Renesas R7FA6M3AF2CBG#AC0
- Part No.:
- R7FA6M3AF2CBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M3AF2CBG#AC0.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:302
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Product details
Overview
R7FA6M3AF2CBG#AC0 from Renesas Electronics is a high-performance 32-bit Arm Cortex-M4 microcontroller with FPU, operating at up to 120 MHz. It integrates 2-MB code flash, 640-KB SRAM, dual CAN, IEEE 1588-compliant Ethernet MAC (ETHERC), USB 2.0 High-Speed and Full-Speed modules, QSPI, SDHI, GLCDC, DRW, CTSU, and SCE7 security engine - enabling industrial HMI, networked edge devices, and real-time control systems.
For engineers reviewing the R7FA6M3AF2CBG#AC0 datasheet, R7FA6M3AF2CBG#AC0 pinout, R7FA6M3AF2CBG#AC0 application, or R7FA6M3AF2CBG#AC0 equivalent, key selection criteria include IEEE 1588 PTP timing accuracy, dual-CAN redundancy, on-chip graphics acceleration (GLCDC + DRW), hardware crypto acceleration (AES-256, ECC, TRNG), and 176-pin BGA package compatibility with industrial temperature range (−40°C to +105°C).
Technical Context
The R7FA6M3AF2CBG#AC0 implements an Armv7E-M architecture with DSP extensions and single-precision FPU for deterministic signal processing. Its memory subsystem includes ECC-protected SRAM (first 32 KB), MMF for flexible firmware load/link separation, and 64-KB data flash rated for 125,000 erase/write cycles.
Real-time connectivity is enabled by tightly coupled peripherals: ETHERC linked to EDMAC and EPTPC for hardware-accelerated PTP timestamping; dual CAN controllers compliant with ISO 11898-1 supporting 32 mailboxes and both standard/extended frames; and USBHS/USBFS with integrated transceivers and battery charging v1.2 support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU, 120 MHz max - enables real-time DSP and floating-point math without external coprocessor |
| Memory | 2-MB code flash (zero-wait @40 MHz), 640-KB SRAM (ECC on first 32 KB) - supports large embedded OS and secure runtime integrity |
| Connectivity | Ethernet MAC + IEEE 1588 PTP, dual CAN 2.0B, USB 2.0 HS/FS, QSPI, SDHI ×2 - meets industrial networking and fieldbus requirements |
| Analog | ADC12 ×2 (12-bit, 22 channels), DAC12 ×2, ACMPHS ×6, PGA ×6 - enables sensor fusion and closed-loop analog control |
| Graphics & HMI | GLCDC + DRW + JPEG codec + CTSU - drives WVGA+ displays with hardware-accelerated rendering and touch interface |
| Security | SCE7 with AES-128/192/256, ECC, RSA, SHA256, TRNG, 128-bit UID - provides certified cryptographic services for secure boot and OTA updates |
| Package & Temp | 176-pin BGA (13 mm × 13 mm, 0.8 mm pitch), −40°C to +105°C - suitable for convection-cooled industrial PCBs with high I/O density |
Pinout & Package
176-pin BGA package (13 mm × 13 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3). Pinout conforms to RA6M3 Group standard layout per R01DS0358EJ0120 Rev.1.20.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply / Ground | 2.7–3.6 V core I/O domain; 133 total I/O pins including 21 5-V tolerant inputs/outputs |
| CLKIN, CLKOUT | External clock input / output | Supports 8–24 MHz main oscillator (MOSC); clock out enables traceability and system synchronization |
| ETH_RXD[0:3], ETH_TXD[0:3], ETH_CRS, ETH_COL, ETH_MDC, ETH_MDIO | Ethernet PHY interface | IEEE 802.3-compliant RMII/MII signals; requires external PHY (e.g., LAN8742A) for physical layer |
| USB_VBUS, USB_DP, USB_DM | USB 2.0 High-Speed interface | On-chip transceiver supports HS/FS modes; VBUS detection enables host/device role negotiation |
| TXDn, RXDn (SCI) | Asynchronous serial communication | 10 SCI channels with FIFO; configurable as UART, SPI, I²C master, or smart card interface per channel |
| CTSUx, CTSUSO, CTSUSI | Capacitive touch sensing | Dedicated CTSU pins support self- and mutual-capacitance measurement for up to 48 electrodes |
| GLCD_D[0:23], GLCD_HSYNC, GLCD_VSYNC, GLCD_CLK | Graphics LCD interface | 24-bit RGB parallel output supporting WVGA+ panels; synchronous timing controlled by GLCDC hardware |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables direct peripheral-to-peripheral triggering (e.g., ADC conversion start → DMA transfer) without CPU intervention, reducing latency and ISR overhead |
