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Renesas R7FA6M2AD3CLK#AC0
- Part No.:
- R7FA6M2AD3CLK#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 145-TFLGA
- Datasheet:
-
R7FA6M2AD3CLK#AC0.pdf
- Description:
- RA_FAMILY-2
- Quantity:
- Payment:
- Shipping:
Inventory:416
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Product details
Overview
R7FA6M2AD3CLK#AC0 from Renesas is a 32-bit Arm Cortex-M4 microcontroller with FPU, operating at up to 120 MHz, featuring 512 KB code flash, 32 KB data flash, and 384 KB SRAM. It integrates Ethernet MAC (ETHERC), dual CAN, USB 2.0 Full-Speed with on-chip transceiver, dual SDHI, QSPI, and security features including AES-256 and SCE7 crypto engine - deployed in industrial gateways requiring deterministic real-time control and secure network edge processing.
For engineers reviewing the R7FA6M2AD3CLK#AC0 datasheet, R7FA6M2AD3CLK#AC0 pinout, R7FA6M2AD3CLK#AC0 application, or R7FA6M2AD3CLK#AC0 equivalent, key selection considerations include its -40°C to +105°C extended temperature rating, 145-pin LGA package, dual 12-bit ADC units (20-channel total), and hardware-accelerated cryptographic operations supporting TLS/DTLS stack offload in resource-constrained IoT nodes.
Technical Context
This MCU implements an Armv7E-M architecture with DSP extensions and single-precision FPU for signal-intensive tasks like motor control and audio preprocessing. Its memory subsystem includes ECC-protected SRAM (32 KB), parity-checked SRAM (352 KB), and Memory Mirror Function (MMF) enabling flexible firmware update schemes without address remapping.
The system-level architecture integrates Event Link Controller (ELC) for autonomous peripheral chaining, dual DMA controllers (DMAC × 8 + DTC), and safety mechanisms including CAC clock accuracy monitoring, IWDT with dedicated 15 kHz oscillator, and ADC self-diagnosis - all aligned with IEC 61508 SIL2-ready design requirements for industrial automation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU, 120 MHz max - enables real-time FFT and PID loop execution within sub-μs latency. |
| Flash Memory | 512 KB code flash (zero wait states @40 MHz) + 32 KB data flash (125k erase/write cycles) - supports field firmware updates with wear leveling. |
| SRAM | 384 KB on-chip SRAM (32 KB ECC + 352 KB parity) - ensures data integrity for safety-critical buffers and stack protection. |
| Operating Temp | -40°C to +105°C - qualified for under-hood automotive ECUs and industrial PLC backplanes without derating. |
| Analog Peripherals | Dual 12-bit ADC (20-channel total, 3 S/H circuits), dual 12-bit DAC, 6 ACMPHS, TSN - supports closed-loop analog sensor fusion and thermal monitoring. |
| Security | SCE7 crypto engine with AES-128/192/256, SHA256, RSA/ECC, TRNG - accelerates TLS handshake and secure boot verification in <5 ms. |
| Connectivity | Ethernet MAC (ETHERC) + EDMAC, dual CAN 2.0B, USBFS (host/device), QSPI, dual SDHI, 3×I²C, 2×SPI, 10×SCI - enables multi-protocol edge node aggregation. |
Pinout & Package
Package: 145-pin LGA (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant Sn-only terminal finish. Designed for high-density PCB layouts with thermal pad grounding and minimal trace inductance for high-speed interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Digital power supply / ground | Decoupled per power domain using 0.1-μF capacitors; supports 2.7–3.6 V operation with LVD monitoring. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; enables precise timing for Ethernet MAC and USB frame synchronization. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and low-power wake-up timing. |
| RES | Active-low reset input | Asynchronous hard reset with internal pull-up; initiates full system initialization and register default state restoration. |
| MD | Mode configuration pin | Defines boot source (single-chip vs. SCI/USB boot) at power-on; must remain stable during reset release. |
| EBCLK / SDCLK | External bus clock outputs | Drives external SDRAM and parallel peripherals; configurable frequency division for timing margin optimization. |
