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Renesas R7FA6E2BB2CBB#BC0
- Part No.:
- R7FA6E2BB2CBB#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LFBGA
- Datasheet:
-
R7FA6E2BB2CBB#BC0.pdf
- Description:
- MCU:RA
- Quantity:
- Payment:
- Shipping:
Inventory:3,920
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Product details
Overview
R7FA6E2BB2CBB from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 256 KB code flash, 4 KB data flash, and 40 KB SRAM. It integrates USB Full-Speed, CAN FD, Quad SPI, I3C, dual 12-bit DACs, 12-bit ADC with temperature sensor, and TrustZone® security - deployed in industrial HMI, motor control gateways, and smart sensor edge nodes.
For engineers reviewing the R7FA6E2BB2CBB datasheet, R7FA6E2BB2CBB pinout, R7FA6E2BB2CBB application, or R7FA6E2BB2CBB equivalent, this page delivers verified electrical specs, BGA-64 package mapping, secure peripheral configuration guidance, and real-world timing/performance constraints for production-grade firmware and PCB layout validation.
Technical Context
The R7FA6E2BB2CBB implements Armv8-M architecture with TrustZone® enabling hardware-isolated secure/non-secure execution states, supporting up to three secure regions in code flash and two in data flash. Its dual Systick timers (secure and non-secure) and CoreSight™ ETM-M33 enable deterministic real-time debugging and trace across security boundaries.
System-level timing is managed via multiple clock sources including MOSC (8–24 MHz), SOSC (32.768 kHz), HOCO/MOCO/LOCO oscillators, and PLL - with Clock Frequency Accuracy Measurement Circuit (CAC) providing on-the-fly oscillator calibration against reference clocks. The Event Link Controller (ELC) enables zero-CPU-intervention peripheral chaining between GPT, ADC, and DMA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max - delivers deterministic real-time control with TrustZone® isolation and PMSAv8 memory protection. |
| Memory | 256 KB code flash (100k erase cycles), 4 KB data flash, 40 KB SRAM - supports field firmware updates and runtime parameter storage without external EEPROM. |
| Connectivity | USB 2.0 Full-Speed (integrated transceiver), CAN FD (ISO 11898-1), QSPI (serial flash interface), I3C, dual SPI, dual SCI - enables mixed-protocol industrial gateway designs. |
| Analog Peripherals | 12-bit ADC12 (12 channels + temp sensor), dual 12-bit DAC12 - enables closed-loop analog signal generation and monitoring in motor control and sensor conditioning. |
| Timers & Control | GPT16E × 6 (BLDC PWM output with GTIOU/GTIOV/GTIOW pins), AGT × 2 (low-power 32-bit event timers), RTC with calendar mode - supports precise motor phase timing and battery-backed timekeeping. |
| Security | Arm TrustZone®, secure MPU (8 regions), 128-bit unique ID, TRNG - provides hardware root of trust for secure boot, encrypted firmware updates, and device identity binding. |
| Power & Environment | 2.7–3.6 V operation, -40°C to +85°C industrial grade, 64-pin BGA (5 mm × 5 mm, 0.5 mm pitch) - suitable for compact, thermally constrained embedded modules. |
Pinout & Package
Package: 64-pin BGA (PLBG0064KB-A), 5 mm × 5 mm, 0.5 mm pitch, exposed die pad (recommended to connect to VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: VCC (digital core), AVCC0/AVSS0 (analog), VCC_USB/VSS_USB (USB PHY) - require separate decoupling per domain. |
| P213/XTAL, P212/EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; EXTAL accepts external clock input - critical for USB and CANFD timing accuracy. |
| P814/USB_DP, P815/USB_DM | USB 2.0 Full-Speed differential pair | Integrated transceiver - no external PHY required; requires 27 Ω series resistors and controlled 90 Ω differential impedance routing. |
| CTX0, CRX0 | CAN FD transmit/receive | Direct connection to CAN transceiver; supports ISO 11898-1 compliant bit rates up to 5 Mbps - enables high-speed vehicle network edge nodes. |
| QSPCLK, QIO0–QIO3, QSSL | Quad SPI bus signals | Drives serial NOR flash (e.g., Winbond W25Qxx) at up to 80 MHz; QIO mode enables 4-bit parallel data transfer for fast firmware loading. |
| P000–P015, P100–P113, etc. | General-purpose I/O | 45 total I/O pins with 5-V tolerance on 11 pins, N-ch open-drain capability, and configurable pull-up - supports mixed-voltage sensor interfacing and level-shifting-free logic. |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone® Secure Partitioning | Hardware-enforced isolation of secure boot, cryptographic keys, and firmware update logic from non-secure application code - prevents unauthorized access to sensitive assets. |
