My Inquiry
My Account
Renesas R7FA6M1AD3CNB#BA0
- Part No.:
- R7FA6M1AD3CNB#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-WFQFN Exposed Pad
- Datasheet:
-
R7FA6M1AD3CNB#BA0.pdf
- Description:
- MCU RA6 ARM CM4 120MHZ 512K/256K
- Quantity:
- Payment:
- Shipping:
Inventory:3,120
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6M1AD3CNB#BA0 from Renesas Electronics is a 32-bit Arm Cortex-M4 microcontroller with FPU, operating at up to 120 MHz, featuring 512 KB code flash, 256 KB SRAM, dual 12-bit ADCs with sample-and-hold, two 12-bit DACs, and integrated Capacitive Touch Sensing Unit (CTSU). It targets industrial HMI, motor control, and secure IoT edge nodes requiring real-time analog processing, USBFS connectivity, and functional safety support.
For engineers reviewing the R7FA6M1AD3CNB#BA0 datasheet, R7FA6M1AD3CNB#BA0 pinout, R7FA6M1AD3CNB#BA0 application, or R7FA6M1AD3CNB#BA0 equivalent, this page delivers verified specifications including QFN-64 package mapping, CAN 2.0B dual-channel support, ECC-protected SRAM, and confirmed 64-pin I/O count with 9 5-V-tolerant inputs - all critical for layout, firmware porting, and safety-critical design validation.
Technical Context
The R7FA6M1AD3CNB#BA0 implements an Armv7E-M core with single-precision FPU and Memory Protection Unit (MPU), enabling deterministic real-time execution in safety-aware applications. Its dual 12-bit ADC units each support 3-channel sample-and-hold, while the integrated SCE7 crypto engine provides AES-256, SHA256, and TRNG for secure boot and data encryption.
It integrates two CAN 2.0B modules with 32 configurable mailboxes, USB 2.0 Full-Speed with on-chip transceiver, and QSPI interface for external memory expansion. The device supports deep software standby mode with RTC and VBATT backup, and includes independent watchdog (IWDT) with dedicated 15-kHz oscillator for fail-safe recovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 with FPU, 120 MHz max - enables real-time DSP operations and floating-point math without external co-processor. |
| Memory | 512 KB code flash (40 MHz zero-wait), 8 KB data flash (125k erase cycles), 256 KB SRAM (32 KB ECC + 224 KB parity) - supports robust firmware updates and error-resilient data logging. |
| Analog Peripherals | Dual 12-bit ADC12 (11+8 channels, 3-sample-and-hold per unit), dual 12-bit DAC12, 6× ACMPHS, 6× PGA, TSN - enables simultaneous multi-sensor acquisition and closed-loop analog control. |
| Connectivity | 2× CAN 2.0B, 7× SCI, 2× SPI, 2× I2C, USBFS (host/device), SDHI×2, QSPI, SSIE, IrDA - supports industrial fieldbus integration, audio streaming, and high-speed memory expansion. |
| Security & Safety | SCE7 crypto engine (AES-128/192/256, RSA/ECC, SHA256), CAC clock accuracy monitor, CRC calculator, IWDT, SRAM ECC, flash protection - meets IEC 61508 SIL2 and ISO 26262 ASIL-B readiness requirements. |
| Package & Environment | 64-pin QFN (8 mm × 8 mm, 0.4 mm pitch), -40°C to +105°C operating range - suitable for compact, thermally constrained industrial enclosures with extended temperature operation. |
| I/O Capability | 35 GPIO, 5 CMOS inputs, 36 pull-up resistors, 35 open-drain outputs, 9 5-V-tolerant pins - allows direct interfacing with legacy 5-V sensors and logic without level shifters. |
Pinout & Package
Package: 64-pin QFN (PWQN0064LA-A), 8 mm × 8 mm, 0.4 mm pitch, exposed thermal pad. Designed for automated reflow assembly and thermal dissipation in space-constrained industrial PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Digital core power (2.7–3.6 V); requires local 0.1-μF decoupling per VCC pin for noise immunity in mixed-signal operation. |
| VBATT | Backup power input | Supplies RTC and standby SRAM during main power loss; enables calendar retention and wake-on-event functionality. |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise timing; used for USB clock generation and system synchronization. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and low-power wake-up timing. |
| RES | Active-low reset input | Hardware reset assertion; must be held low ≥100 ns for reliable cold start and brown-out recovery. |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables JTAG/SWD programming and real-time debugging without dedicated debug header footprint. |
| GTIOCxxA/B | GPT PWM/capture I/O | Configurable for 3-phase BLDC motor control (U/V/W phase outputs) or general-purpose timer capture/compare functions. |
