Renesas R7FA4E2B93CBC#BC0

Overview

R7FA4E2B93CBC#BC0 from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 100 MHz, featuring 128 KB code flash, 4 KB data flash, 40 KB SRAM, USB Full-Speed, CAN FD, I3C, and 12-bit ADC/DAC - deployed in industrial motor control, smart sensor hubs, and secure edge-node applications.

For engineers reviewing the R7FA4E2B93CBC#BC0 datasheet, R7FA4E2B93CBC#BC0 pinout, R7FA4E2B93CBC#BC0 application, or R7FA4E2B93CBC#BC0 equivalent, key selection criteria include its -40°C to +105°C BGA36 package, TrustZone-enabled security partitioning, 36-pin 0.5 mm pitch footprint, and integrated CAN FD + USBFS for dual-protocol connectivity in space-constrained embedded systems.

Technical Context

The R7FA4E2B93CBC#BC0 implements Armv8-M with TrustZone, supporting secure/non-secure MPU regions (8+8), dual SysTick timers, and CoreSight™ ETM-M33 for trace. Its clock system integrates MOSC, SOSC, HOCO/MOCO/LOCO, and PLL with CAC-based accuracy monitoring.

Peripheral integration includes two SCI modules (UART/IIC/SPI/Smart Card), two SPI channels, one I3C interface, CAN FD with 4 TX/32 RX buffers, USBFS device controller with internal transceiver and 5-pipe support, SSIE audio interface, and CEC compliant with HDMI 1.4b - all accessible via configurable pin multiplexing with secure attribution.

Key Specifications

Pinout & Package

Package: 36-pin BGA (PLBG0036KA-A), 4 mm × 4 mm, 0.5 mm pitch, exposed die pad (recommended VSS connection).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA4M2A93CFM and R7FA6M5BH3CFM, the R7FA4E2B93CBC#BC0 offers optimal balance of CAN FD + USBFS in a 36-pin BGA for space-constrained edge nodes, while avoiding over-provisioned memory and higher cost associated with larger packages and extended peripherals.

Availability

R7FA4E2B93CBC#BC0 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor hubs, secure edge gateways, and audio-enabled IoT nodes requiring stable component supply and long-term lifecycle support.

Supply support for R7FA4E2B93CBC#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded design innovation for automotive, industrial, infrastructure, and IoT applications.

The RA4E2 Group targets cost-sensitive, performance-optimized general-purpose microcontrollers with integrated security and connectivity - designed specifically for industrial automation, smart home devices, and battery-powered edge nodes.

FAQ

What is the maximum operating frequency of the R7FA4E2B93CBC#BC0?

The R7FA4E2B93CBC#BC0 operates at a maximum frequency of 100 MHz using its Arm Cortex-M33 core. This speed is achieved with the on-chip PLL enabled and supported by the HOCO or external crystal oscillator. The device maintains full peripheral functionality-including USBFS, CAN FD, and ADC12-at this clock rate, making it suitable for real-time control applications where deterministic timing is critical. All timing specifications in the R7FA4E2B93CBC#BC0 datasheet assume operation at this maximum frequency unless otherwise noted.

Does the R7FA4E2B93CBC#BC0 support CAN FD and USB Full-Speed simultaneously?

Yes, the R7FA4E2B93CBC#BC0 supports concurrent operation of CAN FD and USB Full-Speed. Its dedicated CAN FD module (compliant with ISO 11898-1) and USBFS device controller operate independently with separate clock domains and buffer memories. The 40 KB SRAM and 8-channel DMAC enable seamless data movement between CAN FD receive buffers and USBFS endpoints without CPU intervention. This dual-protocol capability is validated in the R7FA4E2B93CBC#BC0 hardware design and confirmed in Renesas application note R01AN5727JJ0100.

What package type and pin count does the R7FA4E2B93CBC#BC0 use?

The R7FA4E2B93CBC#BC0 uses a 36-pin BGA package (PLBG0036KA-A) with 4 mm × 4 mm dimensions and 0.5 mm pitch. It features an exposed die pad recommended for connection to VSS to enhance thermal dissipation and electrical stability. This package provides 20 general-purpose I/O pins, 4 dedicated analog pins (VREFH0/VREFL0/AVCC0/AVSS0), and full access to USB, CAN FD, and debug interfaces - optimized for compact industrial and consumer edge devices where board space is constrained.

How does the R7FA4E2B93CBC#BC0 implement hardware security?

The R7FA4E2B93CBC#BC0 implements hardware security through Arm TrustZone for Armv8-M, enabling strict separation of secure and non-secure code and data spaces. It includes a secure MPU with three configurable regions for code flash, two for data flash, and three for SRAM, plus individual secure/non-secure attribution for each peripheral. Additional features include a 128-bit unique ID, True Random Number Generator (TRNG), and secure pin multiplexing to prevent unauthorized reconfiguration of critical I/O. These capabilities are intrinsic to the R7FA4E2B93CBC#BC0 silicon and require no external components.

What analog peripherals are integrated into the R7FA4E2B93CBC#BC0?

The R7FA4E2B93CBC#BC0 integrates a 12-bit successive approximation ADC12 with up to 12 input channels, a 12-bit DAC12 with one output channel, and an on-die Temperature Sensor (TSN). The ADC12 supports internal reference voltage and TSN output as inputs, while the DAC12 uses dedicated VREFH/VREFL pins for precision output. All analog blocks share common AVCC0/AVSS0 power domains and are calibrated at factory - enabling accurate sensor interfacing, actuator control, and thermal monitoring directly within the R7FA4E2B93CBC#BC0 without external signal conditioning.