Renesas R7FA4M3AF3CBM#BC0
- Part No.:
- R7FA4M3AF3CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA4M3AF3CBM#BC0.pdf
- Description:
- MCU RA4 ARM CM33 100MHZ 1MB/128K
- Quantity:
- Payment:

- Shipping:

Inventory:2,948
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA4M3AF3CBM from Renesas Electronics is a 100 MHz Arm Cortex-M33 microcontroller with 1 MB code flash, 8 KB data flash, and 128 KB SRAM (with ECC), integrated USB 2.0 Full-Speed, SDHI, QSPI, dual CAN, and Secure Crypto Engine for secure IoT edge nodes requiring real-time control, connectivity, and tamper resistance.
For engineers reviewing the R7FA4M3AF3CBM datasheet, R7FA4M3AF3CBM pinout, R7FA4M3AF3CBM application, or R7FA4M3AF3CBM equivalent, this page delivers verified specifications, package mapping to 144-pin FBGA (PLBG0144KB-A), security architecture details, and validated alternative MCUs for industrial HMI, secure gateways, and motor control designs.
Technical Context
The R7FA4M3AF3CBM implements Arm TrustZone for hardware-isolated secure/non-secure execution environments, with up to three code flash regions, two data flash regions, and three SRAM regions individually attributed. Its Secure Crypto Engine 9 accelerates AES, RSA, ECC, SHA256, and GHASH operations while supporting 128-bit unique ID and tamper detection via dedicated pins.
It integrates dual 12-bit ADCs (5 Msps interleaved), dual 12-bit DACs, CTSU for 20-channel capacitive touch, and six AGT timers for low-power event timing. Clock management includes PLL/PLL2, HOCO/MOCO/LOCO oscillators with trim, and CAC for frequency accuracy validation - all operating across −40°C to +105°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 100 MHz max; supports TrustZone security extension and PMSAv8 MPU with 8 secure + 8 non-secure regions. |
| Memory | 1 MB code flash (background/SWAP operation), 8 KB data flash (100k P/E cycles), 128 KB SRAM with ECC for fault-tolerant operation. |
| Security | Secure Crypto Engine 9 + TrustZone; supports AES/RSA/ECC/SHA256/GHASH; 128-bit UID; 3 tamper pins; secure pin multiplexing. |
| Connectivity | Dual CAN 2.0A/B, USB 2.0 Full-Speed (host/device), SDHI (SD/SDHC/SDXC), QSPI, 6× SCI, 2× I2C, SPI, SSIE (I2S/TDM), and 2× CAN transceiver interfaces required. |
| Analog & Timers | 2× 12-bit ADC (5 Msps interleaved), 2× 12-bit DAC, temperature sensor; 4× GPT32, 4× GPT16, 6× AGT, RTC with calendar, WDT/IWDT. |
| Package & Environment | 144-pin FBGA (PLBG0144KB-A), 7 mm × 7 mm, 0.50 mm pitch; rated for −40°C to +105°C industrial temperature range. |
| I/O Features | 109 GPIOs, 21× 5-V tolerant, N-ch open-drain outputs, pull-up resistors on 110 pins; supports capacitive touch (CTSU) and battery backup (VBATT). |
Pinout & Package
Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A, 7 mm × 7 mm, 0.50 mm pitch, RoHS-compliant Sn (tin) terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core logic power (2.7–3.6 V); decoupling required per datasheet layout guidelines for noise immunity and stability. |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup memory during main power loss; enables calendar retention and wake-from-standby. |
| USB_DP / USB_DM | USB 2.0 differential data pair | Integrated transceiver supports full-speed (12 Mbps) host/device operation; no external PHY needed. |
| CRX0 / CTX0, CRX1 / CTX1 | CAN bus interface (2 channels) | Requires external CAN transceivers (e.g., TJA1042); compliant with ISO 11898-1 for automotive/industrial noise immunity. |
| QSPCLK / QIO0–QIO3 | Quad SPI clock and data lines | Direct interface to serial flash/FeRAM; supports XIP and high-bandwidth firmware updates without CPU load. |
| SD0CLK / SD0CMD / SD0DAT0–7 | SD/MMC host interface | Supports SD/SDHC/SDXC cards in 1-/4-bit modes; requires SD HALA license compliance for certified host design. |
| TS0–TS19 | Capacitive touch sensing inputs | Connected to CTSU for up to 20-button HMI; enables proximity, swipe, and gesture detection with software calibration. |
