My Inquiry
My Account
Renesas R7FA6E10D2CNE#AA0
- Part No.:
- R7FA6E10D2CNE#AA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-WFQFN Exposed Pad
- Datasheet:
-
R7FA6E10D2CNE#AA0.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 48HWQFN
- Quantity:
- Payment:
- Shipping:
Inventory:211
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6E10D2CNE#AA0 from Renesas is a 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 512 KB dual-bank code flash, 8 KB data flash, 256 KB SRAM with parity, integrated Ethernet MAC, USB 2.0 Full-Speed, CAN, SDHI, QSPI, and 12-bit ADC/DAC - designed for industrial edge nodes requiring secure, real-time connectivity and analog signal processing.
For engineers reviewing the R7FA6E10D2CNE#AA0 datasheet, R7FA6E10D2CNE#AA0 pinout, R7FA6E10D2CNE#AA0 application, or R7FA6E10D2CNE#AA0 equivalent, this MCU delivers verified TrustZone-based security partitioning, RMII Ethernet interface, battery-backed RTC with calendar support, and 48-pin QFN packaging optimized for space-constrained industrial gateways and smart sensors.
Technical Context
The R7FA6E10D2CNE#AA0 implements Armv8-M architecture with TrustZone, enabling secure/non-secure execution states managed by dual MPU instances (8 regions each), two SysTick timers (secure and non-secure), and CoreSight ETM-M33 for trace debugging. Its memory subsystem includes dual-bank flash supporting background operation and SWAP, plus parity-protected SRAM for functional safety compliance.
Connectivity is centered on hardware-accelerated peripherals: ETHERC/EDMAC with RMII interface, USBFS with internal transceiver, CAN 2.0B-compliant controller requiring external transceiver, and QSPI for serial NOR flash expansion. Analog integration comprises 11-channel 12-bit ADC12 and single-channel 12-bit DAC12, both with dedicated reference pins (VREFH0/VREFL0 and VREFH/VREFL).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max - enables deterministic real-time control with TrustZone isolation and PMSAv8 memory protection. |
| Memory | 512 KB dual-bank code flash + 8 KB data flash + 256 KB SRAM with parity - supports firmware updates without interruption and ECC-capable data retention. |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS, CAN 2.0B, SDHI, QSPI, 6× SCI, 2× I²C, 2× SPI, SSIE - enables multi-protocol industrial edge communication. |
| Analog | 12-bit ADC12 (11 channels), 12-bit DAC12 (1 channel) - provides precision sensor interfacing and analog output generation with independent reference domains. |
| Timers | GPT32 ×2, GPT16 ×4, AGT ×6, RTC with calendar mode - delivers flexible PWM, capture/compare, low-power timing, and battery-backed timekeeping. |
| Security | Arm TrustZone, secure MPU, access control circuit, RNG, unique ID - establishes hardware-rooted security foundation for secure boot and firmware attestation. |
| Package & Temp | 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C - suited for compact, thermally demanding industrial PCB layouts. |
Pinout & Package
48-pin QFN package (PWQN0048KC-A) with exposed die pad recommended to be connected to VSS. Pin count and I/O configuration: 27 general-purpose I/O pins, 1 input-only pin, 28 pull-up resistors, 27 N-ch open-drain outputs, and 4 pins 5-V tolerant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: digital (VCC/VSS) and analog (AVCC0/AVSS0); decoupling required per pin per datasheet layout guidelines. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal or external clock; enables precise system timing and PLL synchronization. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and low-power wake-up timing. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver eliminates need for external PHY; requires 27 Ω series termination per line per USB spec. |
| RMII0_TXD0/1, RMII0_RXD0/1 | Ethernet RMII data lanes | 2-bit transmit/receive interface compatible with standard RMII PHYs; REF50CK0 required for 50 MHz timing reference. |
| CRXn / CTXn | CAN bus interface | Requires external CAN transceiver (e.g., TJA1042); supports ISO 11898-1 compliant messaging with 32 configurable mailboxes. |
| QSPCLK / QSSL / QIO0–QIO3 | Quad SPI interface | Direct connection to serial NOR/EEPROM/FeRAM; supports XIP and high-speed read/write with configurable latency. |
| P000–P015, P100–P115, etc. | General-purpose I/O | Configurable as GPIO, peripheral function, or event inputs; includes AGT/RTC/GPT trigger capability and SWD debug support. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating downtime in field-deployed devices. |
| TrustZone + Secure MPU | Hardware-enforced isolation between secure firmware (e.g., bootloader, crypto keys) and non-secure application code - meets IEC 62443-3-3 SL2 requirements. |
| RMII Ethernet interface | Reduces pin count and PCB complexity vs MII; integrates DMA controller (EDMAC) for zero-CPU packet handling in TCP/IP stacks. |
| Battery-backed RTC | Retains calendar time (2000–2099) and binary counter during main power loss using VBATT; supports wake-up from Deep Software Standby mode. |
| Event Link Controller (ELC) | Allows direct peripheral-to-peripheral triggering (e.g., ADC conversion start → DMA transfer) without CPU intervention - lowers latency and power. |
| 12-bit ADC12 with 11 channels | Simultaneous sampling not supported, but supports software/hardware triggers, window comparison, and 1.0 µs conversion time - suitable for motor current sensing and environmental monitoring. |
Applications
| Industrial Gateway | Smart Sensor Node |
|---|---|
|
Use Scenario: Edge gateway aggregating Modbus RTU, CAN bus, and analog sensor data before forwarding via Ethernet or USB to cloud infrastructure. IC Role / Device Role / Timing Role: Central controller managing protocol translation, real-time scheduling, secure OTA updates, and time-stamped data logging. Use Value: Dual-bank flash enables fail-safe firmware upgrades; RMII Ethernet and USBFS provide dual upstream connectivity; TrustZone isolates secure boot from application logic. |
Use Scenario: Battery-powered condition-monitoring node measuring temperature, vibration, and humidity with local preprocessing and low-power wireless wakeup. IC Role / Device Role / Timing Role: Low-power host executing sensor fusion algorithms, managing AGT-triggered ADC sampling, and maintaining RTC calendar during sleep. Use Value: 48-pin QFN minimizes board area; VBATT-supported RTC retains time across power cycles; 5-V tolerant I/O simplifies interface to legacy analog sensors. |
| Secure PLC I/O Module | Human-Machine Interface (HMI) Controller |
|
Use Scenario: DIN-rail mounted I/O module with isolated digital inputs, analog outputs, and CAN-based fieldbus communication in factory automation. IC Role / Device Role / Timing Role: Safety-critical control unit performing watchdog-monitored logic execution, analog output calibration, and secure firmware validation. Use Value: Parity-protected SRAM and dual MPU regions enforce memory integrity; WDT/IWDT provide redundant fault detection; DAC12 drives 4–20 mA loop outputs. |
Use Scenario: Touch-enabled HMI panel with local display rendering, button debouncing, audio feedback (SSIE), and USB-based configuration download. IC Role / Device Role / Timing Role: Application processor handling GUI state machine, SSIE-driven audio playback, and USB mass storage emulation for firmware loading. Use Value: SSIE supports I²S/TDM audio up to 50 MHz clock; USBFS operates as device for drag-and-drop configuration; QSPI boots UI assets from external flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6E10F2CNE#AA0 | 1 MB code flash (vs. 512 KB), same 48-pin QFN package, identical peripherals and clocking | Required where larger firmware image size or future-proofing for feature expansion is needed | Select when firmware growth potential exceeds 512 KB or dual-bank update headroom must accommodate larger binaries. |
| R7FA4M10D2CNE#AA0 | Arm Cortex-M4F core (100 MHz), no Ethernet MAC, no QSPI, 384 KB SRAM, same 48-pin QFN | Suitable for cost-sensitive motor control or audio processing without network connectivity | Choose when Ethernet, CAN, or QSPI are unnecessary and floating-point performance is prioritized over security and networking features. |
Compared with R7FA6E10F2CNE#AA0, the R7FA6E10D2CNE#AA0 trades flash capacity for lower cost and smaller footprint while retaining full peripheral compatibility; versus R7FA4M10D2CNE#AA0, it adds TrustZone, Ethernet, CAN, and QSPI at the expense of FPU and higher clock speed - making it optimal for secure, connected industrial endpoints.
