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Renesas R7FA6M4AE2CBM#BC0

Part No.:
R7FA6M4AE2CBM#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LFBGA
Datasheet:
AetrixR7FA6M4AE2CBM#BC0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 768K/256
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,080

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Product details

Overview

R7FA6M4AE2CBM from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 768 KB dual-bank code flash with background/swap operation, 8 KB data flash, and 256 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure IoT edge nodes and industrial gateways.

For engineers reviewing the R7FA6M4AE2CBM datasheet, R7FA6M4AE2CBM pinout, R7FA6M4AE2CBM application, or R7FA6M4AE2CBM equivalent, key selection criteria include its -40°C to +85°C temperature grade, 144-pin FBGA package (PLBG0144KB-A), dual-bank flash for safe firmware updates, integrated Ethernet PHY interface support, and hardware-accelerated AES/RSA/SHA256 crypto operations.

Technical Context

The R7FA6M4AE2CBM implements Armv8-M architecture with TrustZone security extension, enabling strict isolation between secure and non-secure execution environments. Its dual-bank flash supports seamless background programming and SWAP operations without CPU interruption, critical for OTA updates in field-deployed devices.

It features a full peripheral set including ETHERC/EDMAC for zero-CPU packet handling, two CAN 2.0B controllers with 32 configurable mailboxes, and SCE9 delivering hardware-accelerated symmetric (AES), asymmetric (RSA/ECC), and hash (SHA224/SHA256) cryptography - all coordinated under device lifecycle management and tamper detection.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M33 @ 200 MHz with TrustZone, MPU_S/MPU_NS (8 regions each)
Memory768 KB dual-bank code flash (background/SWAP), 8 KB data flash (100k P/E cycles), 256 KB SRAM with parity/ECC
ConnectivityEthernet MAC (RMII), USB 2.0 FS (host/device), SDHI, QSPI/OSPI, 2× CAN 2.0B, 10× SCI, 2× I²C, 2× SPI, SSIE
Analog2× 12-bit ADC (5 Msps interleaved), 2× 12-bit DAC, on-die temperature sensor (TSN)
SecuritySecure Crypto Engine 9 (AES/RSA/ECC/SHA224/SHA256), 128-bit unique ID, tamper pins, lifecycle management
Package & Temp144-pin FBGA (7 mm × 7 mm, 0.50 mm pitch), operating temperature −40°C to +85°C
Power2.7–3.6 V supply, low-power modes (Deep Software Standby), VBATT backup for RTC/SOSC/backup RAM

Pinout & Package

Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A footprint (7 mm × 7 mm, 0.50 mm pitch), RoHS-compliant Sn (tin) terminal finish.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower / GroundDual power domains: core/analog (VCC) and digital I/O (VCC_IO); decoupling required per datasheet layout guidelines
XTAL / EXTALCrystal Oscillator InterfaceSupports 8–24 MHz external crystal; enables precise clock source for Ethernet/USB timing compliance
ETH_RMII_TXD0–1, ETH_RMII_RXD0–1, ETH_RMII_CRS_DV, ETH_RMII_REF_CLKEthernet RMII InterfaceDirect connection to external PHY; no external transceiver needed for RMII mode
USB_DP / USB_DMUSB 2.0 Full-Speed TransceiverOn-chip transceiver eliminates need for external USB PHY; supports host/device roles
CRX0/CTX0, CRX1/CTX1CAN Bus InterfaceTwo independent CAN 2.0B channels; require external CAN transceivers (e.g., TJA1042T/3)
QSPI_IO0–3, QSPI_CLK, QSPI_CSQuad SPI Flash InterfaceDirect boot and XIP support from external serial NOR flash; 4-line high-speed read/write
OSPI_IO0–7, OSPI_CLK, OSPI_CSOcta SPI Memory InterfaceSupports OctaFlash/OctaRAM for high-bandwidth external memory expansion
SD0_CMD, SD0_CLK, SD0_DAT0–3SD/MMC Host Interface4-bit SDHC/SDXC support; compatible with eMMC 4.51 via MMC bus mode

Key Features

FeatureDesign Value
Dual-bank flash with SWAP operationEnables atomic firmware updates without halting real-time tasks - critical for industrial control and medical devices
Hardware crypto acceleration (SCE9)Offloads AES-128/256, RSA-2048, ECC-256, SHA256 from CPU; reduces latency and power vs. software-only crypto
TrustZone-enabled secure bootVerifies signed firmware images before execution; isolates secure peripherals (RTC, keys, crypto engine) from non-secure world
Integrated Ethernet MAC + DMAZero-CPU packet processing via ETHERC/EDMAC; supports TCP/IP stack offload and time-critical protocols (e.g., IEEE 1588 PTP)
Flexible clock systemMultiple on-chip oscillators (HOCO/MOCO/LOCO), PLL/PLL2, CAC for frequency accuracy monitoring - simplifies BOM and improves startup reliability

Applications

Industrial GatewaySecure Edge Node

Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi.

IC Role / Device Role / Timing Role: Central controller managing dual CAN buses, Ethernet backhaul, and secure TLS handshakes via SCE9.

Use Value: Dual-bank flash enables silent firmware upgrades during maintenance windows; TrustZone isolates credential storage from application firmware.

Use Scenario: Tamper-resistant sensor aggregator in smart metering, collecting thermal, current, and voltage data.

IC Role / Device Role / Timing Role: Secure data acquisition node with encrypted local storage (AES-GCM), RTC timestamping, and tamper-detection GPIOs.

