Renesas R7FA6M3AH3CFC#BA0
- Part No.:
- R7FA6M3AH3CFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA6M3AH3CFC#BA0.pdf
- Description:
- MCU RA6 ARM CM4 120MHZ 2M/640K Q
- Quantity:
- Payment:

- Shipping:

Inventory:2,269
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6M3AH3CFC#BA0 from Renesas Electronics is a high-performance 32-bit Arm Cortex-M4 microcontroller with FPU, operating at up to 120 MHz, featuring 2-MB code flash, 640-KB SRAM, dual CAN, IEEE 1588 Ethernet MAC (ETHERC), USB 2.0 High-Speed and Full-Speed modules, QSPI, SDHI, GLCDC, DRW, CTSU, and SCE7 security engine - designed for industrial HMI, networked edge devices, and real-time control systems requiring deterministic timing and rich peripheral integration.
For engineers reviewing the R7FA6M3AH3CFC#BA0 datasheet, R7FA6M3AH3CFC#BA0 pinout, R7FA6M3AH3CFC#BA0 application, or R7FA6M3AH3CFC#BA0 equivalent, key selection considerations include its 176-pin LQFP package, 120-MHz real-time performance, integrated graphics acceleration (GLCDC + DRW), dual Ethernet/USB connectivity, hardware crypto acceleration (AES-256, ECC, TRNG), and functional safety support (ECC SRAM, IWDT, CAC, MPU).
Technical Context
The R7FA6M3AH3CFC#BA0 implements an Armv7E-M architecture with DSP extensions and single-precision FPU, supporting deterministic real-time execution in safety-critical contexts. Its memory subsystem includes 2-MB zero-wait-state flash, 64-KB data flash (125k erase cycles), and 640-KB SRAM with ECC on first 32 KB and parity elsewhere.
Peripherals are tightly coupled via the Event Link Controller (ELC) for CPU-free inter-module triggering, and feature dual independent DMA controllers (DMAC × 8, DTC) plus dedicated hardware accelerators including JPEG codec, Sampling Rate Converter (SRC), and Secure Crypto Engine 7 (SCE7) for authenticated encryption and key management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU, 120 MHz max - enables floating-point math-intensive tasks (e.g., motor control, audio processing) without software emulation overhead. |
| Memory | 2-MB code flash (40 MHz zero wait), 64-KB data flash, 640-KB SRAM - supports large firmware images, field-upgradable parameter storage, and real-time buffering for multimedia/audio pipelines. |
| Connectivity | Ethernet MAC (IEEE 1588 PTP), USBHS/USBFS, CAN × 2, QSPI, SDHI × 2 - enables time-synchronized industrial networking, dual-role USB device/host, and high-bandwidth external memory expansion. |
| Analog | ADC12 × 2 (13+11 ch), DAC12 × 2, ACMPHS × 6, PGA × 6, TSN - delivers precision sensor acquisition, closed-loop analog control, and on-die temperature monitoring with hardware-assisted calibration. |
| Graphics & HMI | GLCDC + DRW + JPEG codec + CTSU - provides hardware-accelerated GUI rendering, image decode, capacitive touch sensing, and parallel display interface without CPU load. |
| Security | SCE7 with AES-128/192/256, ECC, RSA, SHA256, TRNG, 128-bit UID - enables secure boot, encrypted firmware updates, and cryptographic key protection compliant with IEC 62443 Level 1. |
| Package | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), -40°C to +105°C - suitable for industrial PCB layouts requiring thermal robustness and hand-solderable form factor. |
Pinout & Package
Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | 2.7–3.6 V core/io supply; multiple distributed pins reduce impedance and improve noise immunity in high-speed digital operation. |
| XTAL1/XTAL2 | Main clock oscillator input | Supports 8–24 MHz crystal for precise system timing; required for Ethernet PTP synchronization and USB HS clock recovery. |
| ETH_MDC/MDIO | Ethernet management interface | Provides MDIO bus access to external PHY registers for link status, speed negotiation, and IEEE 1588 timestamp configuration. |
| USB_VBUS/USB_DP/USB_DM | USB 2.0 High-Speed transceiver interface | Dedicated pins with internal regulator and ESD protection - enable self-powered USB device or host operation without external PHY. |
| QSPI_IO0–QSPI_IO3 | Quad SPI data lines | Supports x4 read/write to external flash at up to 80 MB/s - used for XIP execution or fast firmware update storage. |
| CTSU_S0–CTSU_S15 | Capacitive touch sensing inputs | 16-channel CTSU electrode interface with built-in charge transfer and noise cancellation - enables robust multi-touch button/slider implementation. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Enables application code to be linked to a fixed virtual address while loading to any physical flash location - simplifies OTA firmware updates and reduces bootloader complexity. |
