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Renesas R7FA6E2BB3CNH#BA0

Part No.:
R7FA6E2BB3CNH#BA0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
32-WFQFN Exposed Pad
Datasheet:
AetrixR7FA6E2BB3CNH#BA0.pdf
Description:
MCU:RA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,920

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Product details

Overview

R7FA6E2BB3CNH from Renesas is a 32-bit Arm® Cortex®-M33 microcontroller operating at up to 200 MHz, featuring 256 KB code flash, 4 KB data flash, and 40 KB SRAM. It integrates USB Full-Speed, CAN FD, Quad SPI, I3C, 12-bit ADC/DAC, and TrustZone security - deployed in industrial HMI, smart sensor nodes, and low-power gateway controllers.

For engineers reviewing the R7FA6E2BB3CNH datasheet, R7FA6E2BB3CNH pinout, R7FA6E2BB3CNH application, or R7FA6E2BB3CNH equivalent, this page delivers verified package mapping (32-pin QFN), validated peripheral set, confirmed security architecture (TrustZone with 3 flash/SRAM regions), and real-world timing & interface constraints for rapid schematic integration and firmware bring-up.

Technical Context

The R7FA6E2BB3CNH implements Armv8-M with TrustZone, supporting secure/non-secure execution states with separate MPU configurations (8 regions each) and dual SysTick timers. Its clock system includes MOSC (8–24 MHz), SOSC (32.768 kHz), HOCO/MOCO/LOCO oscillators, and PLL - enabling precise frequency synthesis and low-power operation down to Deep Software Standby mode.

Peripheral interconnect uses Event Link Controller (ELC) for CPU-free signal routing between GPT, ADC, AGT, and RTC; DMA support includes 8-channel DMAC and DTC for autonomous data movement. Analog subsystem comprises 12-bit ADC12 (12 channels), two 12-bit DAC12 outputs, and on-die temperature sensor (TSN) with linear voltage output referenced to VREFH0/VREFL0.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 @ 200 MHz max - enables real-time deterministic control with hardware floating-point and DSP extensions.
Memory 256 KB code flash (100k erase cycles), 4 KB data flash, 40 KB SRAM - supports field firmware updates and buffered sensor data logging.
Operating Voltage 2.7–3.6 V - compatible with standard 3.3 V industrial power rails and battery-backed systems.
Temperature Range −40°C to +105°C - qualified for under-hood automotive, factory automation, and outdoor edge devices.
Connectivity USBFS (device-only), CAN FD (ISO 11898-1), QSPI, I3C, 2×SCI, 2×SPI, SSIE, CEC - enables mixed-protocol edge node connectivity.
Analog Peripherals ADC12 (12 ch, 12-bit), DAC12 ×2, TSN - allows local analog sensing, actuator control, and thermal monitoring without external ICs.
Security Arm TrustZone, 128-bit unique ID, TRNG, secure pin mux - provides hardware-enforced isolation for secure boot and credential storage.

Pinout & Package

Package: 32-pin QFN (5 mm × 5 mm, 0.5 mm pitch), exposed die pad (recommended to connect to VSS). Pin count and I/O allocation match Table 1.13 and Figure 1.7: 16 general-purpose I/O pins, 5 input-only pins, 17 pull-up resistors, 16 N-ch open-drain outputs, and 4 pins with 5-V tolerance.

Pin/Terminal Circuit Role Design Meaning
P000–P015 General-purpose I/O Configurable as GPIO, peripheral function (SCI/I3C/SPI/CANFD/USB/QSPI/SSIE/CEC), or interrupt source; 4 pins support 5-V tolerant inputs.
VCC / VSS Power supply / Ground Dual VCC (digital) and AVCC0 (analog) pins require local 0.1 µF decoupling; VSS and AVSS0 must be connected to common ground plane.
VREFH0 / VREFL0 Analog reference Independent reference for ADC12 - VREFH0 connects to AVCC0 when internal reference used; VREFL0 ties to AVSS0.
USB_DP / USB_DM USB 2.0 Full-Speed differential pair Integrated transceiver - requires 27 Ω series resistors and 1.5 kΩ pull-up on DP per USB specification; no external PHY needed.
XTAL / EXTAL Main crystal oscillator interface Supports 8–24 MHz crystals; EXTAL accepts external clock; XCIN/XCOUT not available on QFN32 per datasheet note.
SWDIO / SWCLK Serial Wire Debug interface Enables programming and real-time debugging via J-Link or CMSIS-DAP; no additional UART bootloader required.

Key Features

Feature Design Value
Arm TrustZone Security Hardware-isolated secure world with configurable flash/SRAM regions and peripheral attribution - enables secure boot, encrypted OTA, and key vaulting.
Event Link Controller (ELC) Direct hardware-triggered peripheral chaining (e.g., ADC conversion start → GPT capture → DMAC transfer) eliminates CPU polling overhead.
Low-Power Asynchronous Timers (AGT) Two independent 32-bit timers running on LOCO (32.768 kHz) - maintain timing accuracy during deep sleep modes with sub-millisecond resolution.
Quad SPI Interface (QSPI) Memory controller supporting serial flash/EEPROM/FeRAM - enables XIP execution and fast firmware image loading without external parallel memory.
USB Full-Speed Device On-chip transceiver with 5-pipe endpoint support - simplifies HID, CDC, or MSC class implementations without external USB PHY or level shifters.

Applications

Industrial HMI Panel Smart Sensor Node

Use Scenario: Touch-enabled display with local data processing and CAN FD fieldbus communication in factory machinery.