| TDATA0–3 / SWO | Trace and debug outputs | Enables real-time instruction trace and SWD-based debugging without halting CPU execution. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Maps application load address to link address in unused 23-bit space - eliminates linker script complexity for OTA firmware updates. |
| Event Link Controller (ELC) | Chains peripheral events (e.g., ADC EOC → DMAC trigger → SRAM store) without CPU intervention - reduces interrupt latency by >90%. |
| Secure Crypto Engine 7 (SCE7) | Hardware-accelerated AES-GCM, SHA256, and ECC P-256 - achieves 12 Mbps TLS encryption throughput at 120 MHz. |
| Capacitive Touch Sensing Unit (CTSU) | 18-channel touch sensing with noise immunity - enables robust HMI implementation on metal-front panels without external ICs. |
| Sampling Rate Converter (SRC) | Real-time audio sample rate conversion (e.g., 44.1 kHz ↔ 48 kHz) - supports multi-source digital audio mixing in voice-enabled edge devices. |
Applications
| Industrial Ethernet Gateway | Secure Edge Node Controller |
|---|---|
Use Scenario: Aggregating Modbus TCP, CANopen, and EtherCAT traffic into unified MQTT over TLS to cloud infrastructure. IC Role / Device Role / Timing Role: Primary protocol translation MCU with hardware-accelerated TLS offload and deterministic Ethernet MAC timing via ETHERC+EDMAC. Use Value: Eliminates external crypto co-processor and reduces BOM cost by 32% while maintaining <100 μs jitter on time-sensitive EtherCAT frames. | Use Scenario: Field-deployable sensor hub collecting vibration, temperature, and pressure data with local anomaly detection before encrypted upload. IC Role / Device Role / Timing Role: Real-time sensor fusion processor using dual ADC, CTSU for tamper detection, and SCE7 for AES-256 payload encryption. Use Value: Enables battery life extension to 5 years via Deep Software Standby mode with RTC wake-up and SRAM retention. |
| Automotive Body Control Module | Human-Machine Interface Terminal |
Use Scenario: Centralized lighting, window lift, and door lock control in entry-level EV platforms with functional safety compliance. IC Role / Device Role / Timing Role: Safety-aware controller with IWDT, CAC, and ADC self-test - meets ASIL-B decomposition requirements via dual-core lockstep not required. Use Value: Reduces certification effort by integrating ISO 26262 diagnostic coverage (92%) directly into MCU peripherals without external watchdog IC. | Use Scenario: Touch-enabled HVAC and infotainment panel with gesture recognition and audio feedback in commercial appliances. IC Role / Device Role / Timing Role: HMI processor combining CTSU, SSIE for stereo audio playback, SRC for sample rate alignment, and PDC for optional camera integration. Use Value: Supports 10+ simultaneous touch points with <5 ms response latency and zero-touch ghosting due to adaptive noise cancellation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M2AF3CLK#AC0 | 1 MB code flash (vs. 512 KB), same package/temp grade - no change in pinout or peripheral set. | Required when firmware image size exceeds 512 KB or future-proofing for feature expansion is needed. | Select R7FA6M2AF3CLK#AC0 if bootloader + application + OTA storage require >480 KB of contiguous flash space. |
| STM32H743VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, no integrated Ethernet MAC - requires external PHY and separate crypto IC for TLS. | Used where higher compute throughput is prioritized over integrated connectivity and security acceleration. | Choose STM32H743VI only when floating-point performance >3x Cortex-M4 is mandatory and external component count is acceptable. |
Compared with R7FA6M2AD3CLK#AC0, the R7FA6M2AF3CLK#AC0 offers double flash capacity with identical peripheral and safety features - ideal for scalable firmware development; the STM32H743VI trades integrated Ethernet and crypto acceleration for raw CPU speed, increasing BOM cost and layout complexity.
Availability
R7FA6M2AD3CLK#AC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge controllers, automotive body modules, and HMI terminals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M2AD3CLK#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for industrial, automotive, and enterprise applications.
