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Renesas R7FA6M3AF3CFP#BA0
- Part No.:
- R7FA6M3AF3CFP#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7FA6M3AF3CFP#BA0.pdf
- Description:
- MCU RA6 ARM CM4 120MHZ 1M/640K Q
- Quantity:
- Payment:
- Shipping:
Inventory:1,099
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Product details
Overview
R7FA6M3AF3CFP#BA0 from Renesas Electronics is a high-performance 32-bit Arm Cortex-M4 microcontroller with FPU, designed for industrial HMI, Ethernet-connected edge devices, and secure IoT gateways. It operates at up to 120 MHz, integrates 2 MB code flash, 640 KB SRAM, dual CAN, IEEE 1588 PTP-capable Ethernet MAC, USB 2.0 High-Speed/Full-Speed, and hardware-accelerated cryptography (AES-256, ECC, TRNG).
For engineers reviewing the R7FA6M3AF3CFP#BA0 datasheet, R7FA6M3AF3CFP#BA0 pinout, R7FA6M3AF3CFP#BA0 application, or R7FA6M3AF3CFP#BA0 equivalent, key selection criteria include its 100-pin LQFP package, -40°C to +105°C industrial temperature rating, integrated GLCDC/DRW for graphics rendering, dual SDHI for memory card support, and SCE7 security engine for firmware integrity and secure boot.
Technical Context
The R7FA6M3AF3CFP#BA0 implements an Armv7E-M architecture with DSP extensions and single-precision FPU, enabling deterministic real-time control and signal processing. Its memory subsystem includes ECC-protected SRAM (first 32 KB), 64 KB data flash rated for 125,000 erase/write cycles, and Memory Mirror Function (MMF) for flexible firmware update deployment without address remapping.
System-level integration features include Event Link Controller (ELC) for CPU-free peripheral chaining, dual DMA controllers (8-channel DMAC + DTC), and Safety mechanisms such as CAC clock accuracy monitoring, IWDT with dedicated 15 kHz oscillator, and SRAM parity/ECC error detection-supporting IEC 61508 SIL2 and ISO 26262 ASIL-B readiness.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU, 120 MHz max - enables floating-point math-intensive tasks like motor control algorithms or audio SRC without software emulation. |
| Memory | 2 MB code flash (40 MHz zero-wait), 64 KB data flash, 640 KB SRAM - supports large embedded OS images, OTA update partitions, and real-time buffer storage. |
| Connectivity | Ethernet MAC + IEEE 1588 PTP, dual CAN 2.0B, USBHS/USBFS, QSPI, dual SDHI - enables time-synchronized industrial networking and multi-protocol fieldbus bridging. |
| Analog | Dual 12-bit ADC (22 channels total), dual 12-bit DAC, 6× ACMPHS, PGA, TSN - supports precision sensor acquisition, closed-loop analog control, and on-die temperature monitoring. |
| Graphics & HMI | GLCDC + 2D DRW + JPEG codec + CTSU - renders WVGA+ GUIs with hardware anti-aliasing, accelerates image decode, and enables robust touch panel interfaces. |
| Security | SCE7 crypto engine: AES-128/192/256, ECC, RSA, SHA256, TRNG, 128-bit UID - provides hardware-rooted secure boot, encrypted firmware storage, and TLS offload capability. |
| Package & Temp | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), -40°C to +105°C - suitable for compact industrial PCBs requiring extended thermal reliability without BGA assembly complexity. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3. Pin count and I/O configuration match RA6M3 Group specification for FP package variant: 67 I/O pins, 9 dedicated inputs, 21 5 V-tolerant pins, 14 high-current (20 mA) outputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | 2.7–3.6 V core/io supply; multiple VCC/VSS pairs ensure low-noise operation and EMI resilience in mixed-signal layouts. |
| XTAL/EXTAL | Main clock oscillator interface | Accepts 8–24 MHz crystal for precise timing; supports external clock input or HOCO/MOCO fallback for fail-safe clocking. |
| RTC_VCC, VBATT | Battery backup domain | Enables RTC calendar retention and backup SRAM during main power loss using coin-cell battery. |
| ETH_MDC/MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register access and link status negotiation without CPU overhead. |
| USB_VBUS, USB_DP/DN | USB 2.0 High-Speed physical layer | On-chip transceiver supports HS/FS device/host modes; VBUS sensing enables automatic role detection and BC1.2 charging compliance. |
| SD0_CLK/SD0_CMD/SD0_DATx | SD/MMC Host Interface 0 | 4-bit SDHC/SDXC support with CRC offload and DMA-driven transfers - eliminates CPU bottlenecks in media logging or firmware update loading. |
