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Renesas R7FA6E10D2CFP#BA0

Part No.:
R7FA6E10D2CFP#BA0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR7FA6E10D2CFP#BA0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 512K/256
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,355

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Product details

Overview

R7FA6E10D2CFP from Renesas is a 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 512 KB code flash, 8 KB data flash, 256 KB SRAM with parity, Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI, CAN, and dual 12-bit ADC/DAC - designed for industrial connectivity gateways requiring secure, real-time control and wired/wireless edge node interfacing.

For engineers reviewing the R7FA6E10D2CFP datasheet, R7FA6E10D2CFP pinout, R7FA6E10D2CFP application, or R7FA6E10D2CFP equivalent, this page delivers verified technical context, package-specific pin mapping (100-pin LQFP), TrustZone-enabled security architecture, Ethernet/USB/SDHI peripheral integration, and validated alternative MCUs for scalable RA-family migration paths.

Technical Context

The R7FA6E10D2CFP implements Armv8-M with TrustZone, supporting secure/non-secure execution states, dual MPU instances (8 regions each), and CoreSight ETM-M33 for trace-based debugging. Its memory subsystem includes 512 KB dual-bank flash enabling background programming and SWAP operations, plus 8 KB data flash rated for 100,000 P/E cycles.

Connectivity is centered on RMII-mode Ethernet MAC (ETHERC/EDMAC), USBFS with internal transceiver, SDHI supporting SD/SDHC/SDXC cards, and QSPI for external serial flash. Analog integration comprises 11-channel 12-bit ADC12 and single-channel 12-bit DAC12, both with dedicated reference pins (VREFH0/VREFL0, VREFH/VREFL).

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M33 @ 200 MHz max; supports TrustZone, PMSAv8 MPU, secure/non-secure SysTick timers
Memory 512 KB dual-bank code flash (background/SWAP), 8 KB data flash (100k P/E), 256 KB SRAM with parity
Operating Voltage 2.7–3.6 V; AVCC0/AVSS0 separate analog supply; VBATT-supported RTC backup
Peripherals Ethernet MAC (RMII), USB 2.0 FS (internal transceiver), SDHI, QSPI, CAN 2.0B, 6× SCI, 2× IIC, 2× SPI, SSIE, AGT×6, GPT32×2/GPT16×4
Analog 12-bit ADC12 (11 inputs, VREFH0/VREFL0 referenced), 12-bit DAC12 (1 output, VREFH/VREFL referenced)
Package & Temp 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch); -40°C to +85°C industrial grade

Pinout & Package

Package: 100-pin LQFP (PLQP0100KB-B), 14 mm × 14 mm, 0.5 mm pitch, exposed die pad (recommended to connect to VSS).

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Dual VCC/VSS pairs per quadrant; decoupling required (0.1 µF close to each VCC)
P300/TCK/SWCLK JTAG/SWD debug clock Primary debug interface clock; shared with SWD for reduced pin count
USB_DP / USB_DM USB 2.0 Full-Speed differential pair Integrated transceiver; no external PHY needed; supports host/device mode
RMII0_TXD0/RMII0_TXD1 Ethernet transmit data (RMII) 2-bit parallel RMII interface; requires 50 MHz REF50CK0 reference clock input
AN00–AN10 ADC12 analog inputs 11 dedicated pins; support simultaneous sampling only on selected channels per unit
DA00 DAC12 analog output Single buffered voltage output; referenced to VREFH/VREFL; not rail-to-rail

Key Features

Feature Design Value
TrustZone Security Hardware-enforced isolation between secure/non-secure worlds; configurable flash/SRAM regions; SCE9 provides RNG and unique ID
Dual-Bank Flash Enables over-the-air (OTA) firmware updates without halting operation; SWAP mode allows atomic bank switching
Ethernet + USB Coexistence Independent DMA paths (EDMAC + USBFS buffers) prevent bus contention during concurrent high-throughput transfers
Low-Power Timers 6× AGT timers operate asynchronously from main clock; retain function in Deep Software Standby with VBATT
Flexible Clock System Multiple on-chip oscillators (HOCO/MOCO/LOCO), PLL/PLL2, CAC for frequency accuracy monitoring, and clock trim

Applications

Industrial Gateway Smart Energy Meter

Use Scenario: Aggregating Modbus RTU, CAN, and pulse inputs from field devices into a unified Ethernet/USB-connected edge node.

IC Role / Device Role / Timing Role: Central controller executing protocol translation, real-time scheduling via GPT32, and secure OTA updates via dual-bank flash.

Use Value: Integrated ETHERC/EDMAC and USBFS eliminate external PHYs; TrustZone isolates metering firmware from communication stacks.

Use Scenario: High-accuracy energy measurement with tamper detection, time-of-use billing, and remote firmware update capability.

IC Role / Device Role / Timing Role: Realtime metering engine using ADC12 oversampling, RTC calendar mode with VBATT backup, and secure boot validation.

Use Value: 12-bit ADC12 with programmable sampling windows ensures ±0.5% metering accuracy; data flash stores calibration constants across 100k cycles.

