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Renesas R7FA6M4AE3CBM#BC0
- Part No.:
- R7FA6M4AE3CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA6M4AE3CBM#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 768K/256
- Quantity:
- Payment:
- Shipping:
Inventory:2,700
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Product details
Overview
R7FA6M4AE3CBM from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 768 KB dual-bank code flash with background SWAP, 8 KB data flash, 256 KB SRAM with ECC, integrated Ethernet MAC, USB 2.0 Full-Speed, dual CAN, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone for industrial gateway and secure edge node applications.
For engineers reviewing the R7FA6M4AE3CBM datasheet, R7FA6M4AE3CBM pinout, R7FA6M4AE3CBM application, or R7FA6M4AE3CBM equivalent, key selection considerations include its -40°C to +105°C operating range, 144-pin FBGA package (7 mm × 7 mm, 0.50 mm pitch), dual CAN 2.0B compliance, Ethernet MAC with RMII support, and hardware-accelerated AES/RSA/ECC cryptography.
Technical Context
The R7FA6M4AE3CBM implements Armv8-M architecture with TrustZone security extension, supporting secure and non-secure execution states via separate MPU regions (8 each) and memory partitioning across flash, SRAM, and peripherals. Its dual-bank flash enables seamless firmware updates without system interruption.
It integrates a full-featured peripheral set including ETHERC/EDMAC for zero-CPU-load Ethernet frame handling, SCE9 crypto engine with 128-bit unique ID and tamper detection, and dual 12-bit ADCs (5 Msps interleaved) with shared analog input channels - all synchronized via Event Link Controller (ELC) for deterministic low-latency event chaining.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone for hardware-isolated secure/non-secure worlds. |
| Memory | 768 KB dual-bank code flash (SWAP/background operation), 8 KB data flash (100k P/E cycles), 256 KB SRAM with ECC. |
| Operating Temp | -40°C to +105°C; qualified for extended industrial environments without derating. |
| Package | 144-pin FBGA (PLBG0144KB-A), 7 mm × 7 mm, 0.50 mm pitch; supports high-density PCB layouts. |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS (host/device), dual CAN 2.0B, QSPI/OSPI, SDHI, 10× SCI, 2× I²C, 2× SPI, SSIE. |
| Security | Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC, SHA224/256), 128-bit UID, tamper pins, lifecycle management. |
| Analog | Dual 12-bit ADC (ADC12): 12+10 channels, 5 Msps interleaved; dual 12-bit DAC (DAC12); on-die temperature sensor (TSN). |
Pinout & Package
Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A, 7 mm × 7 mm, 0.50 mm ball pitch, RoHS-compliant Sn (Tin) terminations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per bank; decoupling required within 1 mm of each VCC pin using 0.1 µF ceramic capacitors. |
| VBATT | Battery backup supply | Supplies RTC, SOSC, and backup registers during main power loss; supports coin-cell or supercap integration. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; EXTAL accepts external clock source for synchronous system timing. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and low-power wake-up timing. |
| ETH_RMII_RXD[1:0], ETH_RMII_TXD[1:0], ETH_RMII_CRS_DV, ETH_RMII_REF_CLK | Ethernet RMII interface | Direct connection to PHY without external MII transceiver; REF_CLK sourced internally or externally at 50 MHz. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | On-chip transceiver eliminates need for external PHY; requires 27 Ω series resistors and 1.5 kΩ pull-up on DP for device mode. |
| CRX0/CTX0, CRX1/CTX1 | CAN bus transceiver interfaces | Each pair connects to external CAN transceiver (e.g., TJA1042); supports ISO 11898-1 compliant messaging with 32 mailboxes. |
| QSPI_IO[3:0], QSPI_CLK, QSPI_CS | Quad SPI memory interface | Direct boot and XIP support for serial NOR/EEPROM/FeRAM; configurable drive strength and slew rate. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables atomic firmware updates: new image written to inactive bank while active bank executes; SWAP command triggers instant bank switch with no reset. |
| Secure Crypto Engine 9 (SCE9) | Hardware-accelerated AES-128/256 encryption/decryption, RSA-2048/4096 signing/verification, and SHA256 hashing - offloads CPU and prevents side-channel leakage. |
| Event Link Controller (ELC) | Configurable hardware routing of 256+ peripheral events (e.g., ADC EOC → DMA trigger → GPT start) without CPU intervention or interrupt latency. |
| ARM TrustZone with memory partitioning | Enforces isolation between secure firmware (bootloader, key storage) and non-secure application code; flash/SRAM/peripherals assigned secure/non-secure attributes at runtime. |
| Industrial-grade Ethernet + CAN coexistence | Single-chip support for time-critical CAN fieldbus and IP-based Ethernet communication - ideal for protocol gateways in factory automation and energy metering. |
Applications
| Industrial Protocol Gateway | Secure Edge Node |
|---|---|
Use Scenario: Translation between CANopen devices on factory floor and MQTT/HTTP over Ethernet to cloud SCADA systems. IC Role / Device Role / Timing Role: Central protocol translator with real-time CAN message scheduling, Ethernet TCP/IP stack offload, and secure TLS handshake acceleration via SCE9. Use Value: Eliminates dual-MCU architecture; reduces BOM cost by 35% and board area by 40% while maintaining <100 µs CAN-to-Ethernet latency. | Use Scenario: Tamper-resistant remote terminal unit (RTU) for smart grid substations requiring firmware integrity verification and encrypted telemetry upload. IC Role / Device Role / Timing Role: Root-of-trust MCU executing secure boot, runtime attestation, and AES-GCM encrypted data transmission over cellular/LTE modem interface. Use Value: Meets IEC 62443-3-3 SL2 requirements via hardware-enforced secure boot, encrypted flash, and tamper-detect pins tied to physical enclosure switches. |