The RA6M2 Group targets high-performance, secure, and safety-conscious embedded systems - designed specifically for industrial IoT edge nodes needing integrated Ethernet, crypto acceleration, and extended temperature reliability without external co-processors.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M2AD3CLK#AC0?
The R7FA6M2AD3CLK#AC0 features an Arm Cortex-M4 core with Floating Point Unit (FPU), operating at a maximum frequency of 120 MHz. It implements the Armv7E-M architecture with DSP instruction set and supports a 4-GB address space. This architecture enables efficient execution of real-time control algorithms, digital signal processing, and cryptographic operations - all critical for the R7FA6M2AD3CLK#AC0's role in industrial and automotive applications.
Does the R7FA6M2AD3CLK#AC0 support Ethernet connectivity, and what interface does it use?
Yes, the R7FA6M2AD3CLK#AC0 integrates a fully compliant IEEE 802.3 Ethernet MAC Controller (ETHERC) with an associated Ethernet DMA Controller (EDMAC). It connects to external PHY devices via RMII or MII interfaces and supports full-duplex 10/100 Mbps operation. The R7FA6M2AD3CLK#AC0 does not include a physical layer transceiver - external PHY selection (e.g., LAN8742A) is required, but the ETHERC+EDMAC pairing enables zero-CPU packet handling for low-latency industrial protocols.
What security features are integrated into the R7FA6M2AD3CLK#AC0, and how are they implemented?
The R7FA6M2AD3CLK#AC0 includes the Secure Crypto Engine 7 (SCE7), a hardware-accelerated security module supporting AES-128/192/256, SHA256, RSA/ECC, and TRNG. These functions operate independently of the main CPU, with dedicated key registers and protected memory. The R7FA6M2AD3CLK#AC0 also provides 128-bit unique ID, flash area protection, and register write protection - collectively enabling secure boot, firmware authentication, and TLS offload without software-only crypto overhead.
What analog peripherals are available on the R7FA6M2AD3CLK#AC0, and how many channels do they support?
The R7FA6M2AD3CLK#AC0 includes two independent 12-bit successive approximation ADC units (ADC12): Unit 0 supports up to 13 input channels, Unit 1 supports up to 9, with 2 shared pins yielding 20 total analog input ports. It also integrates two 12-bit DAC channels, six high-speed analog comparators (ACMPHS), and an on-die temperature sensor (TSN). These peripherals are accessible across multiple I/O banks and support simultaneous sampling - essential for the R7FA6M2AD3CLK#AC0's use in motor control and sensor fusion applications.
What package type and pin count does the R7FA6M2AD3CLK#AC0 use, and what are its thermal characteristics?
The R7FA6M2AD3CLK#AC0 uses a 145-pin Land Grid Array (LGA) package measuring 7 mm × 7 mm with 0.5 mm pitch and Sn-only (Pb-free) terminations. It is rated for operation from -40°C to +105°C ambient temperature and includes thermal pad grounding for enhanced heat dissipation. The LGA form factor supports high-density routing and improved signal integrity for high-speed interfaces like QSPI and USBFS - making it suitable for compact, thermally constrained designs where the R7FA6M2AD3CLK#AC0 serves as the central processing unit.
R7FA6M2AD3CLK#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 145-TFLGA
- Series:
- RA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FIFO, I2C, IrDA, MMC/SD, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 110
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M2AD3CLK#AC0 FAQ
1.How can I place an order for R7FA6M2AD3CLK#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M2AD3CLK#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M2AD3CLK#AC0 reliable?
The price and inventory of R7FA6M2AD3CLK#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M2AD3CLK#AC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M2AD3CLK#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M2AD3CLK#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M2AD3CLK#AC0?
R7FA6M2AD3CLK#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M2AD3CLK#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M2AD3CLK#AC0?
For technical support, including R7FA6M2AD3CLK#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M2AD3CLK#AC0 requirements.
6.How does Aetrix verify that R7FA6M2AD3CLK#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M2AD3CLK#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M2AD3CLK#AC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M2AD3CLK#AC0?
All R7FA6M2AD3CLK#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M2AD3CLK#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M2AD3CLK#AC0 part is unused and in its original packaging.
Return procedure for R7FA6M2AD3CLK#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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