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Renesas R7FA6M4AF3CBQ#BC0
- Part No.:
- R7FA6M4AF3CBQ#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LFBGA
- Datasheet:
-
R7FA6M4AF3CBQ#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1M/256K
- Quantity:
- Payment:
- Shipping:
Inventory:3,016
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Product details
Overview
R7FA6M4AF3CBQ#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, 256 KB SRAM with ECC, integrated Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.
For engineers reviewing the R7FA6M4AF3CBQ#BC0 datasheet, R7FA6M4AF3CBQ#BC0 pinout, R7FA6M4AF3CBQ#BC0 application, or R7FA6M4AF3CBQ#BC0 equivalent, this page delivers verified core frequency, memory architecture, security engine capabilities, Ethernet/USB connectivity, and package-specific I/O mapping - all confirmed for the 64-pin BGA variant with -40°C to +105°C operation.
Technical Context
The R7FA6M4AF3CBQ#BC0 implements Armv8-M with TrustZone, enabling hardware-isolated secure and non-secure execution environments. Its dual-bank flash supports live firmware updates without interruption, while SCE9 accelerates AES/RSA/ECC/SHA256 operations and enforces tamper detection via dedicated pins.
It integrates ETHERC/EDMAC for zero-CPU packet handling, USBFS with internal transceiver supporting host/device modes, and dual CAN controllers compliant with ISO 11898-1. The 64-pin BGA variant provides 45 I/O pins including 9 with 5-V tolerance, AGT timers for low-power event timing, and CTSU for capacitive touch sensing - all within a 6 mm × 6 mm, 0.65 mm pitch footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max; enables real-time deterministic control with TrustZone isolation. |
| Code Flash | 1 MB dual-bank with background/swap; allows seamless over-the-air (OTA) firmware updates. |
| Data Flash | 8 KB with 100,000 P/E cycles; retains calibration data or configuration parameters across power cycles. |
| SRAM | 256 KB with ECC; detects and corrects single-bit errors for mission-critical data integrity. |
| Operating Temp | -40°C to +105°C; qualified for industrial and extended-temperature embedded deployments. |
| Package | 64-pin FBGA (6 mm × 6 mm, 0.65 mm pitch); compact footprint for space-constrained edge nodes. |
| I/O Count | 45 general-purpose I/O pins; includes 9 with 5-V tolerance for interfacing with legacy peripherals. |
| Security | SCE9 + Arm TrustZone; hardware-accelerated crypto, key management, tamper detection, and lifecycle control. |
Pinout & Package
Package: 64-pin Fine-Pitch Ball Grid Array (FBGA), 6 mm × 6 mm, 0.65 mm ball pitch, PLBG0064JC-A footprint. Compatible with standard reflow profiles and automated optical inspection (AOI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: core (1.1 V) and I/O (2.7–3.6 V); decoupling required per datasheet layout guidelines. |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss; enables calendar retention. |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; critical for Ethernet/USB timing accuracy and system clock stability. |
| USB_DP / USB_DM | Integrated USB 2.0 FS transceiver | No external PHY needed; supports device/host mode with 10-pipe endpoint buffer and VBUS monitoring. |
| CRX0 / CTX0 | CAN0 differential interface | Requires external CAN transceiver; supports ISO 11898-1 (CAN 2.0B) with 32 configurable mailboxes. |
| ETH_MDC / ETH_MDIO | RMII Ethernet management interface | Connects to external PHY for 10/100 Mbps Ethernet; ETHERC+EDMAC offloads CPU from frame processing. |
| QSPI_IO0–3 | Quad SPI data lines | Direct interface to serial NOR flash; enables XIP (execute-in-place) for fast boot and code execution. |
| AGT0IN / AGT0OUT | Low-power asynchronous timer I/O | Enables wake-up from Deep Software Standby on external events; sub-microamp current draw in standby. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables atomic firmware updates without halting real-time tasks or losing connectivity state. |
| Ethernet MAC + DMA controller | Offloads TCP/IP stack processing; supports RMII PHY interface with zero-copy packet buffering. |
| Secure Crypto Engine (SCE9) | Accelerates AES-128/256, RSA-2048, ECC-P256, SHA256; eliminates need for external secure element. |
| Capacitive Touch Sensing Unit (CTSU) | Supports up to 7 touch channels; operates independently of CPU load with built-in noise suppression. |
| Realtime Clock with VBATT support | Maintains calendar (2000–2099) and binary counters during main power loss; auto-leap year correction. |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining (e.g., ADC → DMA → AGT) without CPU intervention or interrupt latency. |
Applications
| Industrial Gateway | Smart Energy Meter |
|---|---|
Use Scenario: Aggregating Modbus RTU, CAN bus, and analog sensor data from field devices into a secure cloud-connected node. IC Role / Device Role / Timing Role: Central protocol translator and TLS-secured MQTT publisher with real-time scheduling via GPT32 timers. Use Value: Dual CAN + SCI × 10 + QSPI enables concurrent legacy fieldbus bridging and encrypted firmware updates over cellular/Wi-Fi. | Use Scenario: High-accuracy electricity meter with tamper detection, time-of-use billing, and remote firmware upgrades. IC Role / Device Role / Timing Role: Secure metering SoC with RTC calendar, ADC12 for voltage/current sampling, and SCE9 for firmware signature verification. Use Value: Tamper pins + SCE9 + TrustZone prevent physical and logical attacks; 256 KB ECC SRAM ensures data integrity during power glitches. |
| Connected Building Controller | Edge AI Sensor Hub |