| Memory Mirror Function (MMF) | Allows application code to be linked to a fixed virtual address while loading to any physical flash location - simplifies firmware update and A/B swap implementation |
| Independent Watchdog Timer (IWDT) | Operates from dedicated 15-kHz on-chip oscillator; provides fail-safe reset independent of main clock domain during system lockup |
| Sampling Rate Converter (SRC) | Hardware-accelerated audio sample rate conversion (e.g., 44.1 kHz ↔ 48 kHz) for SSIE-based audio pipelines without CPU load |
| Port Output Enable for GPT (POEG) | Allows safe PWM output disable during fault conditions (e.g., overcurrent) by forcing GPT pins to high-impedance state via dedicated register |
Applications
| Industrial HMI Panel | Networked PLC Edge Gateway |
|---|---|
Use Scenario: Standalone operator interface with 7-inch WVGA TFT display, multi-touch capacitive overlay, and local data logging. IC Role / Device Role / Timing Role: R7FA6M3AF2CBG#AC0 serves as main application processor, driving GLCDC/DRW for UI rendering, CTSU for touch response, and SDHI for FAT32 logging - all synchronized via ELC-triggered DMA transfers. Use Value: Hardware JPEG decode accelerates image-rich UI loading; 640-KB SRAM buffers framebuffers and touch event queues; 120 MHz FPU enables real-time trend charting with floating-point math. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU sensors over RS-485 and forwarding to cloud via Ethernet with IEEE 1588 time-stamped diagnostics. IC Role / Device Role / Timing Role: R7FA6M3AF2CBG#AC0 acts as protocol translator and time-aware edge node - ETHERC/EPTPC timestamps sensor events, dual CAN interfaces connect to legacy fieldbus, and SCI handles RS-485 Modbus. Use Value: Sub-microsecond PTP timestamping ensures traceable event correlation across distributed I/O; SCE7 secures TLS handshakes and firmware signatures; ECC SRAM prevents silent data corruption in long-running deployments. |
| Secure Medical Data Logger | Automotive Diagnostic Tool |
Use Scenario: Portable device capturing ECG waveforms, encrypting data at rest, and uploading to HIPAA-compliant cloud via USB or Ethernet. IC Role / Device Role / Timing Role: R7FA6M3AF2CBG#AC0 performs analog acquisition (ADC12 + PGA), real-time waveform analysis (Cortex-M4 FPU), AES-256 encryption (SCE7), and secure USB mass storage class interface. Use Value: On-chip TRNG seeds cryptographic keys; 64-KB data flash stores encrypted logs with wear-leveling; 128-bit UID binds device identity to audit trails. | Use Scenario: Handheld OBD-II scanner supporting UDS diagnostics over CAN FD-capable networks (via CAN controller in legacy mode) and firmware updates via USB. IC Role / Device Role / Timing Role: R7FA6M3AF2CBG#AC0 functions as diagnostic host controller - dual CAN modules handle primary/backup bus monitoring, USBHS enables fast firmware download, and GLCDC drives color UI with vehicle-specific DTC visualization. Use Value: Hardware CRC and DOC accelerate diagnostic message validation; 176-pin BGA allows compact PCB layout with ESD-protected CAN transceivers; −40°C to +105°C rating ensures operation in under-hood environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M3AH2CFB#AA0 | Same RA6M3 core, 176-pin LQFP package (24 mm × 24 mm), no BGA soldering requirement | Better suited for prototyping and low-volume production where reworkability matters; slightly lower thermal performance than BGA | Select when manual assembly, test fixture access, or thermal margin above 85°C is not critical |
| R7FA6M4AF2CBG#AC0 | RA6M4 variant: adds TrustZone support, enhanced SCE8 crypto, and larger 3-MB flash option; same pinout and peripheral set | Required for applications needing ARM TrustZone isolation (e.g., secure bootloader partitioning) or extended flash for dual-bank OTA | Choose when hardware-enforced security domains or >2 MB code space are mandatory - otherwise R7FA6M3AF2CBG#AC0 offers optimal cost/performance balance |
Compared with R7FA6M3AH2CFB#AA0, the R7FA6M3AF2CBG#AC0 delivers superior thermal dissipation and board-level miniaturization in BGA form, while R7FA6M4AF2CBG#AC0 extends security and memory capacity without altering PCB layout - making the R7FA6M3AF2CBG#AC0 the preferred choice for volume industrial HMI and edge gateway designs requiring proven reliability and full feature integration.
