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Renesas R7FA6E2B93CBC#BC0

Part No.:
R7FA6E2B93CBC#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
36-LFBGA
Datasheet:
AetrixR7FA6E2B93CBC#BC0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 128K/40K
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,979

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Product details

Overview

R7FA6E2B93CBC#BC0 from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 128 KB code flash, 4 KB data flash, 40 KB SRAM, USB Full-Speed, CAN FD, QSPI, I3C, and dual 12-bit DACs. It targets industrial control, smart sensors, and connected edge devices requiring secure, low-power operation across -40°C to +105°C.

For engineers reviewing the R7FA6E2B93CBC#BC0 datasheet, R7FA6E2B93CBC#BC0 pinout, R7FA6E2B93CBC#BC0 application, or R7FA6E2B93CBC#BC0 equivalent, key selection criteria include its BGA36 package, TrustZone-enabled security partitioning, 20-pin I/O count with 5-V tolerant inputs, and integrated RTC with calendar mode - all confirmed in Rev.1.50 of R01DS0410EJ0150.

Technical Context

The R7FA6E2B93CBC#BC0 implements Armv8-M architecture with TrustZone, supporting secure/non-secure execution states and MPU regions for code (3), data flash (2), and SRAM (3). Its clock system integrates MOSC, SOSC, HOCO/MOCO/LOCO oscillators plus PLL, enabling precise timing control via CAC and dual watchdogs (WDT/IWDT).

Peripheral integration includes one CAN FD controller (4 TX/32 RX buffers), USBFS with internal transceiver (5-pipe support), QSPI for serial memory, SSIE for I2S/TDM audio, and two AGT timers for low-power event counting - all accessible through 20 GPIO pins in its 36-pin BGA package.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 200 MHz max; enables real-time deterministic control with TrustZone isolation.
Memory128 KB code flash (100k erase cycles), 4 KB data flash, 40 KB SRAM; supports firmware updates and data logging without external storage.
Operating Temp-40°C to +105°C; qualified for under-hood automotive and industrial environments without derating.
Package36-pin BGA (4 mm × 4 mm, 0.5 mm pitch); compact footprint ideal for space-constrained edge nodes.
I/O Count20 general-purpose I/O pins with 5-V tolerance on 5 pins; simplifies interface to legacy 5-V peripherals.
SecurityArm TrustZone, 128-bit unique ID, TRNG, secure pin mux; meets IEC 62443-3-3 SL2 requirements for secure boot and runtime attestation.
Analog12-bit ADC (12 channels), dual 12-bit DACs, on-die temperature sensor; enables closed-loop analog control and sensor signal conditioning.

Pinout & Package

Package: 36-pin BGA (PLBG0036KA-A), 4 mm × 4 mm, 0.5 mm pitch, exposed die pad (recommended VSS connection).

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual power domains: VCC (2.7–3.6 V) powers digital logic; VSS provides reference return path for all circuits.
XCIN / XCOUTSub-clock oscillator interfaceConnects to 32.768 kHz crystal for RTC calendar accuracy; XCIN must be pulled down in QFN32 but is functional here.
P213 / P212Main clock inputXTAL/EXTAL pins support 8–24 MHz crystal or external clock source for high-precision system timing.
P814 / P815USB differential pairIntegrated USBFS transceiver D+/D− pins; require 27 Ω series resistors and proper PCB impedance control.
P200 / P201General I/O / Mode controlP200 is dedicated input-only pin; P201 (MD) sets boot mode and must remain stable during reset release.
RESReset inputActive-low asynchronous reset; internal pull-up ensures valid state on power-up without external circuitry.
SWDIO / SWCLKDebug interface2-pin Serial Wire Debug interface enables full JTAG-like debugging and programming via standard CMSIS-DAP tools.

Key Features

FeatureDesign Value
TrustZone Security PartitioningEnables hardware-isolated secure firmware execution with configurable memory/peripheral attribution - critical for OTA update integrity.
QSPI Memory ControllerDirect interface to serial flash/FeRAM without CPU intervention; supports XIP and DMA transfers for fast firmware loading.
Dual 12-bit DAC OutputsIndependent voltage outputs (VREFH/VREFL referenced) for analog actuator control or calibration signal generation.
Realtime Clock with Calendar ModeHardware-accelerated Gregorian calendar (2000–2099) with leap-year correction; retains time in Deep Software Standby using standby SRAM.
Event Link Controller (ELC)Hardware routing of peripheral events (e.g., ADC end-of-conversion → GPT trigger) eliminates CPU polling and reduces latency.

Applications

Industrial PLC I/O ModuleSmart Building Sensor Node

Use Scenario: Compact remote I/O unit collecting analog sensor data and driving 4–20 mA actuators in factory automation cabinets.

IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, dual DAC output control, CAN FD fieldbus communication, and RTC-synchronized data logging.

Use Value: Integrated 12-bit ADC/DAC and CAN FD eliminate external signal-conditioning ICs and transceivers, reducing BOM cost by ~$1.20/unit.

Use Scenario: Battery-powered occupancy/motion sensor with environmental monitoring (temp/humidity) and BLE gateway handoff.

IC Role / Device Role / Timing Role: Low-power host processor executing sensor fusion, RTC wake-up scheduling, and USBFS-based firmware updates via maintenance port.

Use Value: 200 MHz Cortex-M33 delivers sufficient headroom for lightweight ML inference while TrustZone secures credential storage against physical tampering.

Automotive Body Control UnitMedical Diagnostic Handheld

Use Scenario: Under-hood module controlling HVAC fans, lighting, and door locks in entry-level vehicles with extended temperature range.

