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Renesas R7FA4M3AE2CBM#BC0

Part No.:
R7FA4M3AE2CBM#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LFBGA
Datasheet:
AetrixR7FA4M3AE2CBM#BC0.pdf
Description:
MCU RA4 ARM CM33 100MHZ 768K/128
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,080

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Product details

Overview

R7FA4M3AE2CBM from Renesas Electronics is a 32-bit Arm Cortex-M33 microcontroller operating at up to 100 MHz, featuring 768 KB code flash, 8 KB data flash, and 128 KB SRAM with ECC/parity support. It integrates USB 2.0 Full-Speed, SDHI, Quad SPI, dual CAN, dual 12-bit ADCs (5 Msps interleaved), dual 12-bit DACs, CTSU, RTC with VBATT backup, and Secure Crypto Engine 9 with AES/RSA/ECC/SHA256 - deployed in industrial HMI, secure IoT gateways, and motor control systems.

For engineers reviewing the R7FA4M3AE2CBM datasheet, R7FA4M3AE2CBM pinout, R7FA4M3AE2CBM application, or R7FA4M3AE2CBM equivalent, key selection considerations include its 144-pin BGA package (PLBG0144KB-A), -40°C to +85°C temperature grade, TrustZone-enabled secure boot, QSPI interface for external XIP flash, and dual CAN 2.0B support for automotive body electronics and industrial fieldbus nodes.

Technical Context

The R7FA4M3AE2CBM implements Armv8-M with TrustZone, enabling hardware-isolated secure and non-secure execution environments. Its memory subsystem includes 768 KB code flash with background SWAP operation, 8 KB data flash rated for 100,000 P/E cycles, and 128 KB SRAM with configurable parity or ECC protection.

Peripherals are orchestrated via Event Link Controller (ELC) for CPU-free inter-module triggering, supported by 8-channel DMAC and DTC for autonomous data movement. Security is enforced through SCE9 crypto accelerators, tamper-detect pins, and lifecycle management - all coordinated under TrustZone's memory and peripheral attribution model.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M33 @ 100 MHz with TrustZone and MPU_S/MPU_NS (8 regions each)
Memory768 KB code flash (SWAP/background operation), 8 KB data flash (100k P/E), 128 KB SRAM (ECC/parity selectable)
ConnectivityDual CAN 2.0B, USB 2.0 FS (host/device), SDHI (SD/SDHC/SDXC), QSPI (XIP-capable), SCI × 6, IIC × 2, SPI × 1
AnalogADC12 × 2 (12-bit, 5 Msps interleaved, 19 total channels), DAC12 × 2, TSN, VREFH/VREFL per unit
TimersGPT32 × 4, GPT16 × 4, AGT × 6, RTC with calendar (2000–2099), WDT/IWDT
SecuritySCE9 (AES-128/256, RSA-2048/3072, ECC-P256/P384, SHA224/256), 128-bit UID, tamper pins × 3
Package & Temp144-pin FBGA (7 mm × 7 mm, 0.50 mm pitch), operating range: -40°C to +85°C

Pinout & Package

Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A footprint (7 mm × 7 mm, 0.50 mm pitch), RoHS-compliant Sn terminal finish.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated analog/digital power domains; AVCC0/AVSS0 isolate ADC/DAC reference paths
USB_DP / USB_DMUSB 2.0 FS differential pairIntegrated transceiver - no external PHY required; supports host/device mode with 10-pipe endpoint buffer
CRX0/CTX0, CRX1/CTX1CAN bus interfacesTwo independent ISO 11898-1 compliant controllers; require external transceivers (e.g., TJA1042)
QSPCLK / QIO0–QIO3Quad SPI clock & data linesEnables XIP from serial NOR flash; supports single/dual/quad I/O modes with configurable latency
SD0CLK / SD0CMD / SD0DAT0–7SD/MMC host interfaceSupports 1-/4-bit SD/SDHC/SDXC and eMMC 4.51; requires SD HALA license for SD-compliant products
AN000–AN011, AN100–AN109Analog inputs19 total ADC input pins across two units; shared pins (e.g., AN000/AN100) allow simultaneous sampling
DA0 / DA1DAC outputs12-bit voltage-output DACs with internal reference options; usable for sensor calibration or analog actuator control
TS0–TS19Capacitive touch sense inputsCTSU supports up to 20 electrodes; operates with self- or mutual-capacitance measurement and noise rejection

