My Inquiry
My Account
Renesas R7FA6M2AF3CLK#AC0
- Part No.:
- R7FA6M2AF3CLK#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 145-TFLGA
- Datasheet:
-
R7FA6M2AF3CLK#AC0.pdf
- Description:
- RA_FAMILY-2
- Quantity:
- Payment:
- Shipping:
Inventory:416
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6M2AF3CLK#AC0 from Renesas is a high-performance 32-bit Arm Cortex-M4 microcontroller with FPU, operating at up to 120 MHz, featuring 1-MB code flash, 384-KB SRAM, dual CAN, Ethernet MAC (ETHERC), USB 2.0 Full-Speed with on-chip transceiver, and integrated security engine (SCE7) supporting AES-256, RSA, ECC, and TRNG - deployed in industrial gateways requiring real-time connectivity, secure firmware updates, and deterministic control.
For engineers reviewing the R7FA6M2AF3CLK#AC0 datasheet, R7FA6M2AF3CLK#AC0 pinout, R7FA6M2AF3CLK#AC0 application, or R7FA6M2AF3CLK#AC0 equivalent, key selection considerations include its -40°C to +105°C extended temperature rating, 145-pin LGA package, dual SDHI interfaces for redundant storage, QSPI for external XIP execution, and hardware-accelerated cryptographic operations enabling secure boot and OTA integrity verification.
Technical Context
This MCU implements an Armv7E-M architecture with DSP extensions and single-precision FPU, supporting 4-GB address space and boundary scan debugging via JTAG/SWD/ETM. Its memory subsystem includes ECC-protected SRAM (32 KB), parity-checked SRAM (352 KB), and 32-KB data flash rated for 125,000 erase/write cycles.
The system integrates dual independent watchdogs (WDT and IWDT), Memory Mirror Function (MMF) for flexible firmware load/link separation, and Event Link Controller (ELC) enabling autonomous peripheral-to-peripheral triggering without CPU intervention - critical for low-latency motor control and time-sensitive I/O coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU, 120 MHz max - enables real-time signal processing and floating-point math without software emulation. |
| Memory | 1-MB code flash (40 MHz zero-wait-state), 32-KB data flash, 384-KB SRAM - supports large embedded OS images and dual-bank firmware updates. |
| Connectivity | Ethernet MAC (ETHERC) + EDMAC, USB 2.0 FS (on-chip transceiver), 2× CAN 2.0B, 2× SDHI, QSPI - enables wired industrial networking with local storage and external memory expansion. |
| Analog | 2× 12-bit ADC12 (13+9 channels, 3 sample-and-hold), 2× DAC12, 6× ACMPHS, TSN - supports multi-sensor monitoring and closed-loop analog control. |
| Security | SCE7 crypto engine: AES-128/192/256, SHA256, RSA/ECC, TRNG, 128-bit unique ID - provides hardware-rooted trust for secure boot and encrypted communication. |
| Package & Temp | 145-pin LGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +105°C - suitable for convection-cooled industrial control enclosures and automotive under-hood edge nodes. |
| Timers | 4× GPT32EH (enhanced high-res PWM), 4× GPT32E, 6× GPT32, 2× AGT - delivers precise motor phase timing, PWM dead-time insertion, and low-power wake-up capability. |
Pinout & Package
Package: 145-pin LGA (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant Sn-only terminal finish, rated for industrial temperature range (-40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Digital power supply / Ground | 10 dedicated VCC/VSS pairs ensure stable core/peripheral voltage delivery; decoupling requires 0.1-μF capacitors placed adjacent to each VCC pin. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal or external clock input; enables precise timing for Ethernet PHY synchronization and USB frame generation. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar operation and low-power wake-up during Deep Software Standby mode. |
| RES | Reset input | Active-low asynchronous reset pin; initiates full system initialization including flash controller, SRAM retention, and peripheral register reset. |
| MD | Operating mode select | Configures boot source (single-chip, SCI, or USB) at power-on; must remain static during reset release to avoid undefined behavior. |
| EBCLK / SDCLK | External bus clocks | EBCLK drives CS/SDRAM interface timing; SDCLK provides dedicated SDRAM clock - both enable deterministic access to external memory without CPU overhead. |
| TMS / TDI / TDO / TCK / SWDIO / SWCLK | Debug interface | Supports JTAG boundary scan, SWD programming, and ETM trace capture - essential for production test and field firmware validation. |
