Renesas R7FA6M4AD2CBQ#BC0

Overview

R7FA6M4AD2CBQ#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 512 KB dual-bank code flash, 8 KB data flash, and 256 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, 10-channel SCI, dual I²C, dual SPI, SSIE, CTSU, dual 12-bit ADC/DAC, RTC with VBATT support, and Secure Crypto Engine 9 with TrustZone for secure IoT edge nodes and industrial gateways.

For engineers reviewing the R7FA6M4AD2CBQ#BC0 datasheet, R7FA6M4AD2CBQ#BC0 pinout, R7FA6M4AD2CBQ#BC0 application, or R7FA6M4AD2CBQ#BC0 equivalent, key selection considerations include its 64-pin BGA package (7 mm × 7 mm, 0.50 mm pitch), -40°C to +85°C operating range, 2.7–3.6 V supply, 45 GPIOs (9 with 5-V tolerance), and integrated security features enabling certified firmware updates and tamper-resistant operation in connected devices.

Technical Context

The R7FA6M4AD2CBQ#BC0 implements Armv8-M architecture with TrustZone, supporting secure/non-secure execution environments via separate MPU regions (8 per domain) and dedicated SysTick timers. Its memory subsystem includes dual-bank flash enabling background programming and SWAP operations without CPU interruption.

Connectivity is centered on hardware-accelerated peripherals: ETHERC/EDMAC enables zero-CPU packet handling; USBFS supports host/device modes with internal transceiver; QSPI/OSPI controllers interface directly with external OctaFlash and serial ROM; dual CAN modules comply with ISO 11898-1 and support 32 mailboxes with FIFO mode.

Key Specifications

Pinout & Package

64-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0064JC-A, 7 mm × 7 mm body, 0.50 mm ball pitch, RoHS-compliant Sn (tin) terminations.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA6M4AD2CBQ#BC0, the R7FA6M4AF2CBQ#BC0 provides double flash capacity for complex protocol stacks, while R7FA6M4AD3CBQ#BC0 extends thermal reliability-both retain identical pinout, peripheral set, and security architecture, enabling drop-in replacement in compatible PCB layouts.

Availability

R7FA6M4AD2CBQ#BC0 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, building automation controllers, and medical edge sensor hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R7FA6M4AD2CBQ#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RA6M4 Group targets secure, high-connectivity edge applications; R7FA6M4AD2CBQ#BC0 delivers scalable performance, integrated networking, and hardware-rooted security for certified industrial and medical devices.

FAQ

What is the maximum operating frequency of the R7FA6M4AD2CBQ#BC0?

The R7FA6M4AD2CBQ#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This clock speed is achieved via the on-chip PLL driven by the main oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The core maintains full performance across its specified -40°C to +85°C temperature range and 2.7–3.6 V supply voltage, with all peripherals fully functional at maximum frequency.

Does the R7FA6M4AD2CBQ#BC0 support secure boot and firmware updates?

Yes, the R7FA6M4AD2CBQ#BC0 supports secure boot and firmware updates through its integrated Secure Crypto Engine 9 (SCE9) and Arm TrustZone. SCE9 accelerates AES-128/256, RSA-2048, ECC, and SHA256 operations, while TrustZone enforces hardware-isolated secure/non-secure worlds. The dual-bank flash enables atomic SWAP-based updates, and device lifecycle management prevents rollback to compromised firmware versions-key for R7FA6M4AD2CBQ#BC0 deployments in regulated environments.

What package type and pin count does the R7FA6M4AD2CBQ#BC0 use?

The R7FA6M4AD2CBQ#BC0 uses a 64-pin Fine-Pitch Ball Grid Array (FBGA) package, designated PLBG0064JC-A, with 7 mm × 7 mm body size and 0.50 mm ball pitch. It provides 45 general-purpose I/O pins (9 with 5-V tolerance), 1 dedicated NMI input, and dedicated pins for Ethernet, USB, CAN, QSPI, and RTC backup-all matching the mechanical and thermal specifications defined in Renesas' official package drawing.

Can the R7FA6M4AD2CBQ#BC0 operate as a USB host or device?

Yes, the R7FA6M4AD2CBQ#BC0's USB 2.0 Full-Speed module (USBFS) supports both host and device roles. As a device, it enumerates as a CDC, HID, or MSC class peripheral; as a host, it supports low-speed and full-speed devices via its internal transceiver. The USBFS includes 10 configurable pipes, integrated PHY, and dedicated VCC_USB/VSS_USB power domains-enabling direct R7FA6M4AD2CBQ#BC0 connectivity to USB peripherals without external components.

What analog capabilities does the R7FA6M4AD2CBQ#BC0 provide?

The R7FA6M4AD2CBQ#BC0 integrates two independent 12-bit successive approximation ADC units (ADC12), each with up to 12 input channels and 5 Msps interleaved sampling, plus two 12-bit DAC units (DAC12) and an on-die temperature sensor (TSN). Analog inputs share pins with digital functions, and conversion results can trigger DMA transfers or interrupts-supporting precision sensor acquisition, closed-loop motor control, and calibration tasks within the R7FA6M4AD2CBQ#BC0's single-chip architecture.