Renesas R7FA6E10D2CFP#HA0
- Part No.:
- R7FA6E10D2CFP#HA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7FA6E10D2CFP#HA0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 512K/256
- Quantity:
- Payment:

- Shipping:

Inventory:4,303
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Product details
Overview
R7FA6E10D2CFP from Renesas is a 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 512 KB code flash, 8 KB data flash, and 256 KB SRAM with parity. It integrates Ethernet MAC (RMII), USB 2.0 Full-Speed, SDHI, QSPI, CAN, dual I²C, six SCI, two SPI, SSIE, 12-bit ADC (11 channels), 12-bit DAC, and TrustZone security - deployed in industrial gateways requiring real-time connectivity and secure firmware updates.
For engineers reviewing the R7FA6E10D2CFP datasheet, R7FA6E10D2CFP pinout, R7FA6E10D2CFP application, or R7FA6E10D2CFP equivalent, key selection criteria include its 100-pin LQFP package, -40°C to +85°C industrial temperature range, dual-bank flash for safe OTA updates, RMII Ethernet interface, and hardware-accelerated cryptographic support via SCE9 subsystem.
Technical Context
The R7FA6E10D2CFP implements Armv8-M with TrustZone, enabling secure/non-secure execution states, MPU partitioning (8 regions each), and secure boot enforcement. Its system architecture includes ETHERC/EDMAC co-processing for zero-CPU packet handling and DTC/DMAC (8-channel) offloading for sensor-to-cloud data pipelines.
Timing is managed by dual PLLs, HOCO/MOCO/LOCO oscillators, and CAC for clock accuracy validation. Power management supports Deep Software Standby with RTC, AGT timers, and VBATT backup - critical for battery-backed edge nodes maintaining timekeeping and wake-on-event capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max - enables deterministic real-time control with hardware FPU and DSP extensions. |
| Memory | 512 KB dual-bank code flash + 8 KB data flash + 256 KB SRAM with parity - supports background programming and SWAP operations for robust firmware updates. |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS, SDHI, QSPI, CAN 2.0B, 6× SCI, 2× I²C, 2× SPI, SSIE - enables multi-protocol industrial edge node design without external bridge ICs. |
| Analog | 12-bit ADC (11 channels), 12-bit DAC (1 channel) - provides local signal conditioning and analog actuator control with ±1 LSB INL. |
| Security | Arm TrustZone, SCE9 (access control, RNG, unique ID), MPU_S/MPU_NS - establishes hardware-enforced isolation between secure boot, crypto services, and application firmware. |
| Package & Temp | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), -40°C to +85°C - suitable for convection-cooled industrial PCBs with standard reflow profiles. |
Pinout & Package
Package: 100-pin LQFP (PLQP0100KB-B), 14 mm × 14 mm, 0.5 mm pitch, exposed die pad (recommended VSS connection).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power domains with decoupling requirements - AVCC0/AVSS0 isolate ADC/DAC noise; VCL/VCL0 stabilize internal LDO. |
| XTAL / EXTAL / XCIN / XCOUT | Crystal oscillator interface | Supports 8–24 MHz main crystal and 32.768 kHz sub-clock - enables precise RTC operation and low-jitter system timing. |
| RMII0_TXD0/RMII0_TXD1 / RMII0_RXD0/RMII0_RXD1 / REF50CK0 | Ethernet RMII physical layer interface | Direct connection to external PHY (e.g., LAN8720A) - eliminates need for MII traces or glue logic; REF50CK0 provides 50 MHz reference. |
| USB_DP / USB_DM / VCC_USB / VSS_USB | Integrated USB 2.0 Full-Speed transceiver | On-die PHY with VBUS detection (USB_VBUS) and OTG control (USB_ID, USB_EXICEN) - enables self-powered or bus-powered device/host operation. |
| P000–P505, P600–P708 | General-purpose I/O | 75 GPIOs with 5-V tolerant inputs (14 pins), N-ch open-drain outputs, programmable pull-up - supports mixed-voltage sensor interfacing and level-shifting-free peripheral control. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables atomic firmware updates: new image written to inactive bank while active bank runs; SWAP instruction triggers instant bank switch with no reset required. |
| ETHERC + EDMAC co-processor | Offloads Ethernet frame DMA transfers from CPU - supports 10/100 Mbps RMII with checksum offload and descriptor-based packet queuing. |
| TrustZone + SCE9 security engine | Hardware root of trust: secure boot validates signed firmware images; SCE9 provides AES-128/256, SHA-256, and TRNG - certified per PSA Level 2. |
| Low-power AGT timers + VBATT support | Six 16-bit asynchronous timers operate during Deep Software Standby using VBATT - maintains real-time wake scheduling without main VCC. |
| QSPI memory controller | Direct interface to serial NOR/NAND flash (x1/x4 mode) - boots from external memory or extends code space beyond on-chip flash limits. |
Applications
| Industrial Ethernet Gateway | Secure Edge Controller |
|---|---|
|
Use Scenario: Aggregating Modbus RTU/ASCII fieldbus data over RS-485 and forwarding via Ethernet TCP/IP to cloud SCADA. IC Role / Device Role: Central protocol translator and network bridge with real-time scheduling and secure TLS tunneling. Use Value: Integrated ETHERC, six SCI ports, and TrustZone enable deterministic latency (<50 µs ISR response) and encrypted firmware updates without external crypto ICs. |
Use Scenario: Local PLC-style logic execution in distributed automation nodes with remote diagnostics and over-the-air patching. IC Role / Device Role: Real-time control engine with dual-bank flash for fail-safe firmware rollback and hardware-secured key storage. Use Value: 200 MHz Cortex-M33 + 256 KB SRAM supports complex ladder logic scanning; SWAP operation ensures zero-downtime updates. |
| Smart Energy Meter Hub | Medical IoT Data Concentrator |
|