| Motor Control Hub | Human-Machine Interface (HMI) Controller |
Use Scenario: Compact BLDC motor drive for HVAC compressors with field-oriented control (FOC), thermal monitoring, and CAN diagnostics. IC Role / Device Role / Timing Role: Real-time FOC executor using GPT32 timers for PWM generation, ADC12 for current sensing, and AGT for precise commutation timing. Use Value: Achieves 98.2% motor efficiency at 15 kHz PWM frequency with 120 ns dead-time control precision and integrated overtemperature shutdown. | Use Scenario: Touch-enabled operator panel for medical equipment with gesture recognition, audio feedback, and secure UI state persistence. IC Role / Device Role / Timing Role: HMI processor running CTSU for 20-button capacitive touch, SSIE for stereo audio playback, and RTC-backed secure logging. Use Value: Enables Class II medical certification via built-in safety mechanisms (ECC SRAM, LVD monitoring, WDT/IWDT dual-watchdog architecture). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CBM | 1 MB code flash (vs. 768 KB); identical package, peripherals, and security features. | Suitable for larger firmware images requiring bootloader + dual-application storage or extensive OTA update partitions. | Select when >768 KB flash is needed; same pinout, software compatibility, and qualification profile. |
| STM32H743VI | Arm Cortex-M7 @ 480 MHz; no integrated Ethernet MAC or SCE9; uses external crypto coprocessor for comparable security. | Requires external PHY and crypto IC for equivalent functionality; higher peak performance but greater BOM complexity. | Choose only if M7 instruction throughput is critical and design can absorb added components, layout area, and validation effort. |
Compared with R7FA6M4AF3CBM, the R7FA6M4AE3CBM trades 232 KB flash for lower cost and power in resource-constrained edge nodes; versus STM32H743VI, it delivers integrated Ethernet + hardware crypto at lower system-level BoM cost and reduced design risk.
Availability
R7FA6M4AE3CBM is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, motor control hubs, and HMI controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M4AE3CBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with annual revenue exceeding $10 billion and operations in over 20 countries.
The RA6M4 Group - including R7FA6M4AE3CBM - was designed specifically for secure, connected industrial edge applications demanding real-time responsiveness, functional safety readiness, and hardware-enforced cybersecurity in compact form factors.
FAQ
What is the maximum operating frequency of the R7FA6M4AE3CBM?
The R7FA6M4AE3CBM features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This speed is achievable under full voltage (2.7–3.6 V) and temperature (-40°C to +105°C) specifications, with all peripherals fully operational and clocked from the PLL. The core supports dynamic frequency scaling via software-controlled clock dividers.
Does the R7FA6M4AE3CBM support Ethernet connectivity out of the box?
Yes, the R7FA6M4AE3CBM integrates a full Ethernet MAC controller (ETHERC) compliant with IEEE 802.3 and supports RMII physical layer interface. It requires only an external RMII-compliant PHY (e.g., LAN8720A) and magnetics; no external MAC or glue logic is needed. The ETHERC is tightly coupled with EDMAC for zero-CPU-load packet transfers.
What security features does the R7FA6M4AE3CBM include for firmware protection?
The R7FA6M4AE3CBM includes Arm TrustZone for hardware-isolated secure/non-secure memory spaces, Secure Crypto Engine 9 (SCE9) with AES/RSA/ECC acceleration, 128-bit unique ID, tamper detection pins, and device lifecycle management. These enable secure boot, encrypted firmware updates, and runtime attestation - all without external security ICs.
Is the R7FA6M4AE3CBM pin-compatible with other RA6M4 variants?
Yes, the R7FA6M4AE3CBM is pin-compatible with all RA6M4 Group members in the same 144-pin FBGA package (PLBG0144KB-A), including R7FA6M4AF3CBM and R7FA6M4AD3CBM. Pin functions, power domains, and peripheral mappings are identical; only flash size and temperature grade differ - enabling scalable firmware reuse across product tiers.
What development tools are officially supported for the R7FA6M4AE3CBM?
Renesas provides full support for the R7FA6M4AE3CBM via e2 studio IDE, Flexible Software Package (FSP), and RA Configuration Tool. Hardware tools include the EK-RA6M4 evaluation kit, J-Link debug probes, and Renesas Flash Programmer. All drivers, middleware (including FreeRTOS, TLS, and USB stacks), and security libraries are validated and maintained through the Renesas GitHub repository.
R7FA6M4AE3CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA6M4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M4AE3CBM#BC0 FAQ
1.How can I place an order for R7FA6M4AE3CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M4AE3CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M4AE3CBM#BC0 reliable?
The price and inventory of R7FA6M4AE3CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M4AE3CBM#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M4AE3CBM#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M4AE3CBM#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M4AE3CBM#BC0?
R7FA6M4AE3CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M4AE3CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M4AE3CBM#BC0?
For technical support, including R7FA6M4AE3CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M4AE3CBM#BC0 requirements.
6.How does Aetrix verify that R7FA6M4AE3CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M4AE3CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M4AE3CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M4AE3CBM#BC0?
All R7FA6M4AE3CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M4AE3CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M4AE3CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M4AE3CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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