Key Features

FeatureDesign Value
TrustZone + SCE9 co-processingHardware-enforced secure boot, encrypted firmware updates, and side-channel resistant crypto operations without CPU overhead
Background SWAP flashEnables seamless firmware updates: new image written to inactive bank while active bank executes - zero downtime
ELC-driven peripheral chainingAllows ADC conversion trigger → DMA transfer → GPT PWM update without CPU intervention - deterministic real-time response
VBATT-backed RTC & SOSCMaintains calendar time and sub-clock oscillator during main power loss using coin-cell battery on VBATT pin
5-V tolerant I/O (21 pins)Interfacing directly with legacy 5-V logic or sensors without level shifters - reduces BOM and layout complexity

Applications

Industrial HMI PanelSecure Edge Gateway

Use Scenario: Touch-enabled factory operator interface with real-time diagnostics and over-the-air firmware updates.

IC Role / Device Role / Timing Role: Main application processor running FreeRTOS; CTSU handles multi-touch detection; RTC maintains audit timestamps; USBFS enables field service tooling.

Use Value: TrustZone isolates UI rendering from secure boot and SCE9-managed key storage - preventing credential leakage during UI compromise.

Use Scenario: Protocol-agnostic industrial gateway aggregating Modbus RTU, CANopen, and BLE sensor data before TLS-encrypted cloud upload.

IC Role / Device Role / Timing Role: Central protocol translator and security anchor; dual CAN interfaces connect to PLC networks; SDHI logs events to removable media.

Use Value: SCE9 accelerates TLS handshake and AES-GCM encryption; QSPI boots from encrypted external flash - meeting IEC 62443-3-3 SL2 requirements.

BLDC Motor ControllerSmart Energy Meter

Use Scenario: 3-phase inverter control for HVAC compressors with Hall-effect commutation and current sensing.

IC Role / Device Role / Timing Role: Real-time motion controller; GPT32 generates synchronized 3-phase PWM; ADC12 samples phase currents at 5 Msps interleaved rate.

Use Value: ELC links ADC end-of-conversion to GPT reload - achieving <100 ns jitter between sampling and PWM update for precise torque regulation.

Use Scenario: Revenue-grade meter with anti-tampering features, metrology calculations, and secure remote firmware validation.

IC Role / Device Role / Timing Role: Metrology co-processor and security root of trust; TSN monitors die temperature for thermal derating; tamper pins detect enclosure breach.

Use Value: Data flash stores calibrated metrology coefficients with 100,000-cycle endurance; SCE9 signs firmware images to prevent unauthorized updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA4M3AF3CBM1 MB code flash, extended temp (-40°C to +105°C), same 144-pin BGA packageRequired for high-temp industrial drives or automotive under-hood modulesSelect when >768 KB flash or >85°C ambient is mandatory; identical pinout and peripheral set
R7FA6M3AH3CFBArm Cortex-M33 @ 120 MHz, 2 MB flash, 384 KB SRAM, added Ethernet MAC and larger QSPI interfaceSuitable for gateway-class devices needing wired connectivity and higher throughputChoose for designs requiring 10/100 Ethernet or >1 MB code space; LQFP-144 package differs mechanically

Compared with R7FA4M3AE2CBM, R7FA4M3AF3CBM offers higher flash density and extended temperature range in identical packaging, while R7FA6M3AH3CFB adds Ethernet and performance headroom at the cost of larger footprint and different package - making R7FA4M3AE2CBM optimal for cost-sensitive, thermally constrained embedded control with balanced peripheral integration.

