Renesas R7FA6M4AD2CBM#BC0
- Part No.:
- R7FA6M4AD2CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA6M4AD2CBM#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 512K/256
- Quantity:
- Payment:

- Shipping:

Inventory:2,080
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Product details
Overview
R7FA6M4AD2CBM from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 512 KB code flash, 8 KB data flash, and 256 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure industrial edge nodes and gateway applications.
For engineers reviewing the R7FA6M4AD2CBM datasheet, R7FA6M4AD2CBM pinout, R7FA6M4AD2CBM application, or R7FA6M4AD2CBM equivalent, key selection criteria include its 144-pin BGA package, -40°C to +85°C temperature grade, dual-bank flash architecture with background operation, integrated Ethernet PHY interface support, and hardware-accelerated AES/RSA/SHA256 cryptography.
Technical Context
The R7FA6M4AD2CBM implements Armv8-M with TrustZone security extension, enabling strict isolation between secure and non-secure firmware execution environments. Its memory subsystem includes dual-bank flash supporting SWAP and background programming, plus 256 KB SRAM with configurable parity or ECC protection for functional safety compliance.
Connectivity is centered on a full-featured peripheral set: ETHERC/EDMAC with RMII support, USBFS with internal transceiver, dual CAN 2.0B controllers requiring external transceivers, and QSPI/OSPI interfaces for external XIP-capable flash. The analog subsystem comprises two 12-bit ADCs (5 Msps interleaved), two 12-bit DACs, and an on-die temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max - enables real-time deterministic control with TrustZone-based secure boot and runtime isolation. |
| Code Flash | 512 KB dual-bank - supports background programming and SWAP operations without halting CPU execution. |
| Data Flash | 8 KB - rated for 100,000 P/E cycles; used for parameter storage with wear leveling in firmware. |
| SRAM | 256 KB with parity/ECC - configurable per region for safety-critical data integrity (IEC 61508 SIL2/SIL3). |
| Operating Temp | -40°C to +85°C - qualified for industrial automation and building control environments. |
| Package | 144-pin FBGA (7 mm × 7 mm, 0.50 mm pitch) - compact footprint with 109 I/O pins and 21 5-V-tolerant inputs. |
| Ethernet Interface | ETHERC/EDMAC with RMII - requires external PHY; enables deterministic real-time communication in IIoT gateways. |
| Security Engine | Secure Crypto Engine 9 (SCE9) - hardware-accelerated AES-128/256, RSA-2048/4096, SHA224/256, and 128-bit unique ID. |
Pinout & Package
Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A, 7 mm × 7 mm, 0.50 mm pitch, RoHS-compliant Sn (tin) terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power / Ground | Dedicated power rails with local 0.1 µF decoupling required; VCL/VCL0 for internal LDO stabilization. |
| XTAL / EXTAL | Crystal Oscillator | Supports 8–24 MHz external crystal; enables precise timing for Ethernet, USB, and RTC synchronization. |
| MD / RES | Mode Control / Reset | Hardwired MD pin sets single-chip mode; RES is active-low asynchronous reset with glitch filtering. |
| ETH_MDC / ETH_MDIO | Ethernet Management | IEEE 802.3-compliant MDIO/MDC interface for configuring external PHY registers. |
| USB_DP / USB_DM | USB Transceiver | Integrated full-speed transceiver; no external PHY needed - simplifies USB device/host implementation. |
| CRX0 / CTX0 | CAN Channel 0 | Differential receive/transmit pins; require external ISO1050 or similar CAN transceiver for bus coupling. |
| QSPI_IO0–3 | Quad SPI Data | Four bidirectional pins for x4 read/write; supports octal mode via OSPI interface for high-bandwidth external flash access. |
| ADC0_AN000–AN011 | Analog Input Group 0 | 12-channel 12-bit ADC input; shared pins with digital I/O; supports simultaneous sampling with ADC1 for motor control. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates in field-deployed devices without service interruption or external programmer. |
| TrustZone + SCE9 co-processing | Hardware-enforced secure boot, key injection, tamper detection, and cryptographic acceleration reduce software attack surface. |
| RMII Ethernet + USBFS | Single-chip connectivity for industrial gateways: one chip handles both wired network and USB host/device interfaces. |
| 10x SCI + 2x IIC + 2x SPI | Extensive serial peripheral count supports multi-sensor aggregation, display control, and legacy protocol bridging (e.g., Modbus RTU over SCI). |
| GPT32 × 4 + AGT × 6 | High-resolution PWM generation (BLDC motor control) and low-power event timing (battery-backed wake-up) in same device. |
| CTSU with 20 electrodes | Capacitive touch sensing without external ICs - suitable for HMI panels in medical or industrial equipment. |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Aggregating Modbus RTU sensors over SCI and forwarding data via Ethernet to cloud SCADA systems. IC Role / Device Role / Timing Role: Central protocol translator and real-time scheduler with deterministic Ethernet frame handling and secure TLS offload via SCE9. Use Value: Eliminates need for separate MCU + FPGA + crypto ASIC; reduces BOM cost by 37% and board area by 42% vs. discrete solution. | Use Scenario: Tamper-resistant firmware update endpoint in smart metering infrastructure with remote attestation. IC Role / Device Role / Timing Role: Secure bootloader and runtime root-of-trust anchor using TrustZone-isolated secure world and SCE9 key management. Use Value: Meets DLMS/COSEM and IEC 62056-21 security requirements with hardware-enforced key lifecycle and anti-side-channel resistance. |
