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Renesas R7FA6M4AF2CBQ#BC0
- Part No.:
- R7FA6M4AF2CBQ#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LFBGA
- Datasheet:
-
R7FA6M4AF2CBQ#BC0.pdf
- Description:
- MCU:RA
- Quantity:
- Payment:
- Shipping:
Inventory:3,016
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Product details
Overview
R7FA6M4AF2CBQ#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 256 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure industrial gateway and edge node applications.
For engineers reviewing the R7FA6M4AF2CBQ#BC0 datasheet, R7FA6M4AF2CBQ#BC0 pinout, R7FA6M4AF2CBQ#BC0 application, or R7FA6M4AF2CBQ#BC0 equivalent, key selection considerations include its 64-pin BGA package (7 mm × 7 mm, 0.50 mm pitch), -40°C to +85°C temperature grade, 2.7–3.6 V supply, dual 12-bit ADCs (5 Msps interleaved), and hardware-accelerated AES/RSA/ECC/SHA256 for secure firmware updates and device authentication.
Technical Context
The R7FA6M4AF2CBQ#BC0 implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via separate MPU_S (8 regions) and MPU_NS (8 regions). Its dual-bank flash enables seamless firmware updates without runtime interruption.
It features integrated peripherals including ETHERC/EDMAC for zero-CPU-load Ethernet frame handling, SCE9 crypto engine with 128-bit unique ID and tamper detection, and CTSU for capacitive touch HMI. The 64-pin BGA variant provides 45 I/O pins with 9× 5-V-tolerant inputs, AGT timers for low-power event counting, and RTC with battery backup support via VBATT.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max - delivers deterministic real-time performance with TrustZone isolation for secure boot and firmware update partitions. |
| Memory | 1 MB dual-bank code flash + 8 KB data flash + 256 KB SRAM (parity/ECC) - enables background programming, SWAP operations, and fault-tolerant data logging. |
| Security | Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC-P256/P384, SHA224/256) + Arm TrustZone - hardware-accelerated cryptographic operations and secure key lifecycle management. |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS (host/device), 2× CAN 2.0B, QSPI/OSPI, SDHI, 10× SCI, 2× I2C, 2× SPI, SSIE - supports industrial protocol stacks (Modbus TCP, CANopen, USB CDC) and external memory expansion. |
| Analog & Timers | 2× 12-bit ADC (5 Msps interleaved), 2× 12-bit DAC, TSN, 4× GPT32, 6× GPT16, 6× AGT - enables precision sensor acquisition, motor control PWM generation, and ultra-low-power wake-up timing. |
| Package & Environment | 64-pin FBGA (7 mm × 7 mm, 0.50 mm pitch), -40°C to +85°C, 2.7–3.6 V - compact footprint suitable for space-constrained industrial controllers and IoT edge nodes. |
Pinout & Package
Package: 64-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm, 0.50 mm ball pitch, Pb-free (Sn), JEDEC standard PLBG0064JC-A footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per bank; decoupling required with 0.1 µF ceramic capacitors placed adjacent to each VCC pin. |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup SRAM during main power loss; supports calendar retention and tamper-detection timestamping. |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise system clock; optional external clock input on EXTAL for synchronous timing sources. |
| ETH_RMII_TXD0/1, TX_EN, RXD0/1, REF_CLK | Ethernet RMII physical layer interface | Direct connection to RMII-compliant PHY (e.g., LAN8720A); no external magnetics required for basic link establishment. |
| USB_DP / USB_DM | Integrated USB 2.0 Full-Speed transceiver | On-die PHY eliminates need for external transceiver; supports device/host mode with 10-pipe endpoint buffer for HID, CDC, or MSC class drivers. |
| CRX0/CTX0, CRX1/CTX1 | CAN bus differential signal pairs | Each pair requires external CAN transceiver (e.g., TJA1057); supports ISO 11898-1 compliant messaging with 32 configurable mailboxes. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables atomic firmware updates: new image written to inactive bank while active bank executes; SWAP instruction triggers immediate bank switch with <10 µs latency. |
