Independent Watchdog Timer (IWDT), CRC calculator, Data Operation Circuit (DOC), and register write protection. These features are documented in Renesas' Functional Safety Manual (R01UM0154EJ0200) and enable diagnostic coverage exceeding 90% for systematic faults. The R7FA2E3052DNH#HA0 itself is not certified, but serves as a qualified component in certified systems.

What are the analog capabilities of the R7FA2E3052DNH#HA0, particularly regarding ADC resolution and channel count?

The R7FA2E3052DNH#HA0 includes a 12-bit successive approximation ADC (ADC12) with 10 selectable analog input channels (AN019–AN022, AN005–AN010). It supports internal temperature sensor and reference voltage inputs, ±1 LSB integral nonlinearity (INL), and programmable sample-and-hold timing. The ADC operates across the full 1.6–5.5 V supply range and interfaces directly with the on-chip temperature sensor (TSN) for die temperature monitoring - all without external components. This capability is fully specified in the R7FA2E3052DNH#HA0 datasheet Section 2.2.3.

How does the R7FA2E3052DNH#HA0 manage low-power operation in battery-powered applications?

The R7FA2E3052DNH#HA0 achieves ultra-low-power operation through multiple hardware features: deep software standby mode draws just 0.25 μA (typ) with RTC and key interrupts active; Low Power Asynchronous General Purpose Timers (AGT) operate independently of the main clock; and the Event Link Controller (ELC) enables peripheral-to-peripheral triggering without CPU wake-up. Combined with flexible clock gating and voltage scaling, these features extend battery life in wireless sensor nodes to over 10 years on a CR2032 coin cell - verified in Renesas Application Note R01AN5619EJ0100.

What package type and pin count does the R7FA2E3052DNH#HA0 use, and what are its thermal characteristics?

The R7FA2E3052DNH#HA0 uses a 32-pin HWQFN package (PWQN0032KE-A) measuring 5 mm × 5 mm with 0.5 mm pitch and an exposed thermal pad. Its maximum junction temperature is 125°C, and it is rated for operation from -40°C to +85°C. Thermal resistance θ_JA is 40°C/W (typ), and the exposed pad must be soldered to a PCB ground plane for optimal heat dissipation and EMI suppression - details are provided in the R7FA2E3052DNH#HA0 Package Outline Drawing (PWQN0032KE-A).