| Event Link Controller (ELC) | Allows direct peripheral-to-peripheral triggering (e.g., ADC conversion complete → DMAC transfer start) without CPU intervention - reduces latency and ISR overhead in real-time control loops. |
| Graphics LCD Controller (GLCDC) | Supports WVGA+ displays with triple-plane overlay (background + 2 graphics layers), 32-bit ARGB output, and GPX bus master access - eliminates external frame buffer RAM in HMI designs. |
| Secure Crypto Engine 7 (SCE7) | Hardware-accelerated AES-256-GCM, ECDSA signature, SHA256 hash, and TRNG - achieves >10× faster crypto than software-only implementations while isolating keys from main memory. |
| Sampling Rate Converter (SRC) | Resamples stereo/mono audio streams (e.g., MP3/WMA decoded output) to match DAC or codec clock domains - enables seamless audio playback across variable-rate sources without CPU-based resampling. |
Applications
| Industrial HMI Panel | Time-Sensitive Networking Gateway |
|---|---|
|
Use Scenario: A factory-floor operator interface with 7-inch TFT display, touch buttons, real-time process visualization, and local data logging. IC Role / Device Role / Timing Role: R7FA6M3AH3CFC#BA0 serves as the central HMI controller, driving display via GLCDC/DRW, sampling touch via CTSU, acquiring sensor data via ADC12/DAC12, and storing logs in data flash. Use Value: Hardware graphics acceleration reduces CPU load below 15%, enabling concurrent Ethernet communication and deterministic response to touch events within 10 ms. |
Use Scenario: An edge gateway synchronizing PLCs, sensors, and actuators across an IEEE 1588-compliant industrial network with sub-microsecond time stamping. IC Role / Device Role / Timing Role: R7FA6M3AH3CFC#BA0 acts as the PTP grandmaster, using ETHERC+EPTPC to generate precise timestamps, coordinate packet scheduling, and maintain <±50 ns clock accuracy. Use Value: On-chip PTP hardware eliminates need for external timestamping ASICs and ensures deterministic latency for motion control and synchronized I/O. |
| Secure USB-C Industrial Dongle | Audio-Enabled Smart Sensor Node |
|
Use Scenario: A field-configurable USB device that bridges Modbus RTU to USB CDC ACM, with firmware signing and secure parameter storage. IC Role / Device Role / Timing Role: R7FA6M3AH3CFC#BA0 operates as USB device (USBFS/USBHS), runs Modbus stack, validates firmware signatures via SCE7, and stores calibrated parameters in protected data flash. Use Value: Integrated USB transceiver and crypto engine eliminate external USB PHY and secure element, reducing BOM cost by $1.80 and board area by 22 mm². |
Use Scenario: A battery-powered acoustic sensor node capturing vibration data, performing FFT analysis, and streaming compressed audio over BLE via USB-serial bridge. IC Role / Device Role / Timing Role: R7FA6M3AH3CFC#BA0 acquires analog signals via ADC12, executes FFT on FPU, compresses output using JPEG codec (for spectrogram), and streams via USBFS. Use Value: Combined SRC, SSIE, and hardware JPEG acceleration enable real-time spectral analysis and visual feedback without external DSP or codec ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M3AH3CFB#AA0 | Same RA6M3 core, identical peripherals, but in 144-pin LQFP (20 mm × 20 mm) with 101 I/O pins and 21 5-V-tolerant pins - smaller footprint, reduced I/O count. | Better suited for space-constrained designs where full 133-pin I/O capability is unnecessary and Ethernet + USB + QSPI remain essential. | Select when PCB area is critical and I/O count can be reduced by ≥23 pins without sacrificing key interfaces. |
| R7FA6M4AF3CFB#AA0 | RA6M4 variant: adds TrustZone support, enhanced SCE7 (AES-GCM, ChaCha20), larger 3-MB flash, same 144-pin LQFP package - no GLCDC/DRW/JPEG. | Targeted at security-first applications (e.g., secure gateways, encrypted data loggers) where graphics acceleration is not required. | Choose when hardware-enforced isolation (TrustZone), stronger crypto, and larger code space outweigh need for on-chip graphics engines. |
Compared with R7FA6M3AH3CFC#BA0, the R7FA6M3AH3CFB#AA0 offers identical functionality in a smaller LQFP package with fewer I/Os, while the R7FA6M4AF3CFB#AA0 trades graphics capability for TrustZone, stronger crypto, and larger flash - making it better for security-critical, non-HMI roles.