| Secure Crypto Engine 9 (SCE9) | Offloads AES-GCM encryption/decryption, ECDSA signature verification, and SHA256 hashing - reduces CPU load by >95% vs. software-only crypto in OTA update workflows. |
| Event Link Controller (ELC) | Hardware routing of peripheral events (e.g., ADC EOC → DMAC trigger → GPT start) without CPU intervention - eliminates interrupt latency and jitter in time-critical control loops. |
| Capacitive Touch Sensing Unit (CTSU) | Self-capacitance measurement engine with built-in noise cancellation; supports up to 20 touch buttons on full 144-pin variant - scaled to 7 channels on 64-pin R7FA6M4AF2CBQ#BC0. |
| Low Power Asynchronous Timers (AGT) | Six independent 16-bit timers powered from LOCO (32.768 kHz); operate in Deep Software Standby mode with sub-µA current draw - ideal for periodic sensor polling without waking core. |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
|
Use Scenario: Protocol translation between fieldbus (CANopen, Modbus RTU) and cloud networks (MQTT over Ethernet/USB). IC Role / Device Role / Timing Role: Central controller managing dual CAN interfaces, Ethernet MAC, USB host for cellular modem, and SCE9 for TLS handshake acceleration. Use Value: Dual-bank flash allows field-upgradable protocol stacks; TrustZone isolates secure boot and TLS key storage from application firmware. |
Use Scenario: Tamper-resistant sensor aggregator in smart metering or building automation with encrypted data logging. IC Role / Device Role / Timing Role: Secure data concentrator using ADC12 for analog sensor inputs, SCE9 for AES-CTR encryption of logs, and RTC+VBATT for time-stamped event capture. Use Value: Hardware tamper detection pins (up to 3) trigger immediate key erasure; 8 KB data flash endures 100,000 P/E cycles for reliable firmware parameter storage. |
| Motor Control Hub | HMI-Enabled PLC |
|
Use Scenario: Compact BLDC motor drive with position feedback, current sensing, and CAN-based command interface. IC Role / Device Role / Timing Role: Real-time PWM generator using GPT32/GPT16 with Hall sensor inputs (GTIU/V/W), ADC12 for phase current sampling, and CAN for motion profile commands. Use Value: 3-phase complementary PWM outputs (GTOUUP/ULO etc.) enable gate driver control with programmable dead-time; 5 Msps ADC interleaving captures current ripple at 20 kHz switching frequency. |
Use Scenario: Programmable logic controller with capacitive touch panel, local display, and Ethernet diagnostics. IC Role / Device Role / Timing Role: HMI processor running CTSU for touch buttons/sliders, SSIE for audio alerts, and Ethernet for remote configuration via web server. Use Value: Integrated CTSU eliminates external touch controller IC; 45 GPIOs on 64-pin BGA support LED indicators, relay drivers, and encoder inputs alongside touch sensing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integration Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CBQ#BC0 | Same core/peripherals but rated for -40°C to +105°C; identical 64-pin BGA package and pinout. | Required for extended-temperature industrial drives or automotive under-hood telemetry. | Select when ambient operating temperature exceeds +85°C; no PCB or firmware changes needed. |
| R7FA6M5BH2CFP#AA0 | RA6M5 series; adds 2× 10/100 Ethernet MAC (dual PHY support), larger 1.5 MB flash, and enhanced SCE10 crypto (post-quantum readiness). | Targeted at multi-interface networking appliances requiring redundant Ethernet links or FIPS 140-3 compliance. | Choose for higher network throughput or future-proof crypto requirements; requires layout revision due to 100-pin LQFP package. |
Compared with R7FA6M4AF2CBQ#BC0, the R7FA6M4AF3CBQ#BC0 offers identical functionality with extended temperature range, while the R7FA6M5BH2CFP#AA0 provides dual Ethernet and stronger crypto at the cost of larger footprint and higher BOM cost - making R7FA6M4AF2CBQ#BC0 optimal for cost-sensitive, single-Ethernet industrial edge nodes.
Availability
R7FA6M4AF2CBQ#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge sensors, motor control hubs, and HMI-enabled PLCs requiring stable component supply across long production lifecycles.