| RD / WR / WR0–WR1 / BC0–BC1 | External bus strobes | Enable 8-/16-bit parallel memory mapping to external NOR/NAND/SDRAM; supports legacy industrial HMI displays and FPGA co-processors. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Maps flash load address to linker-defined virtual address space - eliminates runtime relocation and simplifies OTA firmware patching. |
| Event Link Controller (ELC) | Routes 128+ peripheral events (e.g., ADC EOC, timer overflow) directly to timers, DMA, or GPIO without CPU involvement - reduces interrupt latency to sub-microsecond levels. |
| Secure Crypto Engine 7 (SCE7) | Accelerates AES-GCM encryption/decryption at >20 MB/s - enables TLS 1.3 handshake offload and encrypted firmware image verification in <5 ms. |
| Capacitive Touch Sensing Unit (CTSU) | 18-channel self-capacitance sensing with noise immunity - supports robust touch buttons/sliders in harsh EMI environments without external components. |
| Sampling Rate Converter (SRC) | Hardware audio resampling up to 50 MHz clock - allows seamless integration of diverse codecs (MP3, AAC, WMA) into voice-enabled HMI systems. |
| Parallel Data Capture (PDC) | Direct 8-/16-bit parallel video/data stream capture into SRAM or SDRAM via DTC/DMAC - enables cost-effective machine vision preprocessing without external FPGA. |
Applications
| Industrial Ethernet Gateway | Secure Edge Node Controller |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, CANopen, and PROFINET devices into a unified OPC UA server with TLS-secured cloud upload. IC Role / Device Role / Timing Role: Primary application processor running FreeRTOS + lwIP stack; ETHERC/EDMAC handles packet DMA; SCE7 performs certificate-based TLS handshake acceleration. Use Value: Eliminates need for external Ethernet PHY and crypto co-processor, reducing BOM count by 3 ICs and PCB area by 28 mm². |
Use Scenario: Field-deployable PLC module with secure remote diagnostics, firmware update rollback, and tamper-evident logging. IC Role / Device Role / Timing Role: Real-time control core executing IEC 61131-3 logic; dual CAN interfaces manage distributed I/O; IWDT ensures fail-safe shutdown on software hang. Use Value: Hardware-enforced secure boot and flash area protection prevent unauthorized firmware modification, meeting IEC 62443-3-3 SL2 requirements. |
| Human-Machine Interface Terminal | Audio-Enabled Smart Sensor Hub |
|
Use Scenario: 7-inch capacitive touchscreen HMI with gesture recognition, local alarm history, and SD card-based report export. IC Role / Device Role / Timing Role: CTSU manages 18-button overlay; PDC captures camera feed for QR code scanning; SDHI #1 hosts OS, SDHI #2 stores logs. Use Value: Integrated CTSU replaces external touch controller IC; dual SDHI enables concurrent read/write for zero-downtime log rotation. |
Use Scenario: Vibration + temperature + acoustic emission sensor node performing FFT-based anomaly detection and voice alert via speaker. IC Role / Device Role / Timing Role: SSIE interfaces with I2S microphone array; SRC resamples audio to 48 kHz; GPT32EH generates precise PWM for speaker driver. Use Value: On-chip SRC and SSIE eliminate external audio codec; FPU-accelerated FFT completes in <12 ms per 1024-sample window. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M2AF3CFB | 144-pin LQFP package (20 mm × 20 mm); identical core, memory, peripherals, and temp grade. | Preferred where manual soldering, rework, or legacy PCB footprint compatibility is required. | Select when board layout constraints favor LQFP over LGA or thermal management permits larger package size. |
| R7FA6M2AF2CLK | Same 145-pin LGA package but rated for -40°C to +85°C; otherwise identical feature set and pinout. | Suitable for commercial/indoor environments where extended temperature is not mandated. | Choose for cost-sensitive applications where ambient operating conditions stay below 85°C ambient. |
Compared with R7FA6M2AF3CLK#AC0, the R7FA6M2AF3CFB offers identical functionality in a rework-friendly LQFP package, while R7FA6M2AF2CLK reduces thermal qualification cost at the expense of industrial-grade temperature margin - both require no firmware changes but differ in mechanical integration and environmental certification scope.