| AN000–AN011, AN100–AN109 | Analog input channels | Two independent 12-bit ADC units with shared pins (e.g., AN000/AN100); supports internal temp sensor and VREF monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone + SCE9 Security | Hardware-enforced isolation between secure/non-secure worlds; cryptographic acceleration reduces firmware overhead by >70% vs. software-only AES-256. |
| 128 KB SRAM with ECC | Detects and corrects single-bit errors in real time; prevents silent data corruption in safety-critical control loops and logging buffers. |
| Dual 12-bit ADC at 5 Msps | Interleaved sampling enables simultaneous high-resolution acquisition of motor phase currents and voltage feedback for FOC control. |
| USBFS + SDHI + QSPI Integration | Enables field firmware updates via USB mass storage, local config storage on SD card, and fast boot from external flash - all concurrently active. |
| CTSU with 20 Channels | Eliminates external touch controller IC; supports self-capacitance measurement with <1 pF resolution for robust glass-panel HMI in harsh environments. |
| 6× AGT Low-Power Timers | Independent 16-bit timers running from LOCO (32.768 kHz); maintain precise wake-up intervals during Deep Software Standby with <1 µA current draw. |
Applications
| Industrial HMI Panel | Secure Edge Gateway |
|---|---|
|
Use Scenario: Touch-enabled factory operator interface with real-time diagnostics, alarm logging, and remote configuration via cellular backhaul. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, managing CTSU-based touch UI, SDHI-stored configuration, and USBFS debug port. Use Value: Integrated TrustZone isolates UI firmware from secure credential storage; SCE9 accelerates TLS handshake for encrypted MQTT communication. |
Use Scenario: Field-deployed protocol translator aggregating Modbus RTU sensors and forwarding data via TLS-secured HTTPS to cloud platform. IC Role / Device Role / Timing Role: Secure network edge node performing crypto offload, CAN-to-HTTP bridging, and OTA update verification using code flash SWAP. Use Value: Dual CAN interfaces connect to legacy PLC networks; 1 MB flash stores dual firmware images for safe rollback after signed OTA updates. |
| BLDC Motor Controller | Smart Energy Meter |
|
Use Scenario: 3-phase inverter driving HVAC compressor with field-oriented control, thermal monitoring, and overcurrent protection. IC Role / Device Role / Timing Role: Real-time motor control MCU synchronizing GPT32 PWM outputs, ADC sampling, and AGT-based fault response within 1 µs jitter. Use Value: Interleaved ADC captures simultaneous phase currents; GTOUUP/GTOULO pins drive gate drivers directly with dead-time insertion in hardware. |
Use Scenario: Revenue-grade meter measuring voltage/current harmonics, calculating kWh/kVARh, and reporting via NB-IoT with tamper detection. IC Role / Device Role / Timing Role: Metrology co-processor interfacing isolated sigma-delta ADCs, managing RTC calendar, and enforcing secure boot via SCE9 key vault. Use Value: Tamper pins detect enclosure breach; VBATT-backed RTC maintains billing timestamp integrity during mains outage; ECC SRAM prevents metering data corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA4M3AF2CBM | Same core, peripherals, and package; rated for −40°C to +85°C (vs. +105°C for R7FA4M3AF3CBM); identical flash/SRAM/security features. | Suitable for commercial/office environments; not qualified for under-hood automotive or high-temp industrial enclosures. | Select R7FA4M3AF2CBM when ambient operating temperature remains ≤85°C and cost optimization is prioritized. |
| R7FA6M3AF3CFB | RA6M3 family successor: 200 MHz Cortex-M33, 2 MB flash, enhanced SCE10, but uses 144-pin LQFP (PLQP0144KA-B), not FBGA; no VBATT support. | Higher performance for AI inference at edge; lacks battery-backed RTC and compact FBGA footprint critical for space-constrained gateways. | Choose R7FA6M3AF3CFB only if 200 MHz throughput and larger flash outweigh need for VBATT, thermal grade, and BGA density. |
Compared with R7FA4M3AF2CBM, the R7FA4M3AF3CBM adds extended temperature qualification essential for industrial drives and outdoor gateways; versus R7FA6M3AF3CFB, it retains VBATT, smaller FBGA, and proven thermal reliability at lower clock speed and cost.
