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Renesas R7FA4M3AF3CBQ#BC0
- Part No.:
- R7FA4M3AF3CBQ#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LFBGA
- Datasheet:
-
R7FA4M3AF3CBQ#BC0.pdf
- Description:
- MCU RA4 ARM CM33 100MHZ 1MB/128K
- Quantity:
- Payment:
- Shipping:
Inventory:3,016
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Product details
Overview
R7FA4M3AF3CBQ#BC0 from Renesas is a 100 MHz Arm Cortex-M33 microcontroller with 1 MB code flash, 8 KB data flash, and 128 KB SRAM (with ECC), integrated USB 2.0 Full-Speed, SDHI, QSPI, dual CAN, and Secure Crypto Engine supporting AES/RSA/ECC/SHA256 - designed for secure industrial HMI and connected edge nodes requiring functional safety and tamper resistance.
For engineers reviewing the R7FA4M3AF3CBQ#BC0 datasheet, R7FA4M3AF3CBQ#BC0 pinout, R7FA4M3AF3CBQ#BC0 application, or R7FA4M3AF3CBQ#BC0 equivalent, key selection considerations include its -40°C to +105°C operation, 64-pin BGA package (6 mm × 6 mm, 0.65 mm pitch), TrustZone-enforced memory partitioning, dual 12-bit ADCs with 5 Msps interleaving, and CTSU-based capacitive touch support.
Technical Context
The R7FA4M3AF3CBQ#BC0 implements Armv8-M with TrustZone, enabling hardware-isolated secure/non-secure execution environments. Its Secure Crypto Engine 9 accelerates AES-128/256, RSA-2048/4096, ECC P-256/P-384, and SHA224/256 with dedicated key management and tamper detection via three dedicated pins.
It integrates dual 12-bit ADCs (ADC12) with up to 19 total analog input channels, 2× DAC12 outputs, temperature sensor (TSN), RTC with calendar and VBATT backup, and six AGT timers for low-power event timing - all operating within 2.7–3.6 V supply across extended temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 100 MHz max - enables real-time deterministic control with TrustZone isolation for secure firmware updates. |
| Memory | 1 MB code flash + 8 KB data flash + 128 KB SRAM with ECC - supports background programming, SWAP operations, and robust runtime error correction. |
| Connectivity | 2× CAN 2.0B, USBFS (host/device), SDHI, QSPI, 6× SCI, 2× IIC, SPI, SSIE - enables multi-protocol industrial fieldbus and memory expansion. |
| Analog | 2× 12-bit ADC12 (5 Msps interleaved), 2× DAC12, TSN - delivers high-fidelity sensor acquisition and analog output for motor control and environmental monitoring. |
| Security | Secure Crypto Engine 9 + Arm TrustZone + tamper pins + lifecycle management - provides certified secure boot, encrypted storage, and physical attack resistance. |
| Package & Temp | 64-pin FBGA (6 mm × 6 mm, 0.65 mm pitch), -40°C to +105°C - suitable for compact, thermally demanding industrial enclosures. |
| I/O | 45 GPIO, 9× 5-V tolerant, N-ch open-drain, pull-up resistors - simplifies interface to legacy 5 V peripherals without level shifters. |
Pinout & Package
64-pin Fine-Pitch Ball Grid Array (FBGA) package, 6 mm × 6 mm body, 0.65 mm ball pitch, PLBG0064JC-A footprint. Complies with JEDEC MO-277.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: digital core (VCC/VSS) and analog (AVCC0/AVSS0) - require separate decoupling per datasheet layout guidelines. |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss - enables calendar retention and wake-from-standby on external events. |
| XCIN / XCOUT | Sub-clock oscillator interface | Connects 32.768 kHz crystal for RTC accuracy and low-power timer operation - essential for time-critical scheduling in Deep Software Standby mode. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver eliminates external PHY - supports device/host modes with 10-pipe endpoint buffer for HID, CDC, or MSC class implementations. |
| CRX0 / CTX0, CRX1 / CTX1 | CAN bus interfaces | Two independent ISO 11898-1 compliant CAN controllers - each requires external transceiver; supports 32 mailboxes with FIFO and standard/extended ID filtering. |
| QSPCLK / QIO0–QIO3 | Quad SPI interface | Direct connection to serial flash/FeRAM - enables XIP execution and fast firmware update over single 4-bit data bus with hardware address translation. |
