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Renesas R7FA4M3AE3CBQ#BC0
- Part No.:
- R7FA4M3AE3CBQ#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LFBGA
- Datasheet:
-
R7FA4M3AE3CBQ#BC0.pdf
- Description:
- MCU RA4 ARM CM33 100MHZ 768K/128
- Quantity:
- Payment:
- Shipping:
Inventory:3,016
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Product details
Overview
R7FA4M3AE3CBQ#BC0 from Renesas is a 100 MHz Arm Cortex-M33 microcontroller with 768 KB code flash, 8 KB data flash, 128 KB SRAM (with ECC), USB 2.0 Full-Speed, dual CAN, SDHI, QSPI, and integrated Secure Crypto Engine + TrustZone for secure embedded control in industrial HMI and connected edge devices.
For engineers reviewing the R7FA4M3AE3CBQ#BC0 datasheet, R7FA4M3AE3CBQ#BC0 pinout, R7FA4M3AE3CBQ#BC0 application, or R7FA4M3AE3CBQ#BC0 equivalent, key selection considerations include its 64-pin BGA package, -40°C to +105°C operation, dual 12-bit ADCs (5 Msps interleaved), CTSU for touch interfaces, and hardware-accelerated AES/RSA/ECC cryptography.
Technical Context
The R7FA4M3AE3CBQ#BC0 implements Armv8-M with TrustZone, enabling secure/non-secure world isolation across flash, SRAM, and peripherals - with up to three secure regions in code flash and two in data flash. Its Secure Crypto Engine 9 supports AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, and SHA-224/256 with tamper detection and 128-bit unique ID.
It integrates dual 12-bit ADC units (ADC12) with up to 19 total analog input channels, 12-channel unit 0 and 10-channel unit 1, sharing three pins (AN000/AN100, AN001/AN101, AN002/AN102); DAC12 × 2 provide precision analog output, and CTSU enables 20-channel capacitive touch sensing without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 100 MHz max - delivers deterministic real-time performance with TrustZone-enforced security partitioning. |
| Memory | 768 KB code flash + 8 KB data flash + 128 KB SRAM with ECC - supports background programming, SWAP operations, and robust data retention. |
| Analog | ADC12 × 2 (12-bit, 5 Msps interleaved) + DAC12 × 2 + TSN - enables high-fidelity sensor acquisition and closed-loop analog control. |
| Connectivity | CAN × 2 (ISO 11898-1 compliant), USBFS (host/device), SDHI, QSPI, SCI × 6, IIC × 2, SPI × 1, SSIE - supports industrial fieldbus, memory expansion, and audio I/O. |
| Security | Secure Crypto Engine 9 + Arm TrustZone + tamper pins + lifecycle management - provides certified secure element functionality for firmware signing and key storage. |
| Package & Temp | 64-pin FBGA (6 mm × 6 mm, 0.65 mm pitch), -40°C to +105°C - suitable for compact, thermally demanding industrial and automotive-adjacent applications. |
| Power | VCC = 2.7–3.6 V; includes VBATT backup for RTC/SOSC; LVD with three thresholds (LVD0/LVD1/LVD2) - ensures reliable operation across wide supply and battery-backed scenarios. |
Pinout & Package
64-pin Fine-Pitch Ball Grid Array (FBGA) package, 6 mm × 6 mm, 0.65 mm ball pitch, Pb-free (Sn) terminal finish. Pin count: 45 I/O pins, 1 input-only pin, 46 pull-up resistors, 45 N-ch open-drain outputs, 9 pins 5-V tolerant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog (AVCC0/AVSS0) and USB (VCC_USB/VSS_USB) domains ensure noise isolation for mixed-signal and high-speed interfaces. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; enables precise timing for USB, CAN, and real-time control loops. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar operation and low-power wake-up timing. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver eliminates external PHY; supports host/device mode with 10-pipe endpoint buffer. |
| CRX0 / CTX0, CRX1 / CTX1 | CAN bus transceiver interfaces | Two independent CAN controllers compliant with ISO 11898-1; require external transceivers for physical layer. |
| QSPCLK / QIO0–QIO3 / QSSL | Quad SPI bus signals | Direct interface to serial flash/FeRAM/EEPROM; supports XIP and high-bandwidth firmware/data loading. |
| SD0CLK / SD0CMD / SD0DAT0–3 | SD/MMC 4-bit host interface | Enables direct attachment of SDHC/SDXC cards or eMMC 4.51 devices for local data logging or firmware updates. |
| TS0–TS19 / TSCAP | Capacitive touch sensing inputs | CTSU supports up to 20 self- or mutual-capacitance channels; TSCAP supplies secondary drive voltage for enhanced SNR. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone + SCE9 | Hardware-enforced secure boot, encrypted firmware update, and isolated key storage - meets PSA Level 2 and IEC 62443 requirements. |