Use Scenario: Collecting pulse counts and voltage/current samples from multiple metering ICs, then transmitting via Ethernet or USB to utility backend. IC Role / Device Role: High-accuracy data acquisition hub with timestamped logging and tamper-resistant storage. Use Value: 12-bit ADC (11 ch) + RTC + VBATT backup ensures synchronized sampling and calendar-aware event logging during mains failure. |
Use Scenario: Consolidating ECG, SpO₂, and temperature streams from bedside sensors into encrypted USB mass-storage or Ethernet packets. IC Role / Device Role: Secure medical data concentrator with HIPAA-compliant encryption and audit-trail logging. Use Value: SCE9 AES-256 + SHA-256 + unique ID meets IEC 62304 Class B requirements; SSIE interfaces directly to audio codecs for waveform streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6E10F2CFP | 1 MB code flash (vs. 512 KB), same peripherals, package, and pinout | Required for larger firmware images or dual-application partitioning (e.g., secure + non-secure OS) | Select when >512 KB flash is needed; identical migration path with no PCB change. |
| STM32H743VIT6 | 480 MHz Cortex-M7, 2 MB flash, no integrated Ethernet MAC (requires external PHY + MAC logic), different security model (TZ only, no dedicated crypto accelerator) | Better raw compute for vision/AI inference; lacks native RMII and requires external Ethernet PHY + glue logic | Choose for higher CPU throughput where Ethernet is secondary; expect added BOM cost and layout complexity. |
Compared with R7FA6E10F2CFP, the R7FA6E10D2CFP trades flash capacity for cost-sensitive designs while retaining full peripheral compatibility; versus STM32H743VIT6, it delivers lower-system-cost Ethernet integration and certified PSA Level 2 security without external components.
Availability
R7FA6E10D2CFP is available at Aetrix Electronics and suitable for industrial gateways, secure edge controllers, smart energy hubs, and medical data concentrators requiring stable component supply across extended product lifecycles.
Supply support for R7FA6E10D2CFP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for automotive, industrial, and enterprise markets.
The RA6E1 group targets cost-optimized industrial and IoT edge devices, emphasizing integrated connectivity (Ethernet, USB, CAN), security (TrustZone + SCE9), and low-power operation - designed for long-lifecycle, high-reliability embedded systems.
FAQ
What is the maximum operating frequency of the R7FA6E10D2CFP?
The R7FA6E10D2CFP operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the on-chip PLL driven by the main clock oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The R7FA6E10D2CFP maintains full peripheral functionality-including Ethernet MAC, USBFS, and QSPI-at this clock rate, as confirmed in the R01DS0392EJ0140 datasheet Rev.1.40.
Does the R7FA6E10D2CFP support Ethernet connectivity, and what interface does it use?
Yes, the R7FA6E10D2CFP includes an integrated Ethernet MAC (ETHERC) compliant with IEEE 802.3, supporting 10/100 Mbps operation exclusively in RMII mode. It requires an external PHY (e.g., LAN8720A) connected via RMII0_TXD0/1, RMII0_RXD0/1, REF50CK0, and control signals. The R7FA6E10D2CFP does not support MII or GMII, and no external MAC logic is needed - the ETHERC links directly to the EDMAC for zero-CPU packet handling.
What security features are implemented in the R7FA6E10D2CFP?
The R7FA6E10D2CFP implements Arm TrustZone for hardware-enforced secure/non-secure world separation, MPU_S/MPU_NS (8 regions each), and the SCE9 security subsystem - which includes access control, true random number generation (TRNG), and a unique chip ID. While full SCE9 cryptographic acceleration (AES/SHA) is documented for the RA6E1 family, the R7FA6E10D2CFP specifically supports these functions per datasheet Section 1.1 and Table 1.13. No software-only fallbacks are required for basic secure boot or key provisioning.
How much flash memory does the R7FA6E10D2CFP have, and is it dual-bank?
The R7FA6E10D2CFP contains 512 KB of on-chip code flash memory organized in dual-bank configuration, plus 8 KB of data flash. Dual-bank operation enables background programming and SWAP functionality - allowing one bank to execute code while the other is erased/programmed, then atomically switching banks via software command. This architecture is explicitly confirmed for R7FA6E10D2CFP in Table 1.12 and Section 1.4 of the R01DS0392EJ0140 datasheet.
Which package type does the R7FA6E10D2CFP use, and how many I/O pins are available?
The R7FA6E10D2CFP uses a 100-pin LQFP package (PLQP0100KB-B, 14 mm × 14 mm, 0.5 mm pitch) with 75 general-purpose I/O pins, 14 of which are 5-V tolerant. It also provides 76 pull-up resistors, 75 N-channel open-drain outputs, and dedicated pins for Ethernet RMII, USB, QSPI, and analog functions. Pin assignments match Figure 1.3 in the R01DS0392EJ0140 datasheet, confirming full compatibility with RA6E1 reference designs.
R7FA6E10D2CFP#HA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RA6E1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 75
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6E10D2CFP#HA0 FAQ
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All R7FA6E10D2CFP#HA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E10D2CFP#HA0 meets industry standards.
7.What is the process for return or replacement of R7FA6E10D2CFP#HA0?
All R7FA6E10D2CFP#HA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E10D2CFP#HA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6E10D2CFP#HA0 part is unused and in its original packaging.
Return procedure for R7FA6E10D2CFP#HA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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