| TS0–TS19 | Capacitive touch sensing inputs | CTSU-driven electrode connections - supports up to 20 touch buttons/sliders with noise immunity and self-calibration via internal reference. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone partitioning | Three configurable secure regions in code flash, two in data flash, three in SRAM - enforces hardware-enforced separation between secure bootloader and application firmware. |
| Secure Crypto Engine 9 | Hardware-accelerated AES-128/256 encryption/decryption, RSA-2048/4096 signing/verification, and SHA256 hashing - reduces crypto latency by >10× vs software-only implementation. |
| Interleaved ADC sampling | 5 Msps combined throughput using dual ADC12 units - enables simultaneous high-speed acquisition of motor phase currents and voltage feedback signals. |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining without CPU intervention - e.g., ADC conversion completion directly triggers DMA transfer or GPT capture, minimizing interrupt latency. |
| Low-power AGT timers | Six independent 16-bit asynchronous timers clocked by LOCO (32.768 kHz) - sustain precise timing in Deep Software Standby mode with sub-µA current draw. |
Applications
| Industrial HMI Panel | Secure Edge Gateway |
|---|---|
|
Use Scenario: Touch-enabled factory operator interface with real-time diagnostics, local data logging, and OTA firmware validation. IC Role / Device Role / Timing Role: Main application processor executing RTOS, managing CTSU touch response, driving display via SPI/SSIE, and enforcing secure boot before loading UI firmware. Use Value: Integrated TrustZone and SCE9 enable signed firmware verification and encrypted parameter storage - preventing unauthorized configuration changes in regulated environments. |
Use Scenario: Protocol-agnostic field gateway aggregating Modbus RTU, CANopen, and BLE sensor data for cloud upload via cellular/Wi-Fi. IC Role / Device Role / Timing Role: Central protocol translator with dual CAN interfaces, USBFS for local debug, QSPI for firmware storage, and hardware crypto for TLS handshake acceleration. Use Value: Dual CAN + SDHI + USBFS allows concurrent fieldbus communication, local SD card logging, and host-side firmware recovery - eliminating need for companion MCU. |
| Smart Motor Drive Controller | Medical Sensor Hub |
|
Use Scenario: Compact BLDC motor controller with Hall-effect commutation, current sensing, thermal monitoring, and safety shutdown. IC Role / Device Role / Timing Role: Real-time motion controller using GPT32 for 3-phase PWM generation, ADC12 for shunt current sampling, and AGT for thermal watchdog timing. Use Value: Interleaved ADC sampling at 5 Msps captures instantaneous current waveforms; integrated tamper detection disables drive outputs on enclosure breach. |
Use Scenario: Portable patient monitor collecting ECG, temperature, and SpO₂ with local trend analysis and encrypted data export via USB. IC Role / Device Role / Timing Role: Signal acquisition hub with 12-bit ADC12 (ECG channel), TSN (body temp), DAC12 (audio alerts), and USBFS for HIPAA-compliant data transfer. Use Value: On-chip ECC SRAM and SCE9 ensure integrity of stored biometric records; RTC with VBATT maintains accurate timestamps during battery swaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA4M3AF3CFM | Same core, memory, and peripherals but in 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch) - larger footprint, easier rework, no BGA assembly requirement. | Preferred for prototyping, low-volume production, or designs where PCB reflow capability for BGA is unavailable. | Select when manual soldering or test probe access is required; trade-off is 30% larger board area vs R7FA4M3AF3CBQ#BC0. |
| R7FA6M3AF3CFB | RA6M3 family successor: 200 MHz Cortex-M33, 2 MB flash, enhanced SCE10, additional GPT32 channels, and Ethernet MAC - not pin-compatible. | Suitable for next-gen designs needing higher compute headroom, network connectivity, or extended security features beyond RA4M3 scope. | Choose for future-proofing where performance scaling and Ethernet integration justify redesign; not a drop-in replacement. |
Compared with R7FA4M3AF3CFM, the R7FA4M3AF3CBQ#BC0 offers superior board-level density and thermal performance in compact industrial modules, while R7FA6M3AF3CFB provides architectural uplift for bandwidth-intensive applications - neither matches the exact footprint or cost profile of R7FA4M3AF3CBQ#BC0.
