Renesas R7FA6M4AF3CBM#BC0

Overview

R7FA6M4AF3CBM from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, 256 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications including industrial gateways and connected HMI systems.

For engineers reviewing the R7FA6M4AF3CBM datasheet, R7FA6M4AF3CBM pinout, R7FA6M4AF3CBM application, or R7FA6M4AF3CBM equivalent, key selection considerations include its -40°C to +105°C industrial temperature rating, 144-pin FBGA package (PLBG0144KB-A), dual CAN 2.0B support, hardware-accelerated AES/RSA/ECC cryptography, and integrated Ethernet MAC requiring external PHY - all critical for deterministic real-time control and secure edge connectivity.

Technical Context

The R7FA6M4AF3CBM implements Armv8-M architecture with TrustZone security extension, enabling strict isolation between secure and non-secure firmware execution environments. Its dual-bank flash supports live firmware updates without system interruption, while SCE9 provides dedicated hardware acceleration for AES-128/256, RSA-2048/4096, ECC secp256r1/secp384r1, and SHA-224/256.

System-level integration includes an 8-channel DMAC, Data Transfer Controller (DTC), Event Link Controller (ELC) for CPU-free peripheral chaining, and dual 12-bit ADCs (5 Msps interleaved) with shared analog input channels across units. The MCU supports RMII Ethernet interface and requires external transceiver for CAN and USB physical layer compliance.

Key Specifications

Pinout & Package

Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A footprint (7 mm × 7 mm, 0.50 mm pitch), RoHS-compliant Sn (tin) terminal finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Compared with R7FA6M4AF2CBM, the R7FA6M4AF3CBM adds extended temperature capability essential for outdoor or under-hood deployments; versus R7FA6M4AF3CFB, it offers superior high-frequency signal integrity and board space efficiency in dense industrial layouts.

Availability

R7FA6M4AF3CBM is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, and motor control gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R7FA6M4AF3CBM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The RA6M4 Group targets secure, high-performance industrial and IoT edge applications, integrating Arm TrustZone, hardware crypto acceleration, and rich connectivity to simplify development of certified secure devices.

FAQ

What is the maximum operating frequency of the R7FA6M4AF3CBM?

The R7FA6M4AF3CBM features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This performance level is achieved using the on-chip PLL with supported clock sources including the main crystal oscillator (8–24 MHz), high-speed on-chip oscillator (HOCO), and PLL2. System clocks are fully configurable via the Clock Configuration Register (CKSCR) and verified using the Clock Frequency Accuracy Measurement Circuit (CAC).

Does the R7FA6M4AF3CBM support secure boot and firmware authentication?

Yes, the R7FA6M4AF3CBM supports secure boot through its integrated Secure Crypto Engine 9 (SCE9) and Arm TrustZone. SCE9 enables hardware-accelerated signature verification (RSA-2048/4096, ECDSA) and hash computation (SHA-256), while TrustZone enforces secure memory isolation during boot. The R7FA6M4AF3CBM also includes device lifecycle management registers to prevent unauthorized firmware downgrades or debug access in production units.

What package type and pin count does the R7FA6M4AF3CBM use?

The R7FA6M4AF3CBM uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package with part code PLBG0144KB-A, measuring 7 mm × 7 mm with 0.50 mm pitch. It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, and supports N-channel open-drain outputs with programmable pull-up resistors. This package is optimized for high-density industrial PCB layouts requiring robust thermal and signal integrity.

Can the R7FA6M4AF3CBM operate as a USB host or device?

Yes, the R7FA6M4AF3CBM's USB 2.0 Full-Speed module (USBFS) supports both host and device roles per the Universal Serial Bus Specification 2.0. It includes an internal transceiver, 10-pipe endpoint buffer, and supports control, interrupt, bulk, and isochronous transfers. As a host, it supports low-speed devices; as a device, it can emulate CDC, HID, or MSC classes - all managed via the USBFS driver stack in Renesas' Flexible Software Package (FSP).

What external components are required for Ethernet and CAN functionality on the R7FA6M4AF3CBM?

The R7FA6M4AF3CBM requires external components for both Ethernet and CAN: an RMII-compliant PHY (e.g., LAN8742A or DP83848) must be connected to ETH_MDC/MDIO, TXD0–1, RXD0–1, and REF_CLK; two external CAN transceivers (e.g., TJA1042T/3) are needed for CRX0/CTX0 and CRX1/CTX1, each with common-mode choke, termination resistors, and ESD protection diodes. No external PHY or transceiver is integrated into the R7FA6M4AF3CBM itself.