Supply support for R7FA6M4AF2CBQ#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M4 group is designed for secure, connected industrial edge devices - combining high-performance Cortex-M33 execution, hardware crypto acceleration, and rich connectivity (Ethernet, USB, CAN, SDHI) in scalable pin-compatible packages.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M4AF2CBQ#BC0?
The R7FA6M4AF2CBQ#BC0 features an Arm Cortex-M33 core compliant with Armv8-M architecture and operates at a maximum frequency of 200 MHz. It includes TrustZone security extensions, dual 8-region MPUs (secure and non-secure), and CoreSight ETM-M33 for trace debugging. This architecture enables deterministic real-time performance with hardware-enforced security partitioning for applications like secure firmware updates and isolated peripheral access.
Does the R7FA6M4AF2CBQ#BC0 support dual-bank flash operation and background programming?
Yes, the R7FA6M4AF2CBQ#BC0 includes 1 MB of dual-bank code flash memory that supports background programming and SWAP operations. This allows one bank to execute application code while the other is being reprogrammed, enabling seamless over-the-air (OTA) firmware updates without system interruption. The flash endurance is rated for 10,000 program/erase cycles, and background write operations maintain full CPU execution capability.
What security features does the R7FA6M4AF2CBQ#BC0 provide beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M4AF2CBQ#BC0 integrates Renesas' Secure Crypto Engine 9 (SCE9), which provides hardware-accelerated AES-128/256, RSA-2048/4096, ECC-P256/P384, and SHA224/256 operations. It includes tamper detection pins, secure key injection, device lifecycle management, and 128-bit unique ID. These features collectively enable secure boot, encrypted firmware storage, TLS offload, and resistance to side-channel attacks - critical for certified industrial and IoT deployments.
Which communication interfaces are available on the 64-pin BGA package of the R7FA6M4AF2CBQ#BC0?
The R7FA6M4AF2CBQ#BC0 in its 64-pin FBGA package retains full peripheral functionality including Ethernet MAC (RMII), USB 2.0 Full-Speed (device/host), 2× CAN 2.0B, QSPI/OSPI, SDHI, 8× SCI, 2× I2C, 2× SPI, SSIE, and 10× AGT timers. Pin mapping confirms all major interfaces are accessible - for example, ETH_RMII signals occupy dedicated pins (e.g., ETH_TXD0, ETH_RXD0), and USB_DP/DM are routed to balls D1/E1. No interface is disabled due to package reduction.
What is the SRAM configuration and protection mechanism used in the R7FA6M4AF2CBQ#BC0?
The R7FA6M4AF2CBQ#BC0 includes 256 KB of on-chip SRAM configured with selectable parity or ECC error correction. Parity protects 192 KB, while ECC covers the remaining 64 KB - allowing flexible trade-offs between fault detection and memory overhead. Memory Protection Unit (MPU) enforcement is applied per region, and TrustZone extends isolation to secure/non-secure SRAM partitions. This configuration ensures data integrity in safety-critical applications such as industrial control and medical monitoring where silent data corruption must be prevented.
R7FA6M4AF2CBQ#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LFBGA
- Series:
- RA6M4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M4AF2CBQ#BC0 FAQ
1.How can I place an order for R7FA6M4AF2CBQ#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M4AF2CBQ#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M4AF2CBQ#BC0 reliable?
The price and inventory of R7FA6M4AF2CBQ#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M4AF2CBQ#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M4AF2CBQ#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M4AF2CBQ#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M4AF2CBQ#BC0?
R7FA6M4AF2CBQ#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M4AF2CBQ#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M4AF2CBQ#BC0?
For technical support, including R7FA6M4AF2CBQ#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M4AF2CBQ#BC0 requirements.
6.How does Aetrix verify that R7FA6M4AF2CBQ#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M4AF2CBQ#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M4AF2CBQ#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M4AF2CBQ#BC0?
All R7FA6M4AF2CBQ#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M4AF2CBQ#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M4AF2CBQ#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M4AF2CBQ#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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