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Renesas R7FA6E2BB3CBC#BC0

Part No.:
R7FA6E2BB3CBC#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
36-LFBGA
Datasheet:
AetrixR7FA6E2BB3CBC#BC0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 256K/40K
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,747

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Product details

Overview

R7FA6E2BB3CBC#BC0 from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 256 KB code flash, 4 KB data flash, and 40 KB SRAM. It integrates CAN FD, USB Full-Speed, QSPI, I3C, dual 12-bit DACs, 12-bit ADC with temperature sensor, and TrustZone security - deployed in industrial motor control, smart metering, and connected edge nodes requiring real-time deterministic response and secure firmware updates.

For engineers reviewing the R7FA6E2BB3CBC#BC0 datasheet, R7FA6E2BB3CBC#BC0 pinout, R7FA6E2BB3CBC#BC0 application, or R7FA6E2BB3CBC#BC0 equivalent, this page delivers verified technical context, package-specific pin mapping, functional alternatives, and supply-chain support for production design-in of a -40°C to +105°C rated 36-pin BGA MCU with integrated analog peripherals and automotive-grade CAN FD interface.

Technical Context

The R7FA6E2BB3CBC#BC0 implements Armv8-M architecture with TrustZone, enabling secure/non-secure execution environments with separate MPU regions (8 per domain), dual SysTick timers, and CoreSight ETM-M33 trace. Its clock system includes PLL, HOCO/MOCO/LOCO oscillators, and CAC for frequency accuracy validation.

Peripheral integration centers on deterministic real-time control: six GPT16E timers support BLDC motor PWM (GTOUUP/GTOULO etc.), two AGT timers operate asynchronously in low-power modes, and ELC enables CPU-free event routing between modules like ADC trigger → GPT capture → DMAC transfer.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 @ 200 MHz max - delivers deterministic real-time performance with hardware security extensions (TrustZone) and dual MPU domains.
Memory 256 KB code flash / 4 KB data flash / 40 KB SRAM - supports field firmware updates, parameter storage with 100k P/E cycles, and real-time buffer allocation.
Connectivity CAN FD (ISO 11898-1), USB 2.0 Full-Speed device, QSPI, I3C, 2× SPI, 2× SCI - enables robust industrial networking, host connectivity, and high-speed external memory expansion.
Analog 12-bit ADC12 (12 ch), 2× 12-bit DAC12, on-die temperature sensor - provides precision sensor interfacing and closed-loop analog control without external components.
Timers & Control 6× GPT16E (BLDC PWM outputs), 2× AGT (low-power async timing), RTC with calendar mode - supports motor commutation, battery-backed timekeeping, and wake-from-standby event sequencing.
Package & Environment 36-pin BGA (4 mm × 4 mm, 0.5 mm pitch), -40°C to +105°C operation - suitable for space-constrained industrial PCBs with extended thermal requirements.

Pinout & Package

Package: 36-pin BGA (PLBG0036KA-A), 4 mm × 4 mm, 0.5 mm pitch, exposed die pad (recommended connection to VSS).

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Dual power domains: VCC (2.7–3.6 V digital/analog), VSS (reference ground); decoupling required per datasheet layout guidelines.
XCIN / XCOUT Sub-clock oscillator interface 32.768 kHz crystal connection for RTC calendar mode; XCIN must be pulled down via resistor in QFN32 but is active in BGA36.
P201/MD Mode control input Configures boot mode (single-chip vs. SCI/USB/SWD); level must remain stable during reset release to avoid undefined state.
SWDIO / SWCLK Debug interface 2-pin Serial Wire Debug for programming and real-time trace; supports secure debug authentication when TrustZone is enabled.
USB_DP / USB_DM USB 2.0 Full-Speed transceiver Integrated PHY with internal termination; requires 27 Ω series resistors and proper USB layout for EMI compliance.
CTX0 / CRX0 CAN FD channel 0 Differential transmit/receive pins compliant with ISO 11898-1; require external CAN transceiver and common-mode choke for bus coupling.

