Renesas R7FA6E2BB3CFM#AA0
- Part No.:
- R7FA6E2BB3CFM#AA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R7FA6E2BB3CFM#AA0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 256KB/40
- Quantity:
- Payment:

- Shipping:

Inventory:484
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Product details
Overview
R7FA6E2BB3CFM from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 256 KB code flash, 4 KB data flash, and 40 KB SRAM. It integrates USB Full-Speed, CAN FD, Quad SPI, I3C, 12-bit ADC/DAC, and TrustZone security - deployed in industrial HMI, motor control, and secure IoT edge nodes.
For engineers reviewing the R7FA6E2BB3CFM datasheet, R7FA6E2BB3CFM pinout, R7FA6E2BB3CFM application, or R7FA6E2BB3CFM equivalent, this page delivers verified specifications, LQFP-64 pin mapping, real-world use cases, and two validated alternative parts for design flexibility and supply continuity.
Technical Context
The R7FA6E2BB3CFM implements Armv8-M with TrustZone, enabling secure/non-secure execution environments with separate MPU regions (8 per domain) and hardware-enforced peripheral attribution. Its dual Systick timers and CoreSight ETM-M33 support deterministic real-time scheduling and trace-based debugging.
System-level timing is managed via multiple clock sources - including MOSC (8–24 MHz), SOSC (32.768 kHz), HOCO/MOCO/LOCO oscillators, and PLL - with Clock Frequency Accuracy Measurement (CAC) for calibration-critical applications. The Event Link Controller (ELC) enables zero-CPU-intervention peripheral chaining between GPT, ADC, and DMA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max - delivers deterministic real-time performance with TrustZone isolation and PMSAv8 memory protection. |
| Memory | 256 KB code flash (100k erase cycles), 4 KB data flash, 40 KB SRAM - supports firmware updates, parameter storage, and real-time buffer handling. |
| Connectivity | USB 2.0 Full-Speed (integrated transceiver), CAN FD (4 Tx / 32 Rx buffers), QSPI (external serial flash interface), I3C (MIPI-compliant master/slave). |
| Analog Peripherals | 12-bit ADC12 (12 channels, temp sensor input), dual 12-bit DAC12 (independent outputs), on-die temperature sensor (linear VDIE vs. T). |
| Timers & Control | GPT16E × 6 (BLDC PWM with complementary outputs), AGT × 2 (32-bit low-power async timer), RTC with calendar mode (2000–2099, leap-year aware). |
| Security & Power | TrustZone (flash/SRAM/peripheral partitioning), TRNG, 128-bit UID, LVD (3 thresholds), Deep Software Standby with 1 KB retained SRAM. |
| Operating Range | VCC = 2.7–3.6 V; Ta = −40°C to +105°C - qualified for industrial-grade thermal and voltage resilience. |
Pinout & Package
Package: 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant Sn finish, exposed die pad recommended to connect to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core/analog power domains; decoupling required per datasheet layout guidelines (0.1 µF near VCC/VCL). |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; enables high-accuracy system clock and USB timing compliance. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar operation and low-power wake-up timing. |
| USB_DP / USB_DM | Integrated USB transceiver I/O | Full-Speed device-mode signaling; no external PHY required - simplifies BOM and PCB routing. |
| P000–P411 (45 I/O) | Programmable GPIO | 5-V tolerant on 11 pins; configurable pull-up, open-drain, and drive strength - supports mixed-voltage interfacing. |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin debug port supporting flash programming, real-time trace, and secure debug authentication. |
| CRX0 / CTX0 | CAN FD physical layer I/O | Differential bus interface compliant with ISO 11898-1; supports classical CAN and CAN FD frames up to 5 Mbps. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone Security | Hardware-isolated secure/non-secure worlds with configurable flash/SRAM/peripheral regions - enables secure boot, key storage, and firmware attestation. |
| Quad SPI Interface | Direct memory-mapped access to external serial flash (up to 133 MHz read speed) - eliminates software overhead for firmware/image loading. |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining (e.g., ADC conversion → DMA transfer → GPT update) - removes CPU polling and reduces latency jitter. |
| Temperature Sensor + ADC Integration | On-die TSN feeds directly into ADC12 channel - enables closed-loop thermal management without external components. |
| Low-Power Asynchronous Timers | AGT × 2 operate independently of main clock domain using LOCO (32.768 kHz) - sustains timing accuracy during deep sleep with sub-µA current draw. |
Applications
| Industrial HMI Panel | BLDC Motor Drive Controller |
|---|---|
|
Use Scenario: Touch-enabled factory display with local logic, USB configuration, and CAN FD fieldbus communication. IC Role / Device Role / Timing Role: Main application processor managing GUI rendering, USB device enumeration, and real-time CAN FD message scheduling. Use Value: Integrated USBFS and CANFD eliminate external transceivers; 200 MHz M33 ensures smooth 60 Hz UI refresh while servicing fieldbus traffic. |
Use Scenario: Compact 3-phase inverter for HVAC compressors requiring precise PWM timing and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motor control unit generating complementary 3-phase PWM (GTOUUP/GTOULO etc.) synchronized to ADC current sampling. Use Value: GPT16E hardware dead-time insertion and ADC-triggered PWM updates ensure safe switching; on-die TSN enables overtemperature shutdown without external sensors. |
| Secure Edge Gateway | Smart Energy Meter |
|
Use Scenario: Cellular-connected gateway aggregating Modbus/KNX data, performing local TLS encryption, and logging to external QSPI flash. IC Role / Device Role / Timing Role: Secure host controller executing encrypted firmware updates, managing QSPI memory mapping, and enforcing TrustZone policy boundaries. Use Value: 256 KB code flash stores dual-bank OTA images; TrustZone isolates crypto keys from application code; QSPI interface enables fast, wear-leveled logging. |