Availability
R7FA6M3AH3CFC#BA0 is available at Aetrix Electronics and suitable for industrial HMI panels, time-sensitive networking gateways, secure USB-C industrial dongles, and audio-enabled smart sensor nodes requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.
Supply support for R7FA6M3AH3CFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M3 Group targets high-end industrial and IoT edge devices requiring real-time performance, rich connectivity, graphics capability, and hardware security - with R7FA6M3AH3CFC#BA0 optimized for HMI-rich, networked, and safety-aware applications.
FAQ
What is the maximum operating frequency of the R7FA6M3AH3CFC#BA0?
The R7FA6M3AH3CFC#BA0 operates at a maximum frequency of 120 MHz using its Arm Cortex-M4 core with FPU. This frequency is achievable with zero wait states on its 2-MB code flash memory when running at 40 MHz bus speed, enabling deterministic real-time execution for motor control, audio processing, and protocol stacks without performance throttling.
Does the R7FA6M3AH3CFC#BA0 support IEEE 1588 Precision Time Protocol?
Yes, the R7FA6M3AH3CFC#BA0 integrates a dedicated Ethernet PTP Controller (EPTPC) compliant with IEEE 1588-2008 v2.0. It works in conjunction with the on-chip Ethernet MAC (ETHERC) and PTPEDMAC to provide hardware timestamping, synchronization frame processing, and statistical time correction - achieving sub-microsecond clock accuracy in industrial time-sensitive networks.
What graphics capabilities does the R7FA6M3AH3CFC#BA0 include?
The R7FA6M3AH3CFC#BA0 includes a Graphics LCD Controller (GLCDC), 2D Drawing Engine (DRW), JPEG codec, and Capacitive Touch Sensing Unit (CTSU). Together, they support WVGA+ displays, triple-plane overlay rendering, hardware-accelerated image decode, anti-aliased vector drawing, and robust multi-electrode touch sensing - all without offloading to external GPUs or controllers.
How many USB interfaces does the R7FA6M3AH3CFC#BA0 support, and what speeds are available?
The R7FA6M3AH3CFC#BA0 supports two independent USB modules: USB 2.0 High-Speed (USBHS) and USB 2.0 Full-Speed (USBFS). USBHS operates at up to 480 Mbps (host or device mode), while USBFS supports 12 Mbps (host/device) and 1.5 Mbps (host only). Both include on-chip transceivers and voltage regulators, eliminating need for external PHY components.
What security features are implemented in the R7FA6M3AH3CFC#BA0's Secure Crypto Engine 7 (SCE7)?
The R7FA6M3AH3CFC#BA0's SCE7 provides hardware-accelerated AES-128/192/256 (including GCM mode), 3DES, ARC4, SHA1/224/256, MD5, GHASH, RSA/DSA/ECC, and a True Random Number Generator (TRNG). It also includes a 128-bit unique ID and secure key storage - enabling secure boot, encrypted firmware updates, and cryptographic operations with side-channel resistance.
R7FA6M3AH3CFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA6M3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 124
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M3AH3CFC#BA0 FAQ
1.How can I place an order for R7FA6M3AH3CFC#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M3AH3CFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M3AH3CFC#BA0 reliable?
The price and inventory of R7FA6M3AH3CFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M3AH3CFC#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA6M3AH3CFC#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M3AH3CFC#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M3AH3CFC#BA0?
R7FA6M3AH3CFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M3AH3CFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M3AH3CFC#BA0?
For technical support, including R7FA6M3AH3CFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M3AH3CFC#BA0 requirements.
6.How does Aetrix verify that R7FA6M3AH3CFC#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M3AH3CFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M3AH3CFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M3AH3CFC#BA0?
All R7FA6M3AH3CFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M3AH3CFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M3AH3CFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M3AH3CFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M3AH3CFC#BA0 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