Key Features

Feature Design Value
Arm TrustZone Security Hardware-enforced isolation between secure/non-secure firmware zones, with configurable flash/SRAM/peripheral attribution - enables secure bootloader, key storage, and OTA update verification.
Event Link Controller (ELC) Direct peripheral-to-peripheral signal routing (e.g., ADC end-of-conversion → GPT start → DMAC transfer) without CPU intervention - reduces latency and CPU load in real-time control loops.
Quad SPI Interface Memory controller supporting x4 I/O mode for serial flash/FeRAM with up to 64 MB address space - enables fast code shadowing and firmware image storage outside main flash.
Temperature Sensor (TSN) On-die sensor with linear output fed directly to ADC12 - allows real-time die temperature monitoring for thermal throttling or safety shutdown in motor drives and power supplies.
Low-Power Asynchronous Timers (AGT) Two 32-bit timers running independently on LOCO clock - sustain precise timing during Deep Software Standby (μA-level current) for wake-up scheduling and periodic sensor sampling.

Applications

Industrial Motor Control Smart Energy Metering

Use Scenario: Brushless DC motor drive in HVAC blowers or pump controllers requiring precise 3-phase PWM, current sensing, and thermal protection.

IC Role / Device Role / Timing Role: Real-time motor commutation engine using GPT16E PWM outputs (GTOUUP/GTOULO etc.), ADC-triggered current sampling, and TSN-based thermal monitoring.

Use Value: Integrated BLDC control logic eliminates external gate drivers and timing ICs; TrustZone secures firmware against unauthorized reprogramming in field-deployed units.

Use Scenario: DIN-rail mounted electricity meter with tariff switching, tamper detection, and PLC/GPRS backhaul communication.

IC Role / Device Role / Timing Role: System controller managing metrology ADC interface, RTC calendar for billing periods, CAN FD for local substation communication, and USB for field technician configuration.

Use Value: Single-chip solution replaces multi-IC meter designs; 4 KB data flash stores calibration coefficients and usage logs with 100k write endurance for lifetime data integrity.

Connected Edge Gateway Secure Industrial IoT Node

Use Scenario: Protocol-agnostic gateway aggregating Modbus RTU, CAN FD, and I3C sensor data for cloud upload via Ethernet/Wi-Fi.

IC Role / Device Role / Timing Role: Central protocol translator with USBFS for host PC interface, QSPI for local firmware storage, and ELC-synchronized data transfers between SCI/CANFD and DMAC buffers.

Use Value: Hardware-accelerated data movement reduces CPU overhead by >40% versus polling-based implementations; I3C support enables low-pin-count sensor fusion.

Use Scenario: Tamper-resistant sensor node in factory automation monitoring vibration, temperature, and power quality with encrypted telemetry.

IC Role / Device Role / Timing Role: Secure endpoint executing signed firmware, generating TRNG-based session keys, and isolating sensor acquisition (ADC/DAC) in non-secure domain while crypto runs in secure domain.

Use Value: TrustZone + 128-bit unique ID + TRNG meets IEC 62443-3-3 SL2 requirements for secure device identity and cryptographic key generation without external secure elements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6E2BB3CNE 48-pin QFN package, 29 I/O pins, same 256 KB flash/40 KB SRAM/200 MHz core Better thermal dissipation and easier hand-soldering; lacks BGA's board-area efficiency Select for prototyping or lower-volume production where reworkability and thermal headroom outweigh miniaturization needs.
R7FA6E2B93CBC 128 KB code flash (vs. 256 KB), identical 36-pin BGA package and peripheral set Suitable for cost-sensitive applications with smaller firmware footprints and no future feature expansion requirement Select when application firmware fits within 128 KB and long-term code growth is constrained; maintains full pin and software compatibility.

Compared with R7FA6E2BB3CBC#BC0, R7FA6E2BB3CNE offers greater thermal margin and accessibility at the cost of PCB area, while R7FA6E2B93CBC reduces flash capacity by 50% without altering package or peripheral functionality - enabling direct migration paths for volume cost optimization or development flexibility.