| Motor Control Hub | HMI Terminal |
Use Scenario: Driving 3-phase BLDC motors in HVAC compressors with position feedback via Hall sensors. IC Role / Device Role / Timing Role: Real-time PWM generator (GPT32) synchronized to ADC sampling (5 Msps interleaved) and current loop control. Use Value: Achieves <1 µs jitter in PWM output and sub-100 ns ADC trigger latency - meets IEC 60034-30-2 IE4 efficiency class timing constraints. | Use Scenario: Touch-enabled operator panel with LCD backlight control and audio feedback via SSIE. IC Role / Device Role / Timing Role: Capacitive touch controller (CTSU), audio codec interface (SSIE), and display timing generator (RTCOUT/ELC). Use Value: Integrates CTSU, SSIE, and GPT PWM in single chip - eliminates 3 external ICs and reduces EMI from interconnect traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF2CBM | 1 MB code flash (vs. 512 KB); same package, temp grade, and peripheral set. | Required for larger firmware images or dual-application partitioning (e.g., secure + non-secure OS). | Select when firmware size exceeds 400 KB or future-proofing for feature expansion is critical. |
| R7FA6M4AD3CBM | Same 512 KB flash but rated for -40°C to +105°C operation (vs. +85°C). | Necessary for under-hood automotive or high-ambient industrial enclosures where thermal derating is unacceptable. | Choose only if ambient operating temperature exceeds 85°C; otherwise, R7FA6M4AD2CBM offers identical functionality at lower cost. |
Compared with R7FA6M4AD2CBM, R7FA6M4AF2CBM provides double flash capacity for complex OTA stacks, while R7FA6M4AD3CBM extends thermal range without altering I/O count or peripheral features - both retain pin-for-pin compatibility and identical BGA footprint.
Availability
R7FA6M4AD2CBM is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, motor control hubs, and HMI terminals requiring stable component supply across multi-year production cycles.
Supply support for R7FA6M4AD2CBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M4 group - including R7FA6M4AD2CBM - was designed for secure, connected industrial edge devices requiring real-time performance, functional safety, and hardware-rooted trust in resource-constrained environments.
FAQ
What is the maximum operating frequency of the R7FA6M4AD2CBM?
The R7FA6M4AD2CBM features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This clock speed is achieved using the on-chip PLL driven by the main oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6M4AD2CBM maintains full peripheral functionality at this frequency, including real-time Ethernet packet processing and concurrent USBFS transactions.
Does the R7FA6M4AD2CBM include an integrated Ethernet PHY?
No, the R7FA6M4AD2CBM includes only the Ethernet MAC (ETHERC) and DMA controller (EDMAC), not a physical layer transceiver. It supports RMII interface and requires an external PHY such as the LAN8742A or KSZ8081RND. The R7FA6M4AD2CBM provides all necessary MAC registers, descriptor management, and interrupt signaling for full IEEE 802.3 compliance when paired with a compatible PHY.
What security features does the R7FA6M4AD2CBM provide beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M4AD2CBM integrates the Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES-128/256, RSA-2048/4096, ECC, DSA, SHA224/256, and GHASH. It also includes tamper detection pins, secure key injection, device lifecycle management, and power analysis resistance - all coordinated with TrustZone to form a certified secure element subsystem meeting Common Criteria EAL4+ requirements.
Can the R7FA6M4AD2CBM support both USB host and device modes simultaneously?
No, the R7FA6M4AD2CBM USBFS module supports either host or device mode at runtime, but not both simultaneously. Mode selection is configured at initialization via the USB module's MODE register. While it can switch modes dynamically under firmware control, concurrent operation (e.g., acting as a USB host to a flash drive while presenting as a CDC device to a PC) is not supported due to shared endpoint buffers and state machine constraints.
What is the purpose of the dual-bank flash architecture in the R7FA6M4AD2CBM?
The dual-bank flash architecture in the R7FA6M4AD2CBM enables background programming and SWAP operations: one bank executes code while the other is erased or programmed. This allows zero-downtime firmware updates - critical for unattended industrial systems. The R7FA6M4AD2CBM implements this with dedicated control logic that manages bank switching, address remapping, and interrupt masking during transitions without CPU intervention.
R7FA6M4AD2CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA6M4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M4AD2CBM#BC0 FAQ
1.How can I place an order for R7FA6M4AD2CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M4AD2CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R7FA6M4AD2CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M4AD2CBM#BC0 is usually 5 days.
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For technical support, including R7FA6M4AD2CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M4AD2CBM#BC0 requirements.
6.How does Aetrix verify that R7FA6M4AD2CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M4AD2CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M4AD2CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M4AD2CBM#BC0?
All R7FA6M4AD2CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M4AD2CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M4AD2CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M4AD2CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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