| Event Link Controller (ELC) | Enables direct peripheral-to-peripheral triggering (e.g., ADC conversion completion → DMAC transfer start) without CPU involvement - reduces latency and frees CPU cycles. |
| Quad SPI Interface | Supports XIP (execute-in-place) from external serial flash - eliminates need for large internal RAM footprint during firmware execution. |
| Dual 12-bit DAC Outputs | Independent voltage outputs usable for analog sensor biasing, programmable reference generation, or audio waveform synthesis - no external DAC IC required. |
| Low-Power Asynchronous Timers (AGT) | 32-bit timers running from LOCO (32.768 kHz) in Deep Software Standby mode - enables wake-on-event functionality with sub-μA current draw. |
| USBFS with Integrated Transceiver | Full-speed USB device controller with on-die PHY and 5-pipe endpoint buffer - simplifies compliance testing and reduces BOM cost vs. external PHY solutions. |
Applications
| Industrial Motor Control Gateway | Smart Sensor Edge Node |
|---|---|
|
Use Scenario: Central controller aggregating CAN FD motor drives, USB-HID configuration interface, and analog feedback from current/voltage sensors. IC Role / Device Role / Timing Role: Real-time coordination of GPT16E PWM outputs (GTIOU/GTIOV/GTIOW), synchronized ADC sampling triggered by GPT, and CAN FD message scheduling. Use Value: Single-chip integration eliminates external timing ICs and reduces gate count; TrustZone® isolates motor safety logic from USB configuration stack. |
Use Scenario: Battery-powered environmental sensor node with temperature, humidity, and CO₂ sensing, transmitting data via USB or CAN FD to central hub. IC Role / Device Role / Timing Role: Low-power AGT timers manage wake intervals; ADC12 reads sensor outputs; TRNG seeds secure sensor data encryption before transmission. Use Value: 40 KB SRAM buffers multi-sensor readings; 2.7–3.6 V operation extends battery life; integrated USB enables field firmware updates without JTAG probe. |
| Human-Machine Interface (HMI) Terminal | Industrial Protocol Converter |
|
Use Scenario: Touch-enabled display panel with local UI rendering, USB host for flash drive firmware updates, and CAN FD communication with PLC backplane. IC Role / Device Role / Timing Role: USBFS handles mass storage class enumeration; QSPI executes GUI assets from external flash; SSIE drives audio alerts via I²S codec. Use Value: Dual 12-bit DACs generate analog audio tones; 64-pin BGA enables compact 4-layer PCB layout with minimal routing congestion. |
Use Scenario: Bridging legacy RS-485 Modbus devices to modern CAN FD networks in factory automation systems. IC Role / Device Role / Timing Role: SCI UART interfaces with Modbus RTU slaves; CANFD module formats and forwards messages; ELC links SCI receive interrupt to DMAC for zero-copy buffering. Use Value: Eliminates need for dual-MCU protocol bridge; 256 KB flash stores multiple protocol stacks; TrustZone® secures firmware update channel against tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6E2BB3CBB | Same package (64-pin BGA), identical peripherals, but rated for -40°C to +105°C and includes ECC on 8 KB of SRAM. | Required for extended-temperature industrial environments (e.g., under-hood automotive gateways, outdoor enclosures). | Select R7FA6E2BB3CBB when ambient operating temperature exceeds +85°C or ECC-critical data integrity is mandated. |
| R7FA6E2B92CBB | Same package and temperature grade (-40°C to +85°C), but reduced code flash (128 KB) and fewer ADC channels (4 vs. 12). | Suitable for cost-sensitive, lower-complexity edge nodes where full analog sensor count or firmware footprint is unnecessary. | Choose R7FA6E2B92CBB to reduce BOM cost while retaining identical pinout, peripheral set, and software compatibility for scaled-down designs. |
Compared with R7FA6E2BB2CBB, R7FA6E2BB3CBB adds extended temperature support and ECC-SRAM for mission-critical reliability, while R7FA6E2B92CBB offers a lower-cost entry point with reduced memory and analog resources - both maintain full software and pin compatibility for seamless design migration.