Availability
R7FA6M3AF2CBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI panels, networked PLC gateways, secure medical loggers, automotive diagnostic tools, and Ethernet-enabled edge controllers requiring stable component supply across multi-year production cycles.
Supply support for R7FA6M3AF2CBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with annual revenue exceeding $10 billion and design centers worldwide.
The RA6M3 Group targets high-end industrial and networked edge applications, combining real-time performance, rich connectivity (Ethernet/CAN/USB), advanced graphics, and hardware security - specifically engineered for next-generation human-machine interfaces and deterministic industrial control systems.
FAQ
What is the maximum operating frequency of the R7FA6M3AF2CBG#AC0?
The R7FA6M3AF2CBG#AC0 operates at a maximum frequency of 120 MHz using its Arm Cortex-M4 core with FPU. This speed is achievable with zero wait states on code flash when running at 40 MHz bus frequency, supported by Flash Cache (FCACHE) and memory mirroring for deterministic execution in real-time applications.
Does the R7FA6M3AF2CBG#AC0 support IEEE 1588 Precision Time Protocol?
Yes, the R7FA6M3AF2CBG#AC0 includes a dedicated Ethernet PTP Controller (EPTPC) compliant with IEEE 1588-2008 v2.0. It works in conjunction with the Ethernet MAC (ETHERC) and EDMAC to provide hardware timestamping of PTP sync, delay_req, and delay_resp messages - enabling sub-microsecond time synchronization in industrial automation networks.
What graphics capabilities does the R7FA6M3AF2CBG#AC0 offer?
The R7FA6M3AF2CBG#AC0 integrates a Graphics LCD Controller (GLCDC), 2D Drawing Engine (DRW), and JPEG codec. It supports WVGA+ displays via 24-bit RGB parallel interface, hardware-accelerated alpha-blended rendering of multiple layers, and real-time JPEG decode - all managed without CPU intervention using DMAC and ELC-triggered transfers.
How many CAN interfaces does the R7FA6M3AF2CBG#AC0 include?
The R7FA6M3AF2CBG#AC0 features two Controller Area Network (CAN) modules compliant with ISO 11898-1 (CAN 2.0A/B). Each supports up to 32 mailboxes, standard/extended identifiers, and configurable FIFO or normal mailbox modes - enabling robust fieldbus communication in industrial and automotive diagnostic applications.
Is the R7FA6M3AF2CBG#AC0 qualified for industrial temperature range?
Yes, the R7FA6M3AF2CBG#AC0 is rated for operation from −40°C to +105°C ambient temperature. This qualification applies specifically to the 176-pin BGA package variant (R7FA6M3AF2CBG#AC0), making it suitable for deployment in harsh industrial environments such as factory floors, outdoor enclosures, and DIN-rail mounted control systems.
R7FA6M3AF2CBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 124
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M3AF2CBG#AC0 FAQ
1.How can I place an order for R7FA6M3AF2CBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M3AF2CBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M3AF2CBG#AC0 reliable?
The price and inventory of R7FA6M3AF2CBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M3AF2CBG#AC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M3AF2CBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M3AF2CBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M3AF2CBG#AC0?
R7FA6M3AF2CBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M3AF2CBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M3AF2CBG#AC0?
For technical support, including R7FA6M3AF2CBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M3AF2CBG#AC0 requirements.
6.How does Aetrix verify that R7FA6M3AF2CBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M3AF2CBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M3AF2CBG#AC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M3AF2CBG#AC0?
All R7FA6M3AF2CBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M3AF2CBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M3AF2CBG#AC0 part is unused and in its original packaging.
Return procedure for R7FA6M3AF2CBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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