| ADC12 interleaving | 5 Msps aggregate sampling rate across two 12-bit units - enables high-resolution motor current sensing or multi-sensor fusion. |
| GPT32 × 4 + GPT16 × 4 | Eight independent PWM timers with complementary outputs and dead-time insertion - supports 3-phase BLDC/PMSM motor drives. |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining (e.g., ADC conversion → DMA transfer → interrupt) - eliminates CPU polling and reduces latency. |
| AGT × 6 | Six ultra-low-power asynchronous timers driven by LOCO (32.768 kHz) - ideal for periodic wake-up, pulse counting, or battery monitoring in standby modes. |
| RTC with VBATT | Calendar mode (2000–2099) + binary counter + battery-backed registers - maintains time/date during main power loss without external components. |
Applications
| Industrial HMI Panel | Smart Energy Gateway |
|---|---|
|
Use Scenario: Touch-enabled control panel for PLCs, HMIs, and building automation systems operating in harsh environments (-40°C to +105°C). IC Role / Device Role / Timing Role: Main application processor handling GUI rendering, capacitive touch decoding (CTSU), real-time CAN/USB communication, and secure firmware updates. Use Value: Integrated CTSU eliminates external touch controller ICs; TrustZone isolates UI code from secure boot and crypto operations; QSPI enables fast OTA firmware loading from serial flash. |
Use Scenario: DIN-rail mounted gateway aggregating data from smart meters, inverters, and sensors via CAN, RS-485 (SCI), and SD card logging. IC Role / Device Role / Timing Role: Central connectivity hub managing dual CAN buses (metering + PV), USB host for configuration, SDHI for local data buffering, and RTC for time-stamped event logging. Use Value: Dual CAN controllers reduce external component count; SDHI supports FAT32-formatted cards for field-deployable log export; VBATT-backed RTC ensures accurate timestamping during brownouts. |
| Secure Edge Node | Motor Control Module |
|
Use Scenario: Tamper-resistant IoT node for remote monitoring in critical infrastructure, requiring cryptographic attestation and firmware integrity verification. IC Role / Device Role / Timing Role: Secure root-of-trust executing verified bootloader, SCE9-accelerated TLS handshake, and TrustZone-isolated sensor data processing. Use Value: Hardware AES/RSA acceleration cuts TLS handshake time by >80% vs. software-only; tamper pins detect physical intrusion attempts; 128-bit unique ID enables device identity binding. |
Use Scenario: Compact BLDC motor driver for HVAC fans, pumps, or robotics where space, thermal constraints, and EMI immunity are critical. IC Role / Device Role / Timing Role: Real-time motor controller generating 3-phase PWM (GPT), sampling current/voltage (ADC12), and communicating status over CAN. Use Value: GPT32 timers with complementary outputs and dead-time control enable precise gate driving; interleaved ADC achieves 5 Msps for high-bandwidth current loop sampling; 105°C rating supports enclosed motor housing operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA4M3AF3CBQ#BC0 | 1 MB code flash (vs. 768 KB), same 64-pin BGA, identical peripherals and security features. | Preferred when firmware image size exceeds 768 KB or future-proofing for feature expansion is required. | Select R7FA4M3AF3CBQ#BC0 only if additional flash capacity is confirmed necessary; otherwise, R7FA4M3AE3CBQ#BC0 offers optimal cost/performance balance. |
| R7FA6M3AH3CFB#AA0 | Same RA6M3 family, 120 MHz Cortex-M33, 2 MB flash, 384 KB SRAM, but 144-pin LQFP - no pin compatibility. | Targeted at higher-performance applications needing more memory bandwidth, larger code footprint, or additional I/O (109 pins vs. 45). | R7FA6M3AH3CFB#AA0 is not a drop-in replacement; requires PCB redesign but suits applications scaling beyond R7FA4M3AE3CBQ#BC0's memory and I/O limits. |
Compared with R7FA4M3AF3CBQ#BC0, the R7FA4M3AE3CBQ#BC0 trades 256 KB flash for lower cost and identical security/peripheral integration; versus R7FA6M3AH3CFB#AA0, it offers smaller footprint and lower power at reduced compute headroom - making it optimal for space-constrained, thermally sensitive industrial nodes.
