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Renesas R7FA6E2B92CBB#BC0

Part No.:
R7FA6E2B92CBB#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LFBGA
Datasheet:
AetrixR7FA6E2B92CBB#BC0.pdf
Description:
MCU:RA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,920

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Product details

Overview

R7FA6E2B92CBB from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 128 KB code flash, 4 KB data flash, and 40 KB SRAM. It integrates USB Full-Speed, CAN FD, Quad SPI, I3C, dual 12-bit DACs, 12-bit ADC with temperature sensor, and TrustZone-based security. It targets industrial control, smart sensors, and connected edge devices requiring secure, low-power real-time processing.

For engineers reviewing the R7FA6E2B92CBB datasheet, R7FA6E2B92CBB pinout, R7FA6E2B92CBB application, or R7FA6E2B92CBB equivalent, key selection considerations include its BGA-64 package (5 mm × 5 mm), -40°C to +85°C operating range, 200 MHz CPU performance, integrated CAN FD and USBFS peripherals, and hardware-enforced security via Arm TrustZone.

Technical Context

The R7FA6E2B92CBB implements an Armv8-M architecture with TrustZone security extension (r0p4-00rel0), supporting secure/non-secure MPU regions and isolated peripheral attribution. Its clock system includes MOSC (8–24 MHz), SOSC (32.768 kHz), HOCO/MOCO/LOCO oscillators, and PLL for flexible frequency synthesis up to 200 MHz.

It features dual execution domains: Secure and Non-secure instances of SysTick timer, GPT16E × 6 PWM channels with BLDC motor control outputs (GTOUUP/GTOULO etc.), AGT × 2 for low-power timing, and event-driven operation via ELC linking peripherals without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 200 MHz max - enables high-throughput deterministic real-time control in resource-constrained edge nodes.
Memory128 KB code flash / 4 KB data flash / 40 KB SRAM - supports firmware updates, parameter storage, and real-time buffer handling without external memory.
Operating Temp-40°C to +85°C - qualified for industrial ambient environments without derating.
Package64-pin BGA (5 mm × 5 mm, 0.5 mm pitch) - compact footprint suitable for space-limited PCB layouts with high I/O density.
SecurityArm TrustZone, 128-bit unique ID, TRNG - provides hardware-isolated secure boot, cryptographic key generation, and tamper-resistant identity.
Analog Peripherals12-bit ADC (12 ch), dual 12-bit DAC, on-die temperature sensor - enables closed-loop analog sensing and actuation without external signal conditioning.
ConnectivityCAN FD (ISO 11898-1), USB 2.0 Full-Speed, QSPI, I3C, SPI × 2, SCI × 2 - supports mixed-protocol industrial networking and high-speed memory expansion.

Pinout & Package

Package: 64-pin BGA (PLBG0064KB-A), 5 mm × 5 mm, 0.5 mm pitch, exposed die pad recommended to connect to VSS.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual power domains: VCC (2.7–3.6 V) powers digital logic; VSS reference for all I/O and analog sections.
P213 / P212XTAL / EXTALCrystal oscillator input/output - supports precision timing for USB and CAN FD with ±50 ppm stability requirement.
P814 / P815USB_DP / USB_DMIntegrated USB 2.0 FS transceiver pins - eliminate need for external PHY; support device-mode enumeration and CDC/HID class operation.
P206 / P207CTX0 / CRX0CAN FD transmit/receive - compliant with ISO 11898-1; supports bit rates up to 5 Mbps with flexible data-rate arbitration.
P409 / P410TXD0 / RXD0SCI asynchronous UART interface - enables debug console, host communication, or legacy protocol bridging at configurable baud rates.
P000–P015, P100–P113, etc.General-purpose I/O45 programmable I/O pins with 5-V tolerance on 11 pins, N-ch open-drain, pull-up resistors - direct interfacing with industrial sensors, actuators, and level-shifted buses.

Key Features

FeatureDesign Value
Arm TrustZone SecurityHardware-enforced isolation between secure firmware (bootloader, crypto keys) and non-secure application code - prevents unauthorized access to sensitive assets.
Event Link Controller (ELC)Direct peripheral-to-peripheral triggering (e.g., ADC conversion start → DMA transfer) - eliminates CPU polling and reduces latency by >90% in time-critical sampling.
Quad SPI InterfaceSingle-cycle read/write to external serial flash/FeRAM up to 133 MHz - enables fast firmware loading, OTA update storage, and extended data logging.
Dual 12-bit DAC OutputsSimultaneous analog voltage generation (e.g., motor phase references or sensor biasing) with independent output control - replaces discrete DAC ICs in closed-loop systems.
Low-Power Asynchronous Timers (AGT)32-bit timers running from LOCO (32.768 kHz) during Deep Software Standby - maintain real-time wake-up scheduling while consuming <1 µA.

Applications

Industrial PLC I/O ModuleSmart Sensor Node

Use Scenario: Compact remote I/O unit collecting analog/digital signals from field devices and communicating via CAN FD to central controller.

IC Role / Device Role / Timing Role: Main controller executing real-time I/O scanning, CAN FD protocol stack, and local diagnostics with sub-millisecond jitter.

Use Value: Integrated CAN FD PHY interface, 12-bit ADC with internal reference, and 200 MHz CPU enable deterministic 1 ms scan cycles without external timing components.

Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and air quality, transmitting data over USB or CAN FD.

IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, data fusion, secure firmware updates, and low-power wireless gateway interface.

Use Value: On-die temperature sensor + ADC calibration, TrustZone-secured OTA updates, and AGT timers allow 5-year battery life with periodic wake-up and measurement.

USB-C Enabled Industrial ToolBLDC Motor Control Reference

Use Scenario: Handheld diagnostic tool connecting to machinery via USB-C for configuration, firmware upload, and live telemetry display.

IC Role / Device Role / Timing Role: USB device controller with CDC ACM class implementation, flash storage manager, and human-interface logic.

Use Value: Integrated USB 2.0 Full-Speed transceiver, 128 KB flash for dual-bank firmware, and 4 KB data flash for persistent settings eliminate external USB PHY and EEPROM.

Use Scenario: 3-phase BLDC motor driver board using hall-effect feedback for commutation and current sensing for torque control.

IC Role / Device Role / Timing Role: Real-time motor control unit generating synchronized PWM waveforms, capturing hall sensor edges, and regulating current via ADC feedback.

Use Value: Six GPT16E channels with complementary outputs (GTOUUP/GTOULO etc.) and GTETRG inputs enable precise 120° commutation timing with <100 ns dead-time control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA6E2B93CBBSame package and pinout; rated for -40°C to +105°C; identical peripherals and memory map.Required for extended temperature industrial or automotive under-hood applications.Select R7FA6E2B93CBB when ambient operating temperature exceeds +85°C.
R7FA6E2BB2CBBSame BGA-64 package; 256 KB code flash (vs. 128 KB); otherwise identical feature set and pin compatibility.Suitable for applications needing larger firmware image size (e.g., embedded Linux RTOS, complex protocol stacks).Choose R7FA6E2BB2CBB when firmware growth or future feature expansion requires additional flash capacity.

Compared with R7FA6E2B92CBB, R7FA6E2B93CBB extends thermal range without changing layout or firmware, while R7FA6E2BB2CBB doubles code flash for scalable firmware-both retain full pin and peripheral compatibility, enabling seamless migration within the RA6E2 family.

Availability

R7FA6E2B92CBB is available at Aetrix Electronics and suitable for industrial automation, smart sensor design, and USB-connected embedded instrumentation requiring stable component supply across multi-year production cycles.

Supply support for R7FA6E2B92CBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RA6E2 Group is designed for cost-sensitive, power-efficient industrial and consumer edge applications requiring Arm Cortex-M33 performance, hardware security, and rich connectivity-including USB, CAN FD, and I3C-in compact packages.

FAQ

What is the maximum operating frequency of the R7FA6E2B92CBB?

The R7FA6E2B92CBB operates at a maximum CPU frequency of 200 MHz using its Arm Cortex-M33 core. This frequency is achieved via internal PLL multiplication of supported clock sources including MOSC (8–24 MHz), HOCO (16/18/20 MHz), or external crystal. The R7FA6E2B92CBB maintains full peripheral functionality at this speed, with timing-critical modules like GPT16E and USBFS fully synchronized to the system clock domain.

Does the R7FA6E2B92CBB support CAN FD communication?

Yes, the R7FA6E2B92CBB integrates a CAN with Flexible Data-Rate (CANFD) module compliant with ISO 11898-1. It supports both classical CAN frames and CAN FD frames with data rates up to 5 Mbps in the data phase. The module provides 4 transmit buffers and 32 receive buffers, and connects directly to the MCU's pinout via dedicated CTX0 and CRX0 signals-no external transceiver required for basic operation.

What package type and pin count does the R7FA6E2B92CBB use?

The R7FA6E2B92CBB uses a 64-pin BGA package (PLBG0064KB-A) with 5 mm × 5 mm dimensions and 0.5 mm pitch. It provides 45 general-purpose I/O pins, 5 dedicated input-only pins, and supports 5-V tolerant operation on 11 pins. The exposed die pad is recommended to be connected to VSS for thermal and electrical integrity.

How much flash and RAM memory does the R7FA6E2B92CBB include?

The R7FA6E2B92CBB includes 128 KB of on-chip code flash memory, 4 KB of data flash memory (rated for 100,000 program/erase cycles), and 40 KB of SRAM. The SRAM is partitioned into 32 KB with parity and 8 KB with ECC, and includes 1 KB of standby SRAM that retains data in Deep Software Standby mode-enabling ultra-low-power operation without data loss.

Is the R7FA6E2B92CBB compatible with Arm TrustZone security?

Yes, the R7FA6E2B92CBB implements Arm TrustZone for Armv8-M, providing hardware-enforced separation between secure and non-secure software states. It supports up to three secure regions in code flash, two in data flash, and three in SRAM, with individual security attribution for each peripheral. This enables secure boot, cryptographic key protection, and runtime isolation-critical for firmware updates and secure communication in industrial deployments.

R7FA6E2B92CBB#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LFBGA
Series:
RA6E2
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6E2B92CBB#BC0 FAQ

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5.How can I obtain technical support or documentation for R7FA6E2B92CBB#BC0?

For technical support, including R7FA6E2B92CBB#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6E2B92CBB#BC0 requirements.

6.How does Aetrix verify that R7FA6E2B92CBB#BC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6E2B92CBB#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2B92CBB#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6E2B92CBB#BC0?

All R7FA6E2B92CBB#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2B92CBB#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6E2B92CBB#BC0 part is unused and in its original packaging.

Return procedure for R7FA6E2B92CBB#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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