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Renesas R7FA6E2B93CBB#BC0

Part No.:
R7FA6E2B93CBB#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LFBGA
Datasheet:
AetrixR7FA6E2B93CBB#BC0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 128K/40K
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,638

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Product details

Overview

R7FA6E2B93CBB#BC0 from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 128 KB code flash, 4 KB data flash, 40 KB SRAM, USB Full-Speed, CAN FD, QSPI, I3C, and 12-bit ADC/DAC. It targets industrial control, smart sensing, and connected edge devices requiring secure, low-power operation across -40°C to +105°C.

For engineers reviewing the R7FA6E2B93CBB#BC0 datasheet, R7FA6E2B93CBB#BC0 pinout, R7FA6E2B93CBB#BC0 application, or R7FA6E2B93CBB#BC0 equivalent, this page delivers verified specifications, package mapping (64-pin BGA, 5 mm × 5 mm), security features (Arm TrustZone®), real-time peripherals (GPT16E × 6, AGT × 2, RTC), and validated alternative options for migration or sourcing continuity.

Technical Context

The R7FA6E2B93CBB#BC0 implements Armv8-M architecture with TrustZone® isolation, supporting secure/non-secure execution states, MPU_S/MPU_NS (8 regions each), and dual SysTick timers. Its clock system integrates MOSC (8–24 MHz), SOSC (32.768 kHz), HOCO/MOCO/LOCO oscillators, and PLL for flexible frequency synthesis up to 200 MHz.

Peripheral integration includes CAN FD (4 TX/32 RX buffers), USBFS (device mode, internal transceiver, 5-pipe support), QSPI (serial ROM interface), SSIE (I2S/TDM audio up to 50 MHz), and dual 12-bit DACs with independent output pins. Security extends to TRNG, 128-bit unique ID, and secure pin multiplexing.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 @ 200 MHz max - enables real-time deterministic control with hardware security extensions.
Memory 128 KB code flash / 4 KB data flash / 40 KB SRAM - supports firmware updates, parameter storage, and buffer-intensive protocols like USB/CANFD.
Operating Temp -40°C to +105°C - qualified for industrial and automotive under-hood environments without derating.
Supply Voltage 2.7 V to 3.6 V - compatible with standard 3.3 V power rails and battery-backed systems.
Security Arm TrustZone®, secure MPU, TRNG, 128-bit UID - provides hardware-enforced isolation for secure boot and firmware integrity.
Connectivity CAN FD, USBFS, QSPI, I3C, SPI × 2, SCI × 2 - enables multi-protocol edge node communication with external flash, sensors, and host interfaces.
Analog 12-bit ADC12 (12 ch), DAC12 × 2, TSN - supports precision sensor signal conditioning and analog actuator control in closed-loop systems.

Pinout & Package

Package: 64-pin BGA (PLBG0064KB-A), 5 mm × 5 mm, 0.5 mm pitch, exposed die pad (recommended to connect to VSS).

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Dual power domains: VCC (digital core), VSS (digital ground); decoupling required per datasheet layout guidelines.
XTAL / EXTAL Main crystal oscillator interface Supports 8–24 MHz external crystal for high-accuracy system clock; EXTAL accepts external clock input.
XCIN / XCOUT Sub-clock oscillator interface 32.768 kHz crystal connection for RTC calendar mode and low-power wake-up timing.
USB_DP / USB_DM USB 2.0 Full-Speed differential pair Integrated transceiver eliminates external PHY; requires 27 Ω series resistors and proper USB routing.
CTX0 / CRX0 CAN FD transmit/receive Direct connection to CAN bus via external transceiver; supports ISO 11898-1 compliant frames up to 5 Mbps.
QSPCLK / QIO0–QIO3 Quad SPI interface Drives serial NOR/NAND flash with 4-line data transfer; enables XIP (execute-in-place) for code density optimization.
P000–P015, P100–P113, etc. General-purpose I/O 45 total I/O pins on BGA64 variant; 5-V tolerant on 11 pins, N-ch open-drain capable, configurable pull-up.

Key Features

Feature Design Value
Arm TrustZone® Security Hardware-isolated secure/non-secure worlds with configurable memory/peripheral attribution - enables secure bootloader and encrypted OTA updates.
Event Link Controller (ELC) Direct peripheral-to-peripheral triggering without CPU intervention - reduces latency in motor control (GPT→ADC) and sensor sampling (AGT→ADC).
Low-Power Asynchronous Timers (AGT × 2) 32-bit down-counters with external event capture and pulse output - sustains timing functions in Deep Software Standby mode (<1 µA).
Realtime Clock (RTC) Calendar mode (2000–2099) with leap-year correction and binary mode - maintains accurate timekeeping during power loss with backup domain support.
USBFS with Internal Transceiver Full-speed device controller with 5 configurable pipes and integrated PHY - eliminates external USB PHY, reducing BOM cost and PCB area.

Applications

Industrial PLC I/O Module Smart Sensor Node

Use Scenario: Distributed I/O expansion unit with analog inputs, digital outputs, and fieldbus connectivity.

IC Role / Device Role / Timing Role: Central controller managing ADC sampling, PWM-driven solenoid control, CAN FD fieldbus communication, and RTC-synchronized logging.

Use Value: Integrated CAN FD and 12-bit ADC/DAC eliminate external interface ICs; TrustZone secures firmware updates over industrial networks.

Use Scenario: Battery-powered environmental sensor aggregating temperature, humidity, and air quality data.