Availability
R7FA4M3AE3CBQ#BC0 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, secure edge nodes, and motor control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA4M3AE3CBQ#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA4M3 group targets secure, high-integration industrial and IoT edge applications - combining Arm Cortex-M33 performance, TrustZone security, and rich analog/connectivity peripherals in compact packages like the R7FA4M3AE3CBQ#BC0.
FAQ
What is the maximum operating frequency and core architecture of the R7FA4M3AE3CBQ#BC0?
The R7FA4M3AE3CBQ#BC0 features an Arm Cortex-M33 core operating at up to 100 MHz, based on the Armv8-M architecture with Security Extension (TrustZone). It includes dual SysTick timers (secure and non-secure), CoreSight ETM-M33 trace, and MPU with eight regions per security state - enabling deterministic real-time execution and hardware-enforced security partitioning within the R7FA4M3AE3CBQ#BC0.
Does the R7FA4M3AE3CBQ#BC0 support hardware cryptography acceleration?
Yes, the R7FA4M3AE3CBQ#BC0 integrates the Secure Crypto Engine 9 (SCE9), which provides hardware acceleration for AES-128/256, RSA-2048/4096, ECC (NIST P-256/P-384), SHA-224/256, and GHASH. It also includes tamper detection pins, power analysis resistance, and a 128-bit unique ID - all coordinated with Arm TrustZone to deliver certified secure element functionality in the R7FA4M3AE3CBQ#BC0.
What analog peripherals are included in the R7FA4M3AE3CBQ#BC0?
The R7FA4M3AE3CBQ#BC0 includes two independent 12-bit successive approximation ADC units (ADC12) with up to 19 total analog input channels (12 in unit 0, 10 in unit 1, sharing three pins), two 12-bit DAC units (DAC12), and an on-die temperature sensor (TSN) routed to both ADC units. These analog resources are fully supported in the 64-pin BGA package and operate across the full -40°C to +105°C range of the R7FA4M3AE3CBQ#BC0.
Which communication interfaces does the R7FA4M3AE3CBQ#BC0 support?
The R7FA4M3AE3CBQ#BC0 supports SCI × 6 (UART, SPI, I²C, smart card), IIC × 2, SPI × 1, USB 2.0 Full-Speed (host/device), CAN × 2 (ISO 11898-1), SDHI, QSPI, SSIE (I²S/TDM), and serial sound interface. All are implemented in silicon and validated for the 64-pin BGA variant - no interface is disabled or shared in the R7FA4M3AE3CBQ#BC0 configuration.
What is the package type and pin count of the R7FA4M3AE3CBQ#BC0?
The R7FA4M3AE3CBQ#BC0 uses a 64-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 6 mm × 6 mm with 0.65 mm ball pitch. It provides 45 general-purpose I/O pins, 9 of which are 5-V tolerant, along with dedicated power, clock, analog, USB, CAN, QSPI, SDHI, and CTSU pins - all documented in the official R7FA4M3AE3CBQ#BC0 pin assignment tables.
R7FA4M3AE3CBQ#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LFBGA
- Series:
- RA4M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA4M3AE3CBQ#BC0 FAQ
1.How can I place an order for R7FA4M3AE3CBQ#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA4M3AE3CBQ#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA4M3AE3CBQ#BC0 reliable?
The price and inventory of R7FA4M3AE3CBQ#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA4M3AE3CBQ#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA4M3AE3CBQ#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA4M3AE3CBQ#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA4M3AE3CBQ#BC0?
R7FA4M3AE3CBQ#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA4M3AE3CBQ#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA4M3AE3CBQ#BC0?
For technical support, including R7FA4M3AE3CBQ#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA4M3AE3CBQ#BC0 requirements.
6.How does Aetrix verify that R7FA4M3AE3CBQ#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA4M3AE3CBQ#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA4M3AE3CBQ#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA4M3AE3CBQ#BC0?
All R7FA4M3AE3CBQ#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA4M3AE3CBQ#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA4M3AE3CBQ#BC0 part is unused and in its original packaging.
Return procedure for R7FA4M3AE3CBQ#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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