Use Scenario: DIN-rail meter with precision voltage/current measurement, RTC-based tariff switching, and optical/USB data export. IC Role / Device Role / Timing Role: System-on-chip handling metrology ADC sampling, calendar-aware billing logic, and USB mass-storage class data dumps. Use Value: 12-bit ADC12 with internal reference achieves ±0.5% linearity; RTC calendar mode (2000–2099) supports multi-decade tariff schedules; USBFS enables direct PC configuration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6E2BB2CBB | Same 64-pin BGA package, identical peripherals, but rated for −40°C to +85°C and 128 KB code flash. | Suitable for commercial/indoor environments where extended temperature range and larger flash are not required. | Select when cost sensitivity outweighs need for 105°C operation or 256 KB firmware headroom. |
| R7FA6E2B93CFM | Same LQFP-64 package and −40°C to +105°C rating, but with 128 KB code flash and reduced I/O count (45 → 32 usable pins). | Targeted at space-constrained designs with simpler peripheral requirements (e.g., no SSIE or second SPI). | Choose when application firmware fits in 128 KB and full 45-pin I/O is unnecessary - lowers BOM cost without sacrificing thermal grade. |
Compared with R7FA6E2BB3CFM, R7FA6E2BB2CBB trades flash capacity and temperature grade for lower cost in ambient environments, while R7FA6E2B93CFM reduces pin count and flash to optimize for compact, cost-sensitive deployments - both retain identical security, USB, CAN FD, and analog capabilities.
Availability
R7FA6E2BB3CFM is available at Aetrix Electronics and suitable for industrial HMI, BLDC motor control, and secure edge gateway applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6E2BB3CFM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for industrial, automotive, and IoT markets.
The RA6E2 Group targets cost-optimized, secure, and feature-rich general-purpose MCUs - designed specifically for industrial automation, smart appliances, and resource-constrained edge devices needing USB, CAN FD, and TrustZone without premium pricing.
FAQ
What is the maximum operating frequency of the R7FA6E2BB3CFM?
The R7FA6E2BB3CFM features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This is achieved using the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6E2BB3CFM maintains timing integrity across its full −40°C to +105°C operating range, with clock accuracy verified via the integrated Clock Frequency Accuracy Measurement Circuit (CAC).
Does the R7FA6E2BB3CFM support USB device functionality without external components?
Yes, the R7FA6E2BB3CFM integrates a full-featured USB 2.0 Full-Speed module (USBFS) with an on-chip transceiver. Pins USB_DP and USB_DM connect directly to the USB connector, eliminating the need for external PHY or level-shifting components. The module supports all USB 2.0 transfer types (control, bulk, interrupt, isochronous) and includes 5 configurable endpoints with dedicated buffer memory - fully implemented in the R7FA6E2BB3CFM silicon.
How many analog-to-digital converter channels does the R7FA6E2BB3CFM provide?
The R7FA6E2BB3CFM includes a 12-bit successive approximation ADC (ADC12) with up to 12 selectable analog input channels. Inputs include external signals (AN0n), internal temperature sensor output, and internal reference voltage - all accessible through the same ADC hardware. Channel selection, sampling time, and trigger sources (software, timer, or peripheral event) are fully configurable in the R7FA6E2BB3CFM's register set.
What security features are implemented in hardware on the R7FA6E2BB3CFM?
The R7FA6E2BB3CFM implements Arm TrustZone for Armv8-M at the silicon level, enabling secure/non-secure world separation with dedicated MPUs for each domain. Additional hardware security includes a True Random Number Generator (TRNG), 128-bit unique ID, secure pin multiplexing, and register write protection (PRCR). These features are intrinsic to the R7FA6E2BB3CFM die and require no external components to activate or maintain.
Which package type corresponds to the R7FA6E2BB3CFM part number suffix "FM"?
The suffix "FM" in R7FA6E2BB3CFM denotes the 64-pin LQFP package (PLQP0064KB-C), measuring 10 mm × 10 mm with 0.5 mm pitch. This package provides 45 general-purpose I/O pins, 5 dedicated input-only pins, and 11 5-V-tolerant inputs - confirmed in Renesas' official part numbering guide and datasheet Table 1.13. The R7FA6E2BB3CFM is not offered in QFN or BGA variants under this specific suffix.
R7FA6E2BB3CFM#AA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RA6E2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 40K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 12x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6E2BB3CFM#AA0 FAQ
1.How can I place an order for R7FA6E2BB3CFM#AA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6E2BB3CFM#AA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R7FA6E2BB3CFM#AA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6E2BB3CFM#AA0 is usually 5 days.
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6.How does Aetrix verify that R7FA6E2BB3CFM#AA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6E2BB3CFM#AA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2BB3CFM#AA0 meets industry standards.
7.What is the process for return or replacement of R7FA6E2BB3CFM#AA0?
All R7FA6E2BB3CFM#AA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2BB3CFM#AA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6E2BB3CFM#AA0 part is unused and in its original packaging.
Return procedure for R7FA6E2BB3CFM#AA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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