Availability
R7FA4M3AF3CBM is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and BLDC motor controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.
Supply support for R7FA4M3AF3CBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a Japanese semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.
The RA4M3 group targets secure, high-integration industrial and IoT edge devices, combining Arm TrustZone, crypto acceleration, and rich analog/peripheral sets for scalable, certified designs.
FAQ
What is the maximum operating temperature rating for the R7FA4M3AF3CBM?
The R7FA4M3AF3CBM is qualified for industrial operation from −40°C to +105°C ambient temperature. This extended range is enabled by its 144-pin FBGA package (PLBG0144KB-A) and internal thermal design, making it suitable for under-hood automotive modules, factory-floor controllers, and outdoor gateway enclosures where passive cooling dominates.
Does the R7FA4M3AF3CBM include an integrated USB transceiver?
Yes, the R7FA4M3AF3CBM integrates a full-speed USB 2.0 transceiver compliant with Universal Serial Bus Specification 2.0. Pins USB_DP and USB_DM connect directly to the USB connector; no external PHY is required. It supports both host and device roles, with up to 10 configurable pipes and internal buffer memory.
How many analog input channels does the R7FA4M3AF3CBM support, and what is their resolution?
The R7FA4M3AF3CBM integrates two independent 12-bit successive approximation ADC units (ADC12). Unit 0 supports up to 12 analog inputs, Unit 1 supports up to 10, with three shared pins (AN000/AN100, etc.), yielding up to 19 total analog input pins. Interleaved operation achieves 5 Msps aggregate sampling rate.
What security features are implemented in hardware on the R7FA4M3AF3CBM?
The R7FA4M3AF3CBM implements Arm TrustZone for hardware-isolated secure/non-secure memory regions, a dedicated Secure Crypto Engine 9 (SCE9) accelerating AES/RSA/ECC/SHA256, 128-bit unique ID, three tamper detection pins, secure pin multiplexing, and lifecycle management - all verified in silicon, not firmware-only.
Is the R7FA4M3AF3CBM pin-compatible with other RA4M3 variants like the R7FA4M3AF3CFB?
No, the R7FA4M3AF3CBM (144-pin FBGA) is not pin-compatible with the R7FA4M3AF3CFB (144-pin LQFP). While functionally identical and software-compatible, their physical packages differ: FBGA uses ball pads in 7 mm × 7 mm grid; LQFP uses gull-wing leads in 20 mm × 20 mm outline. PCB layout and thermal design must be re-validated for each package.
R7FA4M3AF3CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA4M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA4M3AF3CBM#BC0 FAQ
1.How can I place an order for R7FA4M3AF3CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA4M3AF3CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA4M3AF3CBM#BC0 reliable?
The price and inventory of R7FA4M3AF3CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA4M3AF3CBM#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA4M3AF3CBM#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA4M3AF3CBM#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA4M3AF3CBM#BC0?
R7FA4M3AF3CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA4M3AF3CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA4M3AF3CBM#BC0?
For technical support, including R7FA4M3AF3CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA4M3AF3CBM#BC0 requirements.
6.How does Aetrix verify that R7FA4M3AF3CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA4M3AF3CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA4M3AF3CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA4M3AF3CBM#BC0?
All R7FA4M3AF3CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA4M3AF3CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA4M3AF3CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA4M3AF3CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA4M3AF3CBM#BC0 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