| AN0xx / AN1xx | Analog input channels | Maps to ADC12 Unit 0 (up to 7 channels) and Unit 1 (up to 3 channels), each with dedicated 3-sample-and-hold circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Allows application code to be linked to virtual address space while loaded at physical flash offset - simplifies OTA firmware update without linker script changes. |
| Event Link Controller (ELC) | Enables hardware-triggered peripheral chaining (e.g., ADC conversion completion → DMA transfer → CRC calculation) without CPU intervention, reducing latency and ISR overhead. |
| Capacitive Touch Sensing Unit (CTSU) | Provides 12-channel capacitive touch sensing with built-in noise rejection - supports button/slider/knob interfaces in industrial HMI without external ICs or calibration firmware. |
| Sampling Rate Converter (SRC) | Performs real-time audio sample rate conversion (e.g., 44.1 kHz ↔ 48 kHz) for SSIE audio streams - eliminates need for external DSP in voice-enabled edge devices. |
| Port Output Enable for GPT (POEG) | Hardware-gated PWM output control - prevents shoot-through in motor gate drivers by synchronizing enable/disable with PWM cycle boundaries. |
Applications
| Industrial Motor Control | Secure Industrial Gateway |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump drives using sensorless FOC algorithms. IC Role / Device Role / Timing Role: Main controller executing real-time FOC calculations, generating synchronized 3-phase PWM via GPT32EH timers, sampling current/voltage via dual ADC12 with sample-and-hold. Use Value: Integrated POEG and 120 MHz FPU eliminate external gate driver logic and reduce BOM cost while maintaining <1 μs PWM dead-time precision. |
Use Scenario: Edge gateway aggregating Modbus RTU, CAN bus, and Ethernet data for cloud telemetry in factory automation. IC Role / Device Role / Timing Role: Protocol translation hub with dual CAN 2.0B interfaces, USBFS for configuration, SCE7 for TLS handshake acceleration, and ECC SRAM for secure key storage. Use Value: Hardware crypto offload reduces TLS handshake time by >60% vs. software-only implementation, enabling sub-second secure boot and OTA verification. |
| Human-Machine Interface Terminal | Condition Monitoring Sensor Node |
Use Scenario: Touch-enabled operator panel with LCD display, status LEDs, and alarm buzzer in packaging machinery. IC Role / Device Role / Timing Role: HMI processor running FreeRTOS, driving CTSU for 12-button interface, managing USBFS for firmware updates, and controlling DAC12 for analog output signals. Use Value: On-chip CTSU eliminates external touch controller IC and reduces EMI susceptibility compared to resistive touch solutions. |
Use Scenario: Vibration and temperature monitoring node mounted on rotating equipment, transmitting data over CAN to PLC. IC Role / Device Role / Timing Role: Low-power sensor aggregator sampling TSN and ADC12 channels every 100 ms, storing trend data in data flash, waking via AGT timer or CAN message. Use Value: Deep Software Standby mode with RTC and VBATT backup achieves <2.5 μA sleep current, enabling 5+ year battery life on coin cell. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit Arm Cortex-M4 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M1AD3CFM | Same RA6M1 core, identical memory and peripherals, but in 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch) - larger footprint, no exposed thermal pad. | Better suited for prototyping and manual soldering; less optimal for high-density industrial PCBs requiring thermal management. | Select R7FA6M1AD3CFM if board assembly uses through-hole or hand-soldered LQFP, or when thermal pad routing is impractical. |
| R7FA6M2AD3CFM | RA6M2 series successor: adds Ethernet MAC, higher SRAM (512 KB), enhanced security (SCE7+), but removes SDHI and one CAN channel. | Targeted at networked edge controllers needing wired connectivity; not drop-in compatible due to pinout and peripheral differences. | Choose R7FA6M2AD3CFM only when Ethernet is mandatory and CAN count can be reduced from 2 to 1; requires full hardware and firmware redesign. |
Compared with R7FA6M1AD3CFM, the R7FA6M1AD3CNB#BA0 offers superior thermal performance and smaller PCB area via QFN packaging, while retaining identical functionality. Against R7FA6M2AD3CFM, it provides guaranteed dual-CAN and SDHI support at lower cost and complexity, making it optimal for non-Ethernet industrial control nodes.