Availability

R7FA6E2BB3CBC#BC0 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, and secure industrial IoT node designs requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R7FA6E2BB3CBC#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The RA6E2 Group targets cost-optimized, secure, and scalable microcontrollers for industrial automation and edge intelligence - designed to deliver Arm Cortex-M33 performance with integrated analog, connectivity, and TrustZone security in compact packages.

FAQ

What is the maximum operating frequency and core architecture of the R7FA6E2BB3CBC#BC0?

The R7FA6E2BB3CBC#BC0 features an Arm Cortex-M33 core operating at up to 200 MHz, based on the Armv8-M architecture with TrustZone security extension. It implements PMSAv8 memory protection, dual SysTick timers (secure and non-secure), and CoreSight ETM-M33 trace - all confirmed in the R01DS0410EJ0150 datasheet Rev.1.50. This enables deterministic real-time execution with hardware-enforced security boundaries critical for industrial firmware integrity.

Which package type and pin count does the R7FA6E2BB3CBC#BC0 use?

The R7FA6E2BB3CBC#BC0 uses a 36-pin BGA package (PLBG0036KA-A), measuring 4 mm × 4 mm with 0.5 mm pitch and an exposed die pad recommended for connection to VSS. This matches the "BC" suffix in the part numbering scheme and is explicitly listed in Table 1.13 of the datasheet. The package supports 20 I/O pins, 4 pull-up resistors, and 5-V tolerant inputs on select pins.

Does the R7FA6E2BB3CBC#BC0 support CAN FD, and what are its interface requirements?

Yes, the R7FA6E2BB3CBC#BC0 integrates a CAN FD module compliant with ISO 11898-1, supporting both classical CAN and CAN FD frames with 4 transmit and 32 receive buffers. It requires an external CAN transceiver connected to the CTX0 (output) and CRX0 (input) pins, along with proper common-mode filtering and bus termination - as specified in Section 1.5 Pin Functions and Figure 1.6 of the R01DS0410EJ0150 datasheet.

What analog peripherals are integrated into the R7FA6E2BB3CBC#BC0?

The R7FA6E2BB3CBC#BC0 integrates a 12-bit successive approximation ADC12 with up to 12 input channels, two independent 12-bit DAC12 modules, and an on-die temperature sensor (TSN) whose output feeds directly into the ADC12. These are fully documented in Table 1.9 and Figure 1.1 of the R01DS0410EJ0150 datasheet, enabling sensor signal conditioning, closed-loop control, and thermal monitoring without external components.

How does the R7FA6E2BB3CBC#BC0 implement security features beyond TrustZone?

Beyond Arm TrustZone, the R7FA6E2BB3CBC#BC0 includes a 128-bit unique ID, True Random Number Generator (TRNG), secure pin multiplexing, and option-setting memory for boot configuration lockdown. These features are detailed in Table 1.11 and Section 1.1 of the R01DS0410EJ0150 datasheet - collectively enabling secure device identity, cryptographically strong key generation, and protection against unauthorized peripheral reconfiguration in field-deployed systems.

R7FA6E2BB3CBC#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
36-LFBGA
Series:
RA6E2
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 4x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6E2BB3CBC#BC0 FAQ

1.How can I place an order for R7FA6E2BB3CBC#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7FA6E2BB3CBC#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7FA6E2BB3CBC#BC0 reliable?

The price and inventory of R7FA6E2BB3CBC#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6E2BB3CBC#BC0 is usually 5 days.

3.What payment methods are accepted for R7FA6E2BB3CBC#BC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6E2BB3CBC#BC0 transactions.

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R7FA6E2BB3CBC#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA6E2BB3CBC#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA6E2BB3CBC#BC0?

For technical support, including R7FA6E2BB3CBC#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6E2BB3CBC#BC0 requirements.

6.How does Aetrix verify that R7FA6E2BB3CBC#BC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6E2BB3CBC#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2BB3CBC#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6E2BB3CBC#BC0?

All R7FA6E2BB3CBC#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2BB3CBC#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6E2BB3CBC#BC0 part is unused and in its original packaging.

Return procedure for R7FA6E2BB3CBC#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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