My Inquiry
My Account
Renesas R7FA6M4AF3CFM#BA0
- Part No.:
- R7FA6M4AF3CFM#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R7FA6M4AF3CFM#BA0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1M/256K
- Quantity:
- Payment:
- Shipping:
Inventory:4,554
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6M4AF3CFM#BA0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 256 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure industrial gateways and edge IoT nodes.
For engineers reviewing the R7FA6M4AF3CFM#BA0 datasheet, R7FA6M4AF3CFM#BA0 pinout, R7FA6M4AF3CFM#BA0 application, or R7FA6M4AF3CFM#BA0 equivalent, key selection criteria include its -40°C to +105°C extended temperature rating, 64-pin LQFP package, dual CAN support, integrated Ethernet MAC requiring external PHY, and SCE9-accelerated AES/RSA/SHA256 for firmware signing and secure boot.
Technical Context
The R7FA6M4AF3CFM#BA0 implements Armv8-M architecture with TrustZone security partitioning, supporting secure/non-secure MPU regions and isolated Systick timers. Its memory subsystem includes dual-bank flash enabling live firmware updates without interruption and ECC-protected SRAM for safety-critical execution.
Connectivity is centered on hