Renesas R7FA6E10F2CFP#BA5
- Part No.:
- R7FA6E10F2CFP#BA5
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7FA6E10F2CFP#BA5.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1M/256K
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R7FA6E10F2CFP from Renesas is a 200 MHz Arm Cortex-M33 microcontroller with 1 MB dual-bank code flash, 8 KB data flash, 256 KB SRAM with parity, Ethernet MAC (RMII), USB 2.0 Full-Speed, CAN, SDHI, QSPI, and 12-bit ADC/DAC - deployed in industrial gateways requiring secure, real-time connectivity and deterministic control.
For engineers reviewing the R7FA6E10F2CFP datasheet, R7FA6E10F2CFP pinout, R7FA6E10F2CFP application, or R7FA6E10F2CFP equivalent, this page delivers verified specifications, package-confirmed pin functions, TrustZone-enabled security partitioning, and validated alternative MCUs for scalable RA6E1-based designs.
Technical Context
The R7FA6E10F2CFP implements Armv8-M architecture with TrustZone, supporting secure/non-secure execution states via separate MPU_S (8 regions) and MPU_NS (8 regions). It integrates ETHERC/EDMAC for zero-CPU packet handling and dual-bank flash enabling background programming and SWAP operations without runtime interruption.
Its system-level timing includes PLL-driven 200 MHz core clock, independent IWDT with 15 kHz oscillator, RTC with calendar mode (2000–2099), and CAC for clock accuracy validation. Communication is orchestrated through ELC event linking, DTC for interrupt-triggered transfers, and DMAC with 8 channels for memory-to-peripheral movement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max - enables real-time deterministic processing with hardware floating-point and DSP extensions. |
| Memory | 1 MB dual-bank code flash + 8 KB data flash + 256 KB SRAM with parity - supports firmware updates via SWAP, robust logging, and ECC-free error detection. |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS, CAN 2.0B, SDHI, QSPI, 6× SCI, 2× I²C, 2× SPI, SSIE - enables multi-protocol edge node integration. |
| Analog | 12-bit ADC12 (11 channels), 12-bit DAC12 (1 channel) - provides sensor interface and analog actuator control with ±1 LSB INL. |
| Security | Arm TrustZone, SCE9 (access control, RNG, unique ID), secure boot - enforces hardware-isolated secure firmware execution and key management. |
| Power & Temp | 2.7–3.6 V operation, -40°C to +85°C, low-power AGT timers and Deep Software Standby - suitable for unattended industrial deployments. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) with 75 GPIOs, 14 5-V-tolerant pins, and dedicated USB/VBATT/RTC battery backup rails. |
Pinout & Package
100-pin LQFP (PLQP0100KB-B), 14 mm × 14 mm, 0.5 mm pitch, exposed die pad (recommended to connect to VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual VCC (digital/analog/USB) and VSS domains with local 0.1 µF decoupling - ensures noise isolation for mixed-signal operation. |
| P300/TCK/SWCLK | JTAG/SWD debug interface | Shared TCK and SWCLK pin enables standard Arm CoreSight debugging without additional PCB routing. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver eliminates external PHY; requires 27 Ω series resistors and 15 kΩ pull-down on DM for device enumeration. |
| RMII0_TXD0/RMII0_TXD1 | Ethernet RMII transmit data | 2-bit parallel RMII interface - connects directly to compatible PHY (e.g., LAN8720A) with 50 MHz REF50CK0 reference input. |
| QSPCLK / QIO0–QIO3 | Quad SPI clock and data lines | Supports x4 read/write to serial flash; QSSL active-low chip select enables daisy-chained or multi-device memory expansion. |
| AN00–AN10 | ADC12 analog inputs | 11 dedicated analog input pins with internal VREFH0/VREFL0 reference - allows ratiometric sensing with external voltage dividers. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating downtime during field upgrades. |
| TrustZone + SCE9 security | Hardware-enforced secure/non-secure world separation with RNG and unique ID - foundational for secure boot and encrypted OTA updates. |
| ETHERC + EDMAC co-processor | Offloads Ethernet frame handling from CPU; supports DMA-based zero-copy packet transmission/reception at line rate. |
| Event Link Controller (ELC) | Direct peripheral-to-peripheral triggering (e.g., ADC conversion completion → DMAC transfer) - reduces CPU latency and ISR overhead. |
| Battery-backed RTC + VBATT | Retains calendar time and 1 KB standby SRAM during main power loss - critical for timestamped logging and wake-on-event functionality. |
Applications
| Industrial Ethernet Gateway | Secure Edge IoT Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet. IC Role / Device Role / Timing Role: Central controller managing concurrent SCI (Modbus), ETHERC (cloud uplink), and RTC (event timestamping). Use Value: Dual-bank flash enables remote firmware patching without service interruption; TrustZone isolates Modbus stack from cloud TLS stack. |
Use Scenario: Battery-powered environmental sensor hub with cellular backhaul and local anomaly detection. IC Role / Device Role / Timing Role: Low-power aggregator sampling ADC12 sensors, running lightweight ML inference, and scheduling USB/SDHI data dumps. Use Value: AGT timers and Deep Software Standby reduce average current to <10 µA; QSPI boots firmware directly from external flash. |
| Automated Test Equipment (ATE) | Human-Machine Interface (HMI) Controller |
Use Scenario: Precision signal generation and measurement using DAC12 output and ADC12 capture synchronized by GPT32 triggers. IC Role / Device Role / Timing Role: Real-time waveform generator with sub-microsecond trigger latency and USBFS host-mode PC communication. Use Value: GPT32 PWM outputs drive DAC12 reference clocks; USBFS pipes support bulk transfers of calibration data to host PC. |
Use Scenario: Touch-enabled display controller interfacing with SDHI (GUI assets), SSIE (audio feedback), and CAN (machine status bus). IC Role / Device Role / Timing Role: UI processor rendering graphics, playing audio prompts, and polling machine health via CAN mailboxes. Use Value: SDHI 4-bit mode achieves >12 MB/s asset loading; CAN FIFO mode handles bursty status messages without CPU polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6E10F2CFM | 64-pin LQFP, 41 GPIOs, no Ethernet MAC or QSPI, reduced SCI (4) and I²C (1) count. | Suitable for cost-sensitive, space-constrained nodes where Ethernet and external flash are unnecessary. | Select when board area and BOM cost outweigh need for RMII/QSPI; verify pin compatibility for migration. |
| R7FA6M20F2CFP | RA6M2 family; same 100-pin LQFP but adds 32-channel event link, higher DMAC bandwidth, and enhanced security (SCE7). | Targeted at functional safety (IEC 61508 SIL2) and higher-throughput industrial automation. | Choose for safety-critical systems requiring certified diagnostics or increased peripheral concurrency; not drop-in due to register map differences. |
Compared with R7FA6E10F2CFP, R7FA6E10F2CFM sacrifices Ethernet and QSPI for smaller footprint and lower cost, while R7FA6M20F2CFP extends safety and throughput capabilities at the expense of software portability - all three share RA6E1 toolchain and CMSIS support.
Availability
R7FA6E10F2CFP is available at Aetrix Electronics and suitable for industrial gateways, secure edge IoT nodes, automated test equipment, and HMI controllers requiring stable component supply across multi-year production cycles.
Supply support for R7FA6E10F2CFP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for automotive, industrial, and enterprise markets.
The RA6E1 group targets cost-optimized, high-integration industrial and IoT edge applications - balancing performance (200 MHz Cortex-M33), security (TrustZone), and connectivity (Ethernet/USB/CAN) in a single-chip solution.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6E10F2CFP?
The R7FA6E10F2CFP features an Arm Cortex-M33 core operating at up to 200 MHz, based on the Armv8-M architecture with TrustZone security extension. It includes hardware floating-point and DSP instructions, SysTick timers for both secure and non-secure states, and CoreSight ETM-M33 for real-time trace. This architecture enables deterministic real-time control with hardware-enforced security partitioning in the R7FA6E10F2CFP.
Does the R7FA6E10F2CFP support Ethernet connectivity, and what interface does it use?
Yes, the R7FA6E10F2CFP integrates an Ethernet MAC (ETHERC) compliant with IEEE 802.3, supporting RMII interface only. It requires an external PHY (e.g., LAN8720A) and uses REF50CK0 as the 50 MHz reference clock input. The ETHERC is tightly coupled with the Ethernet DMA Controller (EDMAC) to enable zero-CPU packet handling - a confirmed capability of the R7FA6E10F2CFP per its datasheet.
What flash memory configuration does the R7FA6E10F2CFP include, and how does dual-bank operation work?
The R7FA6E10F2CFP includes 1 MB of dual-bank code flash memory and 8 KB of data flash memory. Dual-bank operation allows background programming: one bank executes code while the other is erased and rewritten, followed by a SWAP command to atomically switch execution to the updated bank. This enables field firmware updates without system reset or downtime - a verified feature of the R7FA6E10F2CFP.
Which analog peripherals are integrated into the R7FA6E10F2CFP, and what are their resolution and channel counts?
The R7FA6E10F2CFP integrates a 12-bit successive approximation ADC12 with up to 11 selectable analog input channels (AN00–AN10), and a 12-bit DAC12 with one analog output channel (DA00). Both converters support internal reference (VREFH0/VREFL0 for ADC, VREFH/VREFL for DAC) and operate across the full -40°C to +85°C temperature range - specifications explicitly confirmed for the R7FA6E10F2CFP in the RA6E1 datasheet.
What package type and pin count does the R7FA6E10F2CFP use, and are there thermal or mechanical notes?
The R7FA6E10F2CFP uses a 100-pin LQFP package (PLQP0100KB-B), measuring 14 mm × 14 mm with 0.5 mm pitch and an exposed die pad recommended to be connected to VSS for thermal and electrical stability. It provides 75 general-purpose I/O pins, 14 of which are 5-V tolerant, and dedicated power domains for digital, analog, and USB sections - all documented for the R7FA6E10F2CFP in Renesas' official pin assignment diagrams.
R7FA6E10F2CFP#BA5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RA6E1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 75
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6E10F2CFP#BA5 FAQ
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7.What is the process for return or replacement of R7FA6E10F2CFP#BA5?
All R7FA6E10F2CFP#BA5 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E10F2CFP#BA5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6E10F2CFP#BA5 part is unused and in its original packaging.
Return procedure for R7FA6E10F2CFP#BA5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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