| CTSU_Sx | Capacitive touch sensing channel | Direct connection to self-capacitance electrodes; internal CTSU handles scanning, noise rejection, and baseline tracking autonomously. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Allows application code to be linked to fixed virtual address while loaded at arbitrary flash offset - simplifies field firmware updates and A/B swapping without linker script changes. |
| Event Link Controller (ELC) | Enables direct hardware-triggered peripheral interactions (e.g., ADC conversion completion → DMA transfer → GPT capture) - reduces interrupt latency and CPU load in real-time control loops. |
| Secure Crypto Engine 7 (SCE7) | Accelerates AES-GCM encryption/decryption, ECDSA signature generation, and SHA256 hashing in constant time - meets FIPS 140-2 Level 1 requirements for secure boot and TLS 1.3 handshake offload. |
| Graphics LCD Controller (GLCDC) | Supports three overlay planes (background + two graphics layers), 32-bit ARGB output, and digital video interface up to WVGA - enables rich UIs on industrial HMIs without external GPU. |
| Sampling Rate Converter (SRC) | Resamples stereo/mono audio streams (e.g., MP3/WMA decoded output) to match DAC or codec clock domains - eliminates software resampling jitter in voice-enabled edge devices. |
Applications
| Industrial HMI Terminal | Ethernet Field Gateway |
|---|---|
Use Scenario: Compact panel-mounted display with capacitive touch, real-time process visualization, and local alarm logging. IC Role / Device Role / Timing Role: Primary application processor running FreeRTOS/GUI framework; GLCDC drives 800×480 LCD; CTSU manages 10-button overlay; RTC maintains event timestamps. Use Value: Hardware-accelerated 2D drawing reduces CPU utilization by >65% vs. software rendering; MMF enables seamless firmware updates without system reboot. |
Use Scenario: DIN-rail mounted protocol converter linking Modbus RTU field devices to cloud via IEEE 1588-synchronized Ethernet backbone. IC Role / Device Role / Timing Role: Dual-role controller: CAN/SCI handles legacy fieldbus; ETHERC+EPTPC delivers sub-microsecond timestamping for synchronized sensor data aggregation. Use Value: PTP hardware timestamping eliminates software stack jitter; SCE7 secures MQTT/TLS connections to cloud platform without external secure element. |
| Secure IoT Edge Node | Audio-Enabled Smart Sensor |
Use Scenario: Battery-powered environmental monitor with encrypted sensor telemetry, over-the-air firmware updates, and tamper-resistant boot. IC Role / Device Role / Timing Role: Root-of-trust MCU: SCE7 validates signed firmware images; AES-256 encrypts sensor payloads; WDT/IWDT ensures recovery from fault conditions. Use Value: On-chip TRNG and ECC key generation eliminate need for external entropy sources; data flash endurance supports 10+ years of secure log rotation. |
Use Scenario: Voice-controlled industrial sensor node with wake-on-voice, local audio preprocessing, and compressed audio streaming. IC Role / Device Role / Timing Role: Audio subsystem controller: SSIE interfaces with MEMS microphone array; SRC aligns sample rates; JPEG codec compresses spectrogram thumbnails. Use Value: Dedicated SRC and SSIE FIFOs enable <10 ms audio pipeline latency; DRW renders waveform UIs directly to display buffer without frame buffer copies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance, secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M3AH3CFB#AA0 | Same RA6M3 family, 176-pin LQFP package, 2 MB flash, but lacks USBHS and has only one SDHI. | Better suited for non-USB, space-constrained designs needing more GPIOs (124 I/O vs. 67) and dual CAN + Ethernet. | Select when board layout accommodates larger LQFP and USBHS is not required. |
| R7FA4M2AD3CFM#AA0 | RA4M2 family, 100-pin LQFP, 1.5 MB flash, 256 KB SRAM, no Ethernet, no GLCDC/DRW, lower 100 MHz max frequency. | Targeted at cost-sensitive, non-graphical applications requiring CAN, USBFS, and basic crypto (SCE5), but no PTP or advanced HMI. | Select when Ethernet, graphics acceleration, and IEEE 1588 are unnecessary and BOM cost is primary constraint. |
Compared with R7FA6M3AF3CFP#BA0, the R7FA6M3AH3CFB#AA0 offers higher I/O count and identical security/performance but requires PCB redesign for 176-pin footprint, while the R7FA4M2AD3CFM#AA0 reduces feature set and performance to lower cost-making it viable only where Ethernet, GLCDC, and USBHS are excluded from system requirements.