Building Automation Controller Medical Data Logger

Use Scenario: HVAC control unit managing BACnet MS/TP, LonWorks, and analog sensor inputs while reporting to cloud via Ethernet.

IC Role / Device Role / Timing Role: Deterministic scheduler using ELC-triggered GPT16 for PWM fan control and AGT for low-power wake-up events.

Use Value: 75 GPIOs (14× 5-V tolerant) interface legacy 24 V sensors; SDHI enables local logging to SD card before upload.

Use Scenario: Portable patient monitor recording ECG, temperature, and SpO₂ with encrypted storage and USB-C host upload.

IC Role / Device Role / Timing Role: Secure data acquisition hub using ADC12 with noise filtering, DAC12 for reference generation, and USBFS for certified medical device enumeration.

Use Value: TrustZone isolates cryptographic keys in secure world; 256 KB SRAM with parity ensures data integrity during burst acquisition.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6E10F2CFP 1 MB code flash (vs. 512 KB), same peripherals, package, and pinout Required for larger firmware images or dual-application partitioning (e.g., secure + non-secure OS) Select when firmware size exceeds 512 KB or future scalability to 1 MB is planned
R7FA6M20D2CFP Same flash/SRAM, adds FPU and DSP extensions; removes Ethernet and SDHI; retains USBFS, CAN, QSPI Better suited for motor control or audio processing where floating-point math dominates over wired connectivity Choose when computational throughput > connectivity density; verify peripheral subset matches system needs

Compared with R7FA6E10F2CFP, the R7FA6E10D2CFP reduces flash capacity but maintains identical peripheral set, security features, and package compatibility-ideal for cost-optimized Ethernet/USB edge nodes. Against R7FA6M20D2CFP, it trades FPU/DSP for Ethernet/SDHI, prioritizing infrastructure connectivity over algorithmic intensity.

Availability

R7FA6E10D2CFP is available at Aetrix Electronics and suitable for industrial gateways, smart meters, building automation controllers, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for R7FA6E10D2CFP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The R7FA6E10D2CFP belongs to the RA6E1 group - a cost-optimized, high-integration Arm Cortex-M33 MCU family targeting secure, Ethernet- and USB-enabled industrial edge devices with minimal BOM overhead.

FAQ

What is the maximum operating frequency of the R7FA6E10D2CFP?

The R7FA6E10D2CFP operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6E10D2CFP maintains full peripheral functionality-including Ethernet MAC, USBFS, and SDHI-at this frequency, with timing validated across the full -40°C to +85°C temperature range.

Does the R7FA6E10D2CFP support TrustZone security features?

Yes, the R7FA6E10D2CFP implements Arm TrustZone for Armv8-M, enabling hardware-isolated secure and non-secure execution states. It supports up to three or six configurable regions in code flash (depending on bank mode), two in data flash, and three in SRAM. Peripheral attribution (e.g., ETHERC, USBFS) is individually assignable to secure or non-secure worlds - a capability confirmed in the R01DS0392EJ0140 datasheet Section 1.1 and Table 1.13.

What package type does the R7FA6E10D2CFP use?

The R7FA6E10D2CFP uses a 100-pin LQFP package (PLQP0100KB-B), measuring 14 mm × 14 mm with 0.5 mm pitch and an exposed die pad recommended for connection to VSS. This matches the pin assignment shown in Figure 1.3 of the R01DS0392EJ0140 datasheet and supports 75 general-purpose I/O pins, including 14 with 5-V tolerance - critical for interfacing with legacy industrial sensors and actuators.

Can the R7FA6E10D2CFP interface directly with an Ethernet PHY?

Yes, the R7FA6E10D2CFP integrates an Ethernet MAC (ETHERC) compliant with IEEE 802.3 and supports RMII physical layer interface. It requires an external PHY connected via RMII0_TXD0/RMII0_TXD1, RMII0_RXD0/RMII0_RXD1, RMII0_TXD_EN, RMII0_CRS_DV, RMII0_RX_ER, and REF50CK0. No external MAC is needed - the ETHERC links directly to the EDMAC for zero-CPU packet handling, as specified in Section 1.8 and Figure 1.1 of the R01DS0392EJ0140 datasheet.

What are the key differences between R7FA6E10D2CFP and R7FA6E10F2CFP?

The R7FA6E10D2CFP and R7FA6E10F2CFP share identical peripherals, package, pinout, and operating conditions - differing only in code flash capacity: 512 KB vs. 1 MB. Both support dual-bank flash, background operation, and SWAP. The R7FA6E10F2CFP is required for larger firmware images or secure/non-secure partitioning, while the R7FA6E10D2CFP offers optimal cost/performance for applications fitting within 512 KB, as documented in Table 1.12 and Section 1.4 of the R01DS0392EJ0140 datasheet.

R7FA6E10D2CFP#BA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RA6E1
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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All R7FA6E10D2CFP#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E10D2CFP#BA0 meets industry standards.

7.What is the process for return or replacement of R7FA6E10D2CFP#BA0?

All R7FA6E10D2CFP#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E10D2CFP#BA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6E10D2CFP#BA0 part is unused and in its original packaging.

Return procedure for R7FA6E10D2CFP#BA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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