Availability
R7FA4M3AF3CBQ#BC0 is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, smart motor drives, medical sensor hubs, and automotive body electronics requiring stable component supply across extended temperature and long product lifecycles.
Supply support for R7FA4M3AF3CBQ#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RA4M3 group targets secure, high-integration industrial and IoT edge applications - combining Arm TrustZone, hardware crypto acceleration, and rich analog/peripheral sets to replace discrete security + MCU combinations.
FAQ
What is the package type and pin count of the R7FA4M3AF3CBQ#BC0?
The R7FA4M3AF3CBQ#BC0 uses a 64-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 6 mm × 6 mm with 0.65 mm ball pitch (PLBG0064JC-A). It provides 45 general-purpose I/O pins, 9 of which are 5-V tolerant, and integrates dedicated tamper detection pins for security-critical deployments. This compact BGA footprint supports high-density PCB layouts in space-constrained industrial modules.
Does the R7FA4M3AF3CBQ#BC0 support hardware cryptographic acceleration?
Yes, the R7FA4M3AF3CBQ#BC0 integrates the Secure Crypto Engine 9 (SCE9), which provides hardware-accelerated AES-128/256, RSA-2048/4096, ECC P-256/P-384, and SHA224/256 operations. It includes dedicated key management, tamper detection via three configurable pins, and power analysis resistance - all coordinated with Arm TrustZone to enforce secure key lifecycle management within the R7FA4M3AF3CBQ#BC0.
What are the supported clock sources for the R7FA4M3AF3CBQ#BC0?
The R7FA4M3AF3CBQ#BC0 supports multiple clock sources: main crystal oscillator (8–24 MHz), sub-clock oscillator (32.768 kHz), high/middle/low-speed on-chip oscillators (HOCO/MOCO/LOCO), IWDT-dedicated 15 kHz oscillator, and dual PLLs. The Clock Frequency Accuracy Measurement Circuit (CAC) validates oscillator stability, and clock trimming is available for HOCO/MOCO/LOCO - ensuring precise timing across voltage and temperature for the R7FA4M3AF3CBQ#BC0's real-time functions.
Can the R7FA4M3AF3CBQ#BC0 operate in extended temperature ranges?
Yes, the R7FA4M3AF3CBQ#BC0 is rated for operation from -40°C to +105°C ambient temperature. This extended grade is validated across all core functions including flash programming, SRAM ECC, USBFS, CAN, and ADC12 performance - making it suitable for under-hood automotive body control, industrial PLCs, and outdoor edge infrastructure where thermal resilience is critical for the R7FA4M3AF3CBQ#BC0.
How does the R7FA4M3AF3CBQ#BC0 handle analog-to-digital conversion?
The R7FA4M3AF3CBQ#BC0 integrates two independent 12-bit successive approximation ADC units (ADC12), supporting up to 19 total analog input channels with shared pins. It achieves 5 Msps combined sampling rate in interleaved mode, includes internal temperature sensor (TSN) and reference voltage inputs (VREFH/VREFL), and supports external trigger initiation - delivering high-fidelity signal acquisition for motor control, sensor fusion, and condition monitoring in the R7FA4M3AF3CBQ#BC0.
R7FA4M3AF3CBQ#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LFBGA
- Series:
- RA4M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA4M3AF3CBQ#BC0 FAQ
1.How can I place an order for R7FA4M3AF3CBQ#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA4M3AF3CBQ#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA4M3AF3CBQ#BC0 reliable?
The price and inventory of R7FA4M3AF3CBQ#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA4M3AF3CBQ#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA4M3AF3CBQ#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA4M3AF3CBQ#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA4M3AF3CBQ#BC0?
R7FA4M3AF3CBQ#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA4M3AF3CBQ#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA4M3AF3CBQ#BC0?
For technical support, including R7FA4M3AF3CBQ#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA4M3AF3CBQ#BC0 requirements.
6.How does Aetrix verify that R7FA4M3AF3CBQ#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA4M3AF3CBQ#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA4M3AF3CBQ#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA4M3AF3CBQ#BC0?
All R7FA4M3AF3CBQ#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA4M3AF3CBQ#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA4M3AF3CBQ#BC0 part is unused and in its original packaging.
Return procedure for R7FA4M3AF3CBQ#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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