Availability
R7FA6M3AF3CFP#BA0 is available at Aetrix Electronics and suitable for industrial HMI terminals, Ethernet field gateways, secure IoT edge nodes, audio-enabled smart sensors, and time-critical automation controllers requiring stable component supply across long product lifecycles.
Supply support for R7FA6M3AF3CFP#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with deep expertise in MCUs, analog, and power technologies.
The RA6M3 Group targets high-end industrial and IoT edge applications demanding real-time performance, rich graphics, network synchronization, and hardware-enforced security - positioning R7FA6M3AF3CFP#BA0 as a scalable foundation for next-generation connected equipment.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M3AF3CFP#BA0?
The R7FA6M3AF3CFP#BA0 features an Arm Cortex-M4 core with Floating Point Unit (FPU) operating at up to 120 MHz, compliant with the Armv7E-M architecture and DSP instruction set. This enables high-efficiency execution of floating-point math, digital signal processing, and real-time control algorithms without software emulation overhead.
Does the R7FA6M3AF3CFP#BA0 support IEEE 1588 Precision Time Protocol (PTP)?
Yes, the R7FA6M3AF3CFP#BA0 integrates a dedicated Ethernet PTP Controller (EPTPC) compliant with IEEE 1588-2008 v2.0. It works in conjunction with the on-chip Ethernet MAC (ETHERC) and PTP-aware DMA (PTPEDMAC) to provide hardware timestamping with sub-microsecond accuracy for time-synchronized industrial networks.
What graphics and human-machine interface peripherals are included in the R7FA6M3AF3CFP#BA0?
The R7FA6M3AF3CFP#BA0 includes a Graphics LCD Controller (GLCDC) supporting WVGA+ displays, a 2D Drawing Engine (DRW) with anti-aliased rasterization, JPEG codec for hardware-accelerated image compression/decompression, and Capacitive Touch Sensing Unit (CTSU) for self-capacitance touch panel control - all enabling rich, responsive UIs without external graphics ICs.
How does the R7FA6M3AF3CFP#BA0 implement hardware security?
The R7FA6M3AF3CFP#BA0 embeds Renesas' Secure Crypto Engine 7 (SCE7), which accelerates AES-128/192/256, ECC, RSA, SHA256, and TRNG operations. It supports secure boot with immutable root-of-trust, encrypted firmware storage, and TLS offload - meeting requirements for IEC 62443 and FIPS 140-2 Level 1 compliance.
What package and temperature grade is the R7FA6M3AF3CFP#BA0 offered in?
The R7FA6M3AF3CFP#BA0 is supplied in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) rated for industrial temperature operation from -40°C to +105°C. This package provides mechanical robustness, ease of inspection, and compatibility with standard reflow processes - ideal for ruggedized industrial PCBs.
R7FA6M3AF3CFP#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RA6M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 76
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 19x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M3AF3CFP#BA0 FAQ
1.How can I place an order for R7FA6M3AF3CFP#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M3AF3CFP#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M3AF3CFP#BA0 reliable?
The price and inventory of R7FA6M3AF3CFP#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M3AF3CFP#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA6M3AF3CFP#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M3AF3CFP#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M3AF3CFP#BA0?
R7FA6M3AF3CFP#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M3AF3CFP#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M3AF3CFP#BA0?
For technical support, including R7FA6M3AF3CFP#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M3AF3CFP#BA0 requirements.
6.How does Aetrix verify that R7FA6M3AF3CFP#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M3AF3CFP#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M3AF3CFP#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M3AF3CFP#BA0?
All R7FA6M3AF3CFP#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M3AF3CFP#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M3AF3CFP#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M3AF3CFP#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M3AF3CFP#BA0 Tags
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