Availability

R7FA4M3AE2CBM is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and BLDC motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R7FA4M3AE2CBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for industrial, automotive, and enterprise markets.

The RA4M3 Group targets mid-range embedded applications demanding security, connectivity, and analog integration - designed specifically for industrial automation, IoT edge nodes, and human-machine interfaces where TrustZone, SCE9, and rich peripheral sets reduce system-level design effort.

FAQ

What is the maximum operating frequency and core architecture of the R7FA4M3AE2CBM?

The R7FA4M3AE2CBM features an Arm Cortex-M33 core operating at a maximum frequency of 100 MHz. It implements the Armv8-M architecture with the Security Extension (TrustZone), including separate Secure and Non-secure Memory Protection Units (MPU_S and MPU_NS), each supporting eight memory regions. The core also integrates CoreSight ETM-M33 for instruction trace and dual SysTick timers - one for each security state - driven by either LOCO or the system clock.

Does the R7FA4M3AE2CBM support secure firmware updates and cryptographic acceleration?

Yes, the R7FA4M3AE2CBM integrates the Secure Crypto Engine 9 (SCE9) with hardware-accelerated AES-128/256, RSA-2048/3072, ECC-P256/P384, and SHA224/256. Combined with Arm TrustZone, it enables secure boot, encrypted firmware updates, and key management with tamper detection. The SCE9 offloads crypto operations from the CPU, and the 128-bit unique ID supports device authentication - all essential for implementing FIPS 140-2 Level 1 or IEC 62443-3-3 SL2 compliance in the R7FA4M3AE2CBM.

What are the memory resources available on the R7FA4M3AE2CBM?

The R7FA4M3AE2CBM provides 768 KB of on-chip code flash memory with background SWAP operation for seamless firmware updates, 8 KB of data flash memory rated for 100,000 program/erase cycles, and 128 KB of SRAM with selectable parity or Error Correction Code (ECC) protection. Additionally, it includes 1 KB of standby SRAM powered by VBATT, and option-setting memory that defines reset behavior - all accessible via the MCU's unified memory map and managed under TrustZone security attribution.

Which communication interfaces does the R7FA4M3AE2CBM support for industrial connectivity?

The R7FA4M3AE2CBM supports multiple industrial-grade interfaces: dual CAN 2.0B controllers (requiring external transceivers), USB 2.0 Full-Speed (host/device), SD/MMC Host Interface (SD/SDHC/SDXC compliant), Quad SPI (XIP-capable), six Serial Communications Interfaces (SCI) with UART/SPI/IIC/Manchester modes, two I2C buses, one SPI channel, and Serial Sound Interface Enhanced (SSIE) for audio. These enable robust fieldbus integration, removable media logging, and high-bandwidth peripheral expansion in the R7FA4M3AE2CBM.

What analog and timing peripherals are integrated into the R7FA4M3AE2CBM?

The R7FA4M3AE2CBM integrates two 12-bit ADC units (ADC12) capable of 5 Msps interleaved sampling across 19 total input channels, two 12-bit DAC outputs (DAC12), an on-die temperature sensor (TSN), and a Realtime Clock (RTC) with calendar support (2000–2099) and VBATT backup. Timing resources include four 32-bit General PWM Timers (GPT32), four 16-bit GPT16 units, six Low Power Asynchronous General Purpose Timers (AGT), plus WDT and IWDT - all synchronized via the Event Link Controller (ELC) for deterministic, CPU-free operation in the R7FA4M3AE2CBM.

R7FA4M3AE2CBM#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LFBGA
Series:
RA4M3
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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All R7FA4M3AE2CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA4M3AE2CBM#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA4M3AE2CBM#BC0?

All R7FA4M3AE2CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA4M3AE2CBM#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA4M3AE2CBM#BC0 part is unused and in its original packaging.

Return procedure for R7FA4M3AE2CBM#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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