Availability
R7FA6E2BB2CBB is available at Aetrix Electronics and suitable for industrial motor control gateways, smart sensor edge nodes, HMI terminals, and protocol converter modules requiring stable component supply across long product lifecycles.
Supply support for R7FA6E2BB2CBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power management solutions for industrial, automotive, and IoT markets.
The RA6E2 Group targets cost-optimized, secure, and connectivity-rich embedded applications - designed to accelerate development of industrial edge devices with USB, CAN FD, and TrustZone®-enabled firmware security.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6E2BB2CBB?
The R7FA6E2BB2CBB features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. It implements the Armv8-M architecture with TrustZone® security extension and PMSAv8 memory protection, enabling hardware-isolated secure and non-secure execution environments. This architecture supports deterministic real-time performance and robust firmware security for industrial applications.
Does the R7FA6E2BB2CBB include integrated USB and CAN FD interfaces?
Yes, the R7FA6E2BB2CBB integrates a USB 2.0 Full-Speed module with an on-chip transceiver (supporting device mode and all USB 2.0 transfer types) and a CAN FD module compliant with ISO 11898-1. Both interfaces operate independently with dedicated buffers - USBFS supports up to 5 endpoints, and CAN FD provides 4 transmit and 32 receive buffers for high-throughput industrial networking.
What package type and pin count does the R7FA6E2BB2CBB use?
The R7FA6E2BB2CBB uses a 64-pin BGA package (PLBG0064KB-A) with 5 mm × 5 mm dimensions and 0.5 mm pitch. It provides 45 general-purpose I/O pins, 11 of which are 5-V tolerant, and includes dedicated pins for USB_DP/DM, CAN FD TX/RX, QSPI, and debug (SWDIO/SWCLK). The exposed die pad must be connected to VSS for thermal and electrical stability.
How does the R7FA6E2BB2CBB support low-power operation in battery-powered applications?
The R7FA6E2BB2CBB supports multiple low-power modes, including Deep Software Standby with AGT timers running from LOCO (32.768 kHz). In this mode, standby SRAM retains 1 KB of data, RTC maintains calendar time, and AGT can wake the system on external events or timer expiry - achieving sub-μA quiescent current. Voltage regulation and LVD monitoring further enhance battery longevity.
What analog peripherals are integrated into the R7FA6E2BB2CBB?
The R7FA6E2BB2CBB integrates a 12-bit successive approximation ADC12 with up to 12 input channels, on-die temperature sensor (TSN), and two independent 12-bit DAC12 outputs. The ADC supports internal reference and temperature sensor inputs; DAC outputs are rail-to-rail and support continuous waveform generation - enabling sensor signal conditioning, motor current feedback, and analog stimulus without external components.
R7FA6E2BB2CBB#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LFBGA
- Series:
- RA6E2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 40K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 12x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6E2BB2CBB#BC0 FAQ
1.How can I place an order for R7FA6E2BB2CBB#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6E2BB2CBB#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6E2BB2CBB#BC0 reliable?
The price and inventory of R7FA6E2BB2CBB#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6E2BB2CBB#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6E2BB2CBB#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6E2BB2CBB#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6E2BB2CBB#BC0?
R7FA6E2BB2CBB#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6E2BB2CBB#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6E2BB2CBB#BC0?
For technical support, including R7FA6E2BB2CBB#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6E2BB2CBB#BC0 requirements.
6.How does Aetrix verify that R7FA6E2BB2CBB#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6E2BB2CBB#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2BB2CBB#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6E2BB2CBB#BC0?
All R7FA6E2BB2CBB#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2BB2CBB#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6E2BB2CBB#BC0 part is unused and in its original packaging.
Return procedure for R7FA6E2BB2CBB#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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