Use Scenario: HVAC and lighting controller integrating BACnet MS/TP, KNX, and BLE via external bridge ICs. IC Role / Device Role / Timing Role: Real-time deterministic scheduler managing multi-protocol stacks with precise 1-ms task resolution. Use Value: GPT32 × 4 + AGT × 6 + ELC enable synchronized PWM fan control, temperature ramping, and occupancy-triggered dimming. | Use Scenario: Vibration/temperature/audio sensor node performing local inference and streaming feature vectors to cloud. IC Role / Device Role / Timing Role: Low-power edge processor running TinyML models with SSIE for audio capture and CTSU for UI interaction. Use Value: OSPI interface connects to external OctaRAM for model weights; SCE9 accelerates HMAC-based OTA authentication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CFM | 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch); same core, memory, and peripheral set. | Preferred where manual soldering, thermal relief, or mechanical mounting constraints favor LQFP over BGA. | Select R7FA6M4AF3CFM for prototyping, low-volume production, or designs requiring visual inspection and reworkability. |
| R7FA6M4AE3CBQ | Same 64-pin BGA package but with 768 KB code flash; otherwise identical clock, security, and peripheral configuration. | Suitable when firmware size is under 768 KB and cost optimization is prioritized without sacrificing security or connectivity. | Choose R7FA6M4AE3CBQ if application firmware fits in 768 KB and budget-sensitive BOM reduction is required. |
Compared with R7FA6M4AF3CBQ#BC0, R7FA6M4AF3CFM offers identical functionality in a rework-friendly LQFP package, while R7FA6M4AE3CBQ reduces flash capacity by 256 KB to lower unit cost - both retain full TrustZone, SCE9, Ethernet, and CAN compatibility for drop-in design reuse.
Availability
R7FA6M4AF3CBQ#BC0 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, building automation controllers, and edge AI sensor hubs requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability.
Supply support for R7FA6M4AF3CBQ#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M4 Group targets secure, high-performance edge computing with integrated networking and cryptography - designed specifically for industrial IoT, smart infrastructure, and trusted embedded systems.
FAQ
What is the maximum operating frequency of the R7FA6M4AF3CBQ#BC0?
The R7FA6M4AF3CBQ#BC0 features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This clock speed is achieved using the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The R7FA6M4AF3CBQ#BC0 maintains timing compliance across its full -40°C to +105°C operating range with appropriate voltage regulation (2.7–3.6 V).
Does the R7FA6M4AF3CBQ#BC0 include hardware cryptographic acceleration?
Yes, the R7FA6M4AF3CBQ#BC0 integrates the Secure Crypto Engine 9 (SCE9), which provides hardware acceleration for AES-128/256, RSA-2048, ECC-P256, DSA, and SHA224/SHA256. It also includes tamper detection circuitry, secure key injection, and 128-bit unique ID generation - all coordinated with Arm TrustZone to enforce secure boot and runtime isolation. The R7FA6M4AF3CBQ#BC0 does not require external crypto co-processors for TLS or secure firmware updates.
What package type and pin count does the R7FA6M4AF3CBQ#BC0 use?
The R7FA6M4AF3CBQ#BC0 uses a 64-pin Fine-Pitch Ball Grid Array (FBGA) package with dimensions of 6 mm × 6 mm and 0.65 mm ball pitch (PLBG0064JC-A). It provides 45 general-purpose I/O pins, including 9 with 5-V tolerance, and supports industrial temperature operation from -40°C to +105°C. This compact BGA variant is optimized for high-density PCB layouts in space-constrained edge devices.
Can the R7FA6M4AF3CBQ#BC0 support Ethernet connectivity?
Yes, the R7FA6M4AF3CBQ#BC0 includes a fully integrated Ethernet MAC (ETHERC) compliant with IEEE 802.3 and an associated Ethernet DMA Controller (EDMAC). It supports RMII interface to external PHYs for 10/100 Mbps operation. The R7FA6M4AF3CBQ#BC0 handles frame reception/transmission without CPU involvement via DMA, and includes hardware timestamping and checksum offload - making it suitable for real-time industrial Ethernet applications.
Is the R7FA6M4AF3CBQ#BC0 pin-compatible with other RA6M4 variants?
The R7FA6M4AF3CBQ#BC0 shares the same 64-pin BGA footprint (PLBG0064JC-A) with other RA6M4 parts in the CBQ suffix family, including R7FA6M4AE3CBQ and R7FA6M4AD3CBQ. Pin functions are identical across these variants; only code flash size differs (1 MB vs. 768 KB vs. 512 KB). However, it is not pin-compatible with LQFP or larger BGA variants (e.g., CBM, CFB) due to differing pin counts and signal allocations.
R7FA6M4AF3CBQ#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LFBGA
- Series:
- RA6M4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M4AF3CBQ#BC0 FAQ
1.How can I place an order for R7FA6M4AF3CBQ#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M4AF3CBQ#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M4AF3CBQ#BC0 reliable?
The price and inventory of R7FA6M4AF3CBQ#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M4AF3CBQ#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M4AF3CBQ#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M4AF3CBQ#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M4AF3CBQ#BC0?
R7FA6M4AF3CBQ#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M4AF3CBQ#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M4AF3CBQ#BC0?
For technical support, including R7FA6M4AF3CBQ#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M4AF3CBQ#BC0 requirements.
6.How does Aetrix verify that R7FA6M4AF3CBQ#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M4AF3CBQ#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M4AF3CBQ#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M4AF3CBQ#BC0?
All R7FA6M4AF3CBQ#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M4AF3CBQ#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M4AF3CBQ#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M4AF3CBQ#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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