Use Value: Hardware crypto engine ensures sub-10ms encryption latency; battery-backed RTC maintains time across power loss.

Medical IoT HubAutomated Test Equipment

Use Scenario: FDA-compliant patient monitor hub aggregating ECG, SpO₂, and temperature data from Bluetooth LE sensors.

IC Role / Device Role / Timing Role: Real-time data concentrator with USB FS host (for flash drives), SDHI logging, and cryptographic signing of audit logs.

Use Value: 256 KB SRAM with ECC prevents bit-flip corruption in long-duration recordings; SCE9 signs logs with private key stored in secure memory.

Use Scenario: Benchtop test controller interfacing with DUTs via CAN, USB, and analog I/O while running deterministic test sequences.

IC Role / Device Role / Timing Role: Precision timing controller using GPT32 timers (200 MHz base), AGT for low-power wake-up, and CAC for clock calibration.

Use Value: Dual GPT32 units generate synchronized PWM waveforms for stimulus generation; CAC validates oscillator drift before test execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA6M4AF3CBM1 MB code flash, extended temp (−40°C to +105°C), same 144-pin FBGA packageSuitable for under-hood automotive or high-temp industrial enclosures where thermal margin is criticalSelect when >768 KB flash is required or ambient exceeds +85°C; otherwise R7FA6M4AE2CBM offers optimal cost/performance for commercial-grade deployments
R7FA6M5BH2CFPSame RA6M4 family but 100-pin LQFP, 1 MB flash, no Ethernet MAC, adds AI accelerator (DRP-AI)Better suited for compact, AI-inference edge nodes without wired networking requirementsChoose only if board space constraints preclude 144-BGA and Ethernet is unnecessary; lacks ETHERC/EDMAC and RMII pins

Compared with R7FA6M4AF3CBM, the R7FA6M4AE2CBM trades 232 KB flash and 20°C thermal range for lower unit cost and identical peripheral integration - ideal for volume commercial gateways. Against R7FA6M5BH2CFP, it retains full Ethernet and CAN capability at the expense of AI acceleration, making it superior for deterministic networked control.

Availability

R7FA6M4AE2CBM is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, and medical IoT hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R7FA6M4AE2CBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RA6M4 Group targets secure, connected microcontrollers for industrial automation and edge computing, combining high-performance Cortex-M33 execution with hardware-enforced security and rich connectivity - precisely embodied by the R7FA6M4AE2CBM.

FAQ

What is the maximum operating frequency and core architecture of the R7FA6M4AE2CBM?

The R7FA6M4AE2CBM features an Arm Cortex-M33 core operating at a maximum frequency of 200 MHz. It implements the Armv8-M architecture with security extension (TrustZone), supporting both secure and non-secure execution states. The core includes a Memory Protection Unit (MPU) with eight regions for each state, SysTick timers for both worlds, and CoreSight ETM-M33 for trace debugging - all confirmed in the R01DS0365EJ0160 datasheet Rev.1.60.

Does the R7FA6M4AE2CBM support Ethernet connectivity, and what interface does it use?

Yes, the R7FA6M4AE2CBM integrates a single-channel Ethernet MAC (ETHERC) compliant with IEEE 802.3, paired with an Ethernet DMA Controller (EDMAC). It supports RMII physical layer interface with dedicated pins (ETH_RMII_TXD0/1, RXD0/1, CRS_DV, REF_CLK), enabling direct connection to external PHYs like the LAN8742A without requiring external glue logic or bridging ICs.

What security features are implemented in the R7FA6M4AE2CBM beyond Arm TrustZone?

Beyond Arm TrustZone, the R7FA6M4AE2CBM includes the Secure Crypto Engine 9 (SCE9) with hardware acceleration for AES, RSA, ECC, and SHA224/SHA256; 128-bit unique ID; tamper detection via dedicated pins; secure key injection; and device lifecycle management. These features are documented in Section 1.12 of the R01DS0365EJ0160 datasheet and enable certified secure boot, encrypted firmware updates, and runtime attestation for the R7FA6M4AE2CBM.

What is the flash memory configuration of the R7FA6M4AE2CBM, and how does dual-bank operation benefit firmware updates?

The R7FA6M4AE2CBM contains 768 KB of code flash memory organized in dual banks, plus 8 KB of data flash. Dual-bank operation allows background programming of one bank while executing from the other, and supports atomic SWAP operations to switch active banks instantly. This enables fail-safe over-the-air (OTA) updates without interrupting real-time operation - a key requirement verified for the R7FA6M4AE2CBM in industrial and medical applications.

Which package type and pin count does the R7FA6M4AE2CBM use, and what are its key mechanical dimensions?

The R7FA6M4AE2CBM uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package with part code BM, identified as PLBG0144KB-A. Its mechanical dimensions are 7 mm × 7 mm with 0.50 mm ball pitch. It features 109 general-purpose I/O pins, 21 of which are 5-V tolerant, and supports pull-up resistors on all I/Os - specifications confirmed in Table 1.13 and Figure 1.2 of the R01DS0365EJ0160 datasheet for the R7FA6M4AE2CBM.

R7FA6M4AE2CBM#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LFBGA
Series:
RA6M4
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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All R7FA6M4AE2CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M4AE2CBM#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6M4AE2CBM#BC0?

All R7FA6M4AE2CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M4AE2CBM#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M4AE2CBM#BC0 part is unused and in its original packaging.

Return procedure for R7FA6M4AE2CBM#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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