Renesas R7FA6E2BB2CBC#BC0

Overview

R7FA6E2BB2CBC#BC0 from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 256 KB code flash, 4 KB data flash, 40 KB SRAM, USB Full-Speed, CAN FD, QSPI, I3C, and dual 12-bit DACs. It targets industrial control, smart sensors, and connected edge devices requiring secure, low-power real-time processing.

For engineers reviewing the R7FA6E2BB2CBC#BC0 datasheet, R7FA6E2BB2CBC#BC0 pinout, R7FA6E2BB2CBC#BC0 application, or R7FA6E2BB2CBC#BC0 equivalent, key selection criteria include its BGA36 package, -40°C to +85°C temperature grade, TrustZone security, 20 GPIO pins with 5-V tolerance, and integrated analog peripherals including ADC12 and DAC12.

Technical Context

The R7FA6E2BB2CBC#BC0 implements Armv8-M architecture with TrustZone, supporting secure/non-secure execution states and MPU regions for both code and data memory. Its clock system integrates MOSC (8–24 MHz), SOSC (32.768 kHz), HOCO/MOCO/LOCO oscillators, and PLL for flexible frequency synthesis up to 200 MHz.

Peripheral integration includes one CAN FD controller (4 TX/32 RX buffers), USBFS with internal transceiver, QSPI for external serial flash, SSIE for I2S/TDM audio, and two AGT timers with asynchronous operation for ultra-low-power wake-up - all accessible via 20 dedicated I/O pins in its 36-pin BGA package.

Key Specifications

Pinout & Package

Package: 36-pin BGA (PLBG0036KA-A), 4 mm × 4 mm, 0.5 mm pitch, exposed die pad (recommended VSS connection).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA6E2BB2CBC#BC0, R7FA6E2BB3CBC#BC0 adds thermal robustness without functional trade-offs, while R7FA6E2B92CBC#BC0 reduces flash capacity to lower cost - both retain identical I/O count, security features, and peripheral compatibility for seamless migration.

Availability

R7FA6E2BB2CBC#BC0 is available at Aetrix Electronics and suitable for industrial PLC modules, smart sensor nodes, USB-C edge gateways, and motor control reference designs requiring stable component supply across production lifecycles.

Supply support for R7FA6E2BB2CBC#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RA6E2 Group is designed for cost-optimized, secure, and low-power general-purpose microcontroller applications - balancing performance, peripheral richness, and energy efficiency for next-generation edge devices.

FAQ

What is the maximum operating frequency of the R7FA6E2BB2CBC#BC0?

The R7FA6E2BB2CBC#BC0 operates at a maximum CPU frequency of 200 MHz using its Arm Cortex-M33 core. This frequency is achieved via the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6E2BB2CBC#BC0 maintains this performance across its full -40°C to +85°C operating temperature range with appropriate voltage supply (2.7–3.6 V).

Does the R7FA6E2BB2CBC#BC0 support CAN FD communication?

Yes, the R7FA6E2BB2CBC#BC0 integrates a CAN with Flexible Data-Rate (CANFD) module compliant with ISO 11898-1. It supports both classical CAN frames and CAN FD frames with data rates up to 5 Mbps, includes 4 transmit buffers and 32 receive buffers, and uses dedicated CTX0/CRX0 pins. The R7FA6E2BB2CBC#BC0 requires no external transceiver for physical layer interfacing.

What package type and pin count does the R7FA6E2BB2CBC#BC0 use?

The R7FA6E2BB2CBC#BC0 uses a 36-pin BGA package (PLBG0036KA-A) with 4 mm × 4 mm dimensions and 0.5 mm pitch. It provides 20 general-purpose I/O pins, 5 of which support 5-V tolerance, along with dedicated pins for USB, CAN FD, QSPI, and debug interfaces. The exposed die pad is recommended to be connected to VSS for thermal and electrical stability.

How much flash and RAM memory does the R7FA6E2BB2CBC#BC0 include?

The R7FA6E2BB2CBC#BC0 includes 256 KB of on-chip code flash memory, 4 KB of data flash memory (rated for 100,000 program/erase cycles), and 40 KB of SRAM. The SRAM is partitioned into 32 KB with parity and 8 KB with ECC, and includes 1 KB of standby SRAM that retains data in Deep Software Standby mode - all accessible without external memory controllers.

Does the R7FA6E2BB2CBC#BC0 include hardware security features?

Yes, the R7FA6E2BB2CBC#BC0 incorporates Arm TrustZone technology for hardware-enforced secure/non-secure world separation, a secure Memory Protection Unit (MPU) with region-based access control, a 128-bit unique ID, and a True Random Number Generator (TRNG). These features enable secure boot, encrypted firmware updates, and runtime protection of sensitive assets - all implemented in silicon without software overhead.