Availability
R7FA6E10D2CNE#AA0 is available at Aetrix Electronics and suitable for industrial gateways, smart sensor nodes, and secure PLC I/O modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.
Supply support for R7FA6E10D2CNE#AA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RA6E1 group targets cost-optimized, secure, and connected industrial edge devices - combining Arm TrustZone, rich analog/mixed-signal integration, and essential connectivity (Ethernet, USB, CAN) in compact packages like the R7FA6E10D2CNE#AA0.
FAQ
What is the maximum operating frequency of the R7FA6E10D2CNE#AA0?
The R7FA6E10D2CNE#AA0 features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz, achieved using the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO). This frequency is fully supported across the specified operating voltage range (2.7–3.6 V) and temperature range (−40°C to +85°C).
Does the R7FA6E10D2CNE#AA0 include an integrated Ethernet PHY?
No, the R7FA6E10D2CNE#AA0 integrates only the Ethernet MAC (ETHERC) and DMA controller (EDMAC) - it requires an external RMII-compliant PHY (e.g., LAN8720A or DP83848) connected via RMII0_TXD0/1, RMII0_RXD0/1, REF50CK0, and associated control signals. The MCU does not contain a physical layer transceiver.
How many analog input channels does the ADC12 support on the R7FA6E10D2CNE#AA0?
The R7FA6E10D2CNE#AA0 includes the 12-bit ADC12 peripheral with up to 11 selectable analog input channels (ANm0–ANm10), as confirmed in the RA6E1 datasheet section 1.7 and Table 1.13. Channel count is consistent across all RA6E1 variants, including the 48-pin QFN package.
Is TrustZone functionality fully implemented on the R7FA6E10D2CNE#AA0?
Yes, the R7FA6E10D2CNE#AA0 implements Arm TrustZone for Armv8-M, including secure/non-secure MPU regions, secure exception handling, and secure boot support. However, only the access control circuit, random number generator (RNG), and unique ID are guaranteed functional per datasheet Note 1 - advanced cryptography accelerators (e.g., SCE9) are not enabled on this variant.
What is the purpose of the VBATT pin on the R7FA6E10D2CNE#AA0?
The VBATT pin on the R7FA6E10D2CNE#AA0 supplies backup power to the RTC, sub-clock oscillator (SOSC), and backup registers during main power loss. When connected to a coin cell or supercapacitor, it enables continuous calendar timekeeping, wake-up events, and retention of 128 B of backup register data - critical for energy-harvesting and battery-operated systems.
R7FA6E10D2CNE#AA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-WFQFN Exposed Pad
- Series:
- RA6E1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, I2C, MMC/SD, SCI, SmartCard, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 27
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 5x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6E10D2CNE#AA0 FAQ
1.How can I place an order for R7FA6E10D2CNE#AA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6E10D2CNE#AA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6E10D2CNE#AA0 reliable?
The price and inventory of R7FA6E10D2CNE#AA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6E10D2CNE#AA0 is usually 5 days.
3.What payment methods are accepted for R7FA6E10D2CNE#AA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6E10D2CNE#AA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6E10D2CNE#AA0?
R7FA6E10D2CNE#AA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6E10D2CNE#AA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6E10D2CNE#AA0?
For technical support, including R7FA6E10D2CNE#AA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6E10D2CNE#AA0 requirements.
6.How does Aetrix verify that R7FA6E10D2CNE#AA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6E10D2CNE#AA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E10D2CNE#AA0 meets industry standards.
7.What is the process for return or replacement of R7FA6E10D2CNE#AA0?
All R7FA6E10D2CNE#AA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E10D2CNE#AA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6E10D2CNE#AA0 part is unused and in its original packaging.
Return procedure for R7FA6E10D2CNE#AA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6E10D2CNE#AA0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