IC Role / Device Role / Timing Role: Low-power host executing sensor fusion, BLE gateway logic (via UART), and scheduled wake-up using AGT and RTC.

Use Value: 40 KB SRAM buffers multi-sensor readings; Deep Software Standby with AGT wake-up achieves <1 µA average current.

USB-C Connected Test Equipment Motor Control Edge Gateway

Use Scenario: Portable calibration tool communicating with PC via USB Full-Speed for real-time waveform capture.

IC Role / Device Role / Timing Role: USBFS device controller interfacing with ADC12 and GPT16E for synchronized analog acquisition and timestamping.

Use Value: On-chip USB transceiver and 5-pipe endpoint support enable high-throughput bulk transfers without external PHY.

Use Scenario: BLDC motor drive with Hall-effect feedback, current sensing, and CAN-based command interface.

IC Role / Device Role / Timing Role: Real-time PWM generator (GPT16E × 6) with GTIU/GTIV/GTIW inputs and GTOUUP/GTOVLO outputs for 3-phase commutation.

Use Value: Hardware-accelerated motor control reduces CPU load; ELC links ADC triggers to GPT for precise current sampling alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6E2BB3CBB 256 KB code flash (vs. 128 KB), same 64-pin BGA package, identical peripherals and security features. Suitable where larger firmware image size or future feature expansion is required without changing PCB layout. Select when firmware growth headroom or field-upgrade capability is critical; no hardware changes needed.
R7FA6E2B93CFM LQFP-64 package (10 mm × 10 mm), same 128 KB flash, 40 KB SRAM, and -40°C to +105°C rating. Preferred for prototyping, manual assembly, or applications requiring easier rework and thermal management. Choose for development boards or cost-sensitive production where larger footprint is acceptable.

Compared with R7FA6E2B93CBB#BC0, R7FA6E2BB3CBB offers double flash capacity for complex firmware while maintaining pin and code compatibility, whereas R7FA6E2B93CFM trades BGA miniaturization for LQFP manufacturability-both preserve identical peripheral sets and TrustZone security implementation.

Availability

R7FA6E2B93CBB#BC0 is available at Aetrix Electronics and suitable for industrial automation, smart sensor nodes, and USB-connected test equipment requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R7FA6E2B93CBB#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for industrial, automotive, and IoT markets.

The RA6E2 Group is designed for cost-optimized, secure, and low-power general-purpose embedded applications - balancing performance (200 MHz Cortex-M33), rich connectivity (CAN FD, USBFS, QSPI), and robust security (TrustZone, TRNG) in compact packages.

FAQ

What is the maximum operating frequency of the R7FA6E2B93CBB#BC0?

The R7FA6E2B93CBB#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This is achieved via internal PLL configuration with supported clock sources including MOSC (8–24 MHz), HOCO, and external crystals. The 200 MHz performance enables real-time processing for motor control, sensor fusion, and protocol stacks without external acceleration.

Does the R7FA6E2B93CBB#BC0 support CAN FD, and what are its buffer capabilities?

Yes, the R7FA6E2B93CBB#BC0 integrates a CAN FD module compliant with ISO 11898-1, supporting both classical CAN and CAN FD frames up to 5 Mbps. It provides 4 dedicated transmit buffers and 32 receive buffers - sufficient for high-throughput industrial networking and automotive diagnostic applications without software-managed buffering overhead.

What package type and pin count does the R7FA6E2B93CBB#BC0 use?

The R7FA6E2B93CBB#BC0 uses a 64-pin BGA package (PLBG0064KB-A) with 5 mm × 5 mm dimensions and 0.5 mm pitch. It provides 45 general-purpose I/O pins, 5 dedicated input-only pins, and supports 5-V tolerance on 11 pins - optimized for space-constrained industrial and portable designs requiring high peripheral density.

How does the R7FA6E2B93CBB#BC0 implement hardware security?

The R7FA6E2B93CBB#BC0 implements Arm TrustZone® for hardware-enforced secure/non-secure world separation, with configurable memory regions (code flash, data flash, SRAM) and peripheral attribution. It also includes a True Random Number Generator (TRNG), 128-bit unique ID, secure pin multiplexing, and MPU_S/MPU_NS - enabling secure boot, encrypted firmware updates, and protected key storage without external security ICs.

Can the R7FA6E2B93CBB#BC0 operate in low-power modes, and which timers remain active?

Yes, the R7FA6E2B93CBB#BC0 supports multiple low-power modes including Deep Software Standby, where only the RTC, AGT timers, and wakeup-capable I/O remain active. Two 32-bit AGT timers retain full functionality - supporting external event capture, pulse generation, and periodic wake-up - enabling sub-1 µA average current in battery-operated sensor nodes while preserving timing accuracy.

R7FA6E2B93CBB#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LFBGA
Series:
RA6E2
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6E2B93CBB#BC0 FAQ

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Please submit a Request for Quotation (RFQ) for R7FA6E2B93CBB#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R7FA6E2B93CBB#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6E2B93CBB#BC0 is usually 5 days.

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R7FA6E2B93CBB#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA6E2B93CBB#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA6E2B93CBB#BC0?

For technical support, including R7FA6E2B93CBB#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6E2B93CBB#BC0 requirements.

6.How does Aetrix verify that R7FA6E2B93CBB#BC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6E2B93CBB#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2B93CBB#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6E2B93CBB#BC0?

All R7FA6E2B93CBB#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2B93CBB#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6E2B93CBB#BC0 part is unused and in its original packaging.

Return procedure for R7FA6E2B93CBB#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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