IC Role / Device Role / Timing Role: Safety-aware controller running ASIL-B software partitions, monitoring LVD thresholds, and managing CAN FD diagnostics.

Use Value: -40°C to +105°C rating and dual watchdogs (WDT + IWDT) meet AEC-Q100 Grade 2 requirements without external supervision ICs.

Use Scenario: Portable ECG/SpO₂ device requiring precise analog front-end control, USB charging, and secure patient data export.

IC Role / Device Role / Timing Role: Signal acquisition engine synchronizing ADC sampling, DAC reference calibration, and USBFS mass-storage-class data transfer.

Use Value: On-chip 12-bit DACs generate precision bias voltages for op-amp circuits, eliminating external DACs and trimming components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA6E2B93CFMLQFP-64 package (45 I/O), same 128 KB flash/SRAM, identical peripherals; larger footprint and higher pin count.Better suited for prototyping or designs requiring more GPIOs, UARTs, or debug access; not drop-in compatible due to package mismatch.Select when board layout allows 10 mm × 10 mm footprint and >30 I/O signals are needed.
R7FA6E2BB3CBCSame 36-pin BGA package, but 256 KB code flash and enhanced peripheral set (e.g., full 6× GPT16E vs. 4× in R7FA6E2B93CBC#BC0).Targeted at feature-rich edge nodes needing larger firmware image size or advanced motor control (BLDC commutation).Choose when future firmware expansion or additional PWM channels justify higher cost and flash density.

Compared with R7FA6E2B93CFM and R7FA6E2BB3CBC, the R7FA6E2B93CBC#BC0 offers optimal balance of compact BGA36 packaging, industrial temperature range, and essential connectivity (CAN FD, USBFS, QSPI) - making it the most cost-effective choice for volume production of space-constrained embedded controllers.

Availability

R7FA6E2B93CBC#BC0 is available at Aetrix Electronics and suitable for industrial PLC modules, smart building sensor nodes, automotive body control units, and medical diagnostic handhelds requiring stable component supply across extended temperature ranges.

Supply support for R7FA6E2B93CBC#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RA6E2 Group is designed for cost-sensitive, high-integration embedded applications demanding security, low power, and rich connectivity - targeting next-generation edge intelligence without premium pricing.

FAQ

What is the maximum operating frequency of the R7FA6E2B93CBC#BC0?

The R7FA6E2B93CBC#BC0 operates at a maximum CPU frequency of 200 MHz using its Arm Cortex-M33 core. This performance level is sustained across its full industrial temperature range (-40°C to +105°C) with appropriate voltage (2.7–3.6 V) and thermal design. The R7FA6E2B93CBC#BC0 achieves this via integrated PLL and multiple on-chip oscillators including HOCO and MOSC.

Does the R7FA6E2B93CBC#BC0 support CAN FD communication?

Yes, the R7FA6E2B93CBC#BC0 integrates a CAN with Flexible Data-Rate (CANFD) module compliant with ISO 11898-1. It supports both classical CAN frames and CAN FD frames, with 4 transmit buffers and 32 receive buffers. The R7FA6E2B93CBC#BC0's CANFD peripheral is accessible via dedicated CRX0/CTX0 pins and supports bit rates up to 5 Mbps in FD mode.

What package type does the R7FA6E2B93CBC#BC0 use?

The R7FA6E2B93CBC#BC0 uses a 36-pin BGA package (PLBG0036KA-A), measuring 4 mm × 4 mm with 0.5 mm pitch and an exposed die pad recommended for connection to VSS. This package provides 20 general-purpose I/O pins, 5-V tolerance on five inputs, and optimized thermal performance for dense PCB layouts.

How much flash and RAM memory does the R7FA6E2B93CBC#BC0 include?

The R7FA6E2B93CBC#BC0 includes 128 KB of code flash memory (with 100,000 program/erase cycles), 4 KB of data flash memory, and 40 KB of on-chip SRAM. It also features 1 KB of standby SRAM retained in Deep Software Standby mode and optional ECC/parity protection configurable per memory region.

Is the R7FA6E2B93CBC#BC0 TrustZone-enabled?

Yes, the R7FA6E2B93CBC#BC0 implements Arm TrustZone technology for hardware-enforced security isolation. It supports up to three secure regions in code flash, two in data flash, and three in SRAM, with individual secure/non-secure attribution for each peripheral. The R7FA6E2B93CBC#BC0 also includes a 128-bit unique ID and True Random Number Generator (TRNG) for cryptographic operations.

R7FA6E2B93CBC#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
36-LFBGA
Series:
RA6E2
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 4x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6E2B93CBC#BC0 FAQ

1.How can I place an order for R7FA6E2B93CBC#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7FA6E2B93CBC#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7FA6E2B93CBC#BC0 reliable?

The price and inventory of R7FA6E2B93CBC#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6E2B93CBC#BC0 is usually 5 days.

3.What payment methods are accepted for R7FA6E2B93CBC#BC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6E2B93CBC#BC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7FA6E2B93CBC#BC0?

R7FA6E2B93CBC#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA6E2B93CBC#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA6E2B93CBC#BC0?

For technical support, including R7FA6E2B93CBC#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6E2B93CBC#BC0 requirements.

6.How does Aetrix verify that R7FA6E2B93CBC#BC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6E2B93CBC#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2B93CBC#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6E2B93CBC#BC0?

All R7FA6E2B93CBC#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2B93CBC#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6E2B93CBC#BC0 part is unused and in its original packaging.

Return procedure for R7FA6E2B93CBC#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R7FA6E2B93CBC#BC0 Tags

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