Availability
R7FA6M2AF3CLK#AC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge controllers, human-machine interface terminals, and audio-enabled sensor hubs requiring stable component supply across long-lifecycle deployments.
Supply support for R7FA6M2AF3CLK#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
R7FA6M2AF3CLK#AC0 belongs to the RA6M2 group - a family of Arm Cortex-M4 MCUs designed for industrial connectivity, security-critical edge computing, and real-time control with integrated Ethernet, USB, CAN, and hardware cryptography.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M2AF3CLK#AC0?
The R7FA6M2AF3CLK#AC0 features an Arm Cortex-M4 core with Floating Point Unit (FPU), compliant with Armv7E-M architecture and DSP instruction set, operating at a maximum frequency of 120 MHz. This enables high-throughput real-time processing for industrial control algorithms, audio decoding, and cryptographic operations - all verified in the R01DS0357EJ0120 datasheet revision 1.20.
Does the R7FA6M2AF3CLK#AC0 support hardware-accelerated cryptography, and which algorithms are implemented?
Yes, the R7FA6M2AF3CLK#AC0 integrates the Secure Crypto Engine 7 (SCE7), providing hardware acceleration for AES-128/192/256, 3DES, ARC4, SHA1/SHA224/SHA256/MD5, GHASH, RSA/DSA/ECC, and a True Random Number Generator (TRNG). These functions are accessible via Renesas' Trusted Secure IP (TSIP) API and validated against NIST SP800-22 for entropy quality - confirmed in Section 1.13 and User's Manual Chapter 44.
What package type and pin count does the R7FA6M2AF3CLK#AC0 use, and what is its temperature rating?
The R7FA6M2AF3CLK#AC0 uses a 145-pin Land Grid Array (LGA) package measuring 7 mm × 7 mm with 0.5 mm pitch, and is qualified for operation from -40°C to +105°C. This compact, thermally efficient package supports high-density industrial PCB layouts and meets extended temperature requirements for under-hood or factory-floor deployment - specified in Table 1.15 and Section 1.3 of the datasheet.
How many CAN interfaces does the R7FA6M2AF3CLK#AC0 include, and what protocol versions are supported?
The R7FA6M2AF3CLK#AC0 includes two Controller Area Network (CAN) modules, each compliant with ISO 11898-1 (CAN 2.0A and CAN 2.0B), supporting both standard (11-bit) and extended (29-bit) identifier formats. Each module provides up to 32 configurable mailboxes in normal or FIFO mode - detailed in Section 1.8 and User's Manual Chapter 35 of the R01DS0357EJ0120 documentation.
Does the R7FA6M2AF3CLK#AC0 support external memory interfaces, and which types are available?
Yes, the R7FA6M2AF3CLK#AC0 supports multiple external memory interfaces: an 8-/16-bit external bus interface (EXBIU) for NOR/NAND flash and SRAM, SDRAM support with dedicated SDCLK output, and Quad SPI (QSPI) for serial NOR/FeRAM/EEPROM. These interfaces allow expansion beyond on-chip memory for firmware overlays, data logging, or graphics frame buffers - as defined in Tables 1.6 and 1.11 and User's Manual Chapter 54.
R7FA6M2AF3CLK#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 145-TFLGA
- Series:
- RA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FIFO, I2C, IrDA, MMC/SD, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 110
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M2AF3CLK#AC0 FAQ
1.How can I place an order for R7FA6M2AF3CLK#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M2AF3CLK#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M2AF3CLK#AC0 reliable?
The price and inventory of R7FA6M2AF3CLK#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M2AF3CLK#AC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M2AF3CLK#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M2AF3CLK#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M2AF3CLK#AC0?
R7FA6M2AF3CLK#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M2AF3CLK#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M2AF3CLK#AC0?
For technical support, including R7FA6M2AF3CLK#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M2AF3CLK#AC0 requirements.
6.How does Aetrix verify that R7FA6M2AF3CLK#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M2AF3CLK#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M2AF3CLK#AC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M2AF3CLK#AC0?
All R7FA6M2AF3CLK#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M2AF3CLK#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M2AF3CLK#AC0 part is unused and in its original packaging.
Return procedure for R7FA6M2AF3CLK#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M2AF3CLK#AC0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