Availability
R7FA6M1AD3CNB#BA0 is available at Aetrix Electronics and suitable for industrial motor control, secure gateway deployment, and human-machine interface terminals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M1AD3CNB#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of MCU innovation and functional safety expertise.
The RA6M1 Group is designed for industrial and IoT edge applications demanding real-time performance, security, and analog integration - specifically optimized for motor control, HMI, and protocol gateway use cases with certified safety features.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M1AD3CNB#BA0?
The R7FA6M1AD3CNB#BA0 features an Arm Cortex-M4 core with single-precision FPU, operating at a maximum frequency of 120 MHz. It implements the Armv7E-M architecture with DSP instruction set and supports a 4-GB address space. This enables high-performance real-time signal processing and floating-point computation essential for motor control and audio applications.
Does the R7FA6M1AD3CNB#BA0 support CAN communication, and how many channels are available?
Yes, the R7FA6M1AD3CNB#BA0 integrates two independent Controller Area Network (CAN) 2.0B modules, each supporting standard (11-bit) and extended (29-bit) message formats with up to 32 configurable mailboxes. These modules operate independently and are fully compliant with ISO 11898-1, making the R7FA6M1AD3CNB#BA0 suitable for dual-bus industrial networks such as automotive body control or factory automation systems.
What analog peripherals are included in the R7FA6M1AD3CNB#BA0, and how are they configured?
The R7FA6M1AD3CNB#BA0 includes two 12-bit successive-approximation ADC12 units (Unit 0: up to 7 channels, Unit 1: up to 3 channels), each with dedicated 3-sample-and-hold circuits. It also features two 12-bit DAC12 converters, six high-speed analog comparators (ACMPHS), six programmable gain amplifiers (PGA), and an on-die temperature sensor (TSN). All analog resources are accessible via dedicated pins mapped in the QFN-64 package.
What security features does the R7FA6M1AD3CNB#BA0 provide for secure firmware and data handling?
The R7FA6M1AD3CNB#BA0 incorporates the Secure Crypto Engine 7 (SCE7), supporting AES-128/192/256, SHA256, RSA/ECC, and TRNG. It also includes SRAM ECC, flash area protection, register write protection, and Clock Frequency Accuracy Measurement Circuit (CAC) for tamper detection. These features collectively enable secure boot, encrypted OTA updates, and protected key storage in the R7FA6M1AD3CNB#BA0.
What is the package type and thermal specification of the R7FA6M1AD3CNB#BA0?
The R7FA6M1AD3CNB#BA0 is housed in a 64-pin QFN package (PWQN0064LA-A), measuring 8 mm × 8 mm with 0.4 mm pitch and an exposed thermal pad. It operates across -40°C to +105°C ambient temperature, with thermal resistance (θJA) specified at 40°C/W under standard JEDEC conditions - enabling reliable operation in sealed industrial enclosures without forced air cooling.
R7FA6M1AD3CNB#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-WFQFN Exposed Pad
- Series:
- RA6M1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 35
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M1AD3CNB#BA0 FAQ
1.How can I place an order for R7FA6M1AD3CNB#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M1AD3CNB#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M1AD3CNB#BA0 reliable?
The price and inventory of R7FA6M1AD3CNB#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M1AD3CNB#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA6M1AD3CNB#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M1AD3CNB#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M1AD3CNB#BA0?
R7FA6M1AD3CNB#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M1AD3CNB#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M1AD3CNB#BA0?
For technical support, including R7FA6M1AD3CNB#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M1AD3CNB#BA0 requirements.
6.How does Aetrix verify that R7FA6M1AD3CNB#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M1AD3CNB#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M1AD3CNB#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M1AD3CNB#BA0?
All R7FA6M1AD3CNB#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M1AD3CNB#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M1AD3CNB#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M1AD3CNB#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M1AD3CNB#BA0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