IC Role / Device Role / Timing Role: Main controller executing GUI rendering, sensor fusion, and real-time CAN FD messaging with deterministic 200 MHz timing.

Use Value: Integrated QSPI enables fast UI asset loading; TrustZone isolates firmware update logic from runtime application code.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and vibration using onboard ADC and TSN.

IC Role / Device Role / Timing Role: Low-power sensor aggregator with AGT-driven wake-up, ADC sampling, and USB/CAN FD data upload.

Use Value: 40 KB SRAM buffers multi-sensor readings; 2.7–3.6 V operation extends battery life; 105°C rating supports harsh enclosures.

Edge Gateway Controller BLDC Motor Control Module

Use Scenario: Protocol translator bridging I3C sensors, USB peripherals, and CAN FD field networks in building automation.

IC Role / Device Role / Timing Role: Protocol-aware bridge managing concurrent I3C master, USB device, and CAN FD host operations.

Use Value: Dual SCI + I3C + CAN FD + USBFS eliminates need for companion protocol ICs; ELC synchronizes cross-interface events.

Use Scenario: Compact motor driver board controlling 3-phase BLDC motors using hall-effect feedback and PWM generation.

IC Role / Device Role / Timing Role: Real-time motion controller generating synchronized 3-phase PWM (GTOUUP/GTOULO etc.) with hall sensor input capture.

Use Value: Six GPT16E timers provide independent PWM channels; GTIU/GTIV/GTIW inputs directly interface hall sensors without external logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6E2B93CNH 128 KB code flash, same 32-pin QFN package and peripheral set. Suitable for cost-sensitive designs with smaller firmware footprints and no field-upgrade requirements. Select when firmware size ≤128 KB and data flash retention cycles are not critical.
R7FA6M2AF3CFM 64-pin LQFP, 512 KB flash, FPU, higher SRAM (256 KB), Ethernet MAC. Targeted at networked industrial controllers requiring TCP/IP stack and larger code space. Choose for Ethernet-connected applications needing >256 KB flash and floating-point math acceleration.

Compared with R7FA6E2BB3CNH, R7FA6E2B93CNH reduces flash capacity but maintains identical low-power features and pinout for drop-in replacement in resource-constrained designs; R7FA6M2AF3CFM expands connectivity and compute headroom at the cost of larger footprint and higher BOM cost.

Availability

R7FA6E2BB3CNH is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, and edge gateway controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R7FA6E2BB3CNH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RA6E2 Group targets cost-optimized, secure, low-power embedded applications - designed for rapid development of scalable, certified edge devices with minimal external components.

FAQ

What is the maximum operating frequency of the R7FA6E2BB3CNH?

The R7FA6E2BB3CNH operates at a maximum CPU frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the on-chip PLL driven by the main crystal oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6E2BB3CNH datasheet confirms this rating across the full −40°C to +105°C temperature range under 2.7–3.6 V supply conditions.

Does the R7FA6E2BB3CNH support USB device functionality without an external PHY?

Yes, the R7FA6E2BB3CNH integrates a full USB 2.0 Full-Speed transceiver (USBFS module) with on-die termination and differential signaling. It supports all USB 2.0 transfer types (control, bulk, interrupt, isochronous) and requires only external 27 Ω series resistors on USB_DP/USB_DM - no external PHY or level shifter is needed for standard USB device operation.

How many analog input channels does the ADC12 support on the R7FA6E2BB3CNH?

The R7FA6E2BB3CNH includes a 12-bit successive approximation ADC12 with up to 12 selectable analog input channels (AN0n). These channels accept signals referenced to VREFH0/VREFL0 and include dedicated inputs for the on-die temperature sensor (TSN) and internal reference voltage - all accessible in the 32-pin QFN package per the pin list in R01DS0410EJ0150.

Is TrustZone security implemented in hardware on the R7FA6E2BB3CNH?

Yes, TrustZone for Armv8-M is implemented in silicon on the R7FA6E2BB3CNH. It provides hardware-enforced isolation between secure and non-secure worlds, including configurable memory regions (up to three in code flash, two in data flash, three in SRAM) and individual peripheral security attribution - all documented in the R7FA6E2BB3CNH security chapter and verified in the RA6E2 Group reference manual.

What package type and pin count does the R7FA6E2BB3CNH use?

The R7FA6E2BB3CNH uses a 32-pin QFN package (5 mm × 5 mm, 0.5 mm pitch) with an exposed die pad. This matches the "NH" suffix in the part number and is confirmed in Table 1.13 and Figure 1.7 of the R01DS0410EJ0150 datasheet. It provides 16 general-purpose I/O pins, 4 with 5-V tolerance, and dedicated pins for USB, CAN FD, QSPI, and debug interfaces.

R7FA6E2BB3CNH#BA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
32-WFQFN Exposed Pad
Series:
RA6E2
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6E2BB3CNH#BA0 FAQ

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6.How does Aetrix verify that R7FA6E2BB3CNH#BA0 is sourced from the original manufacturer or authorized distributors?

All R7FA6E2BB3CNH#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6E2BB3CNH#BA0 meets industry standards.

7.What is the process for return or replacement of R7FA6E2BB3CNH#BA0?

All R7FA6E2BB3CNH#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6E2BB3CNH#BA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6E2BB3CNH#BA0 part is unused and in its original packaging.

Return procedure for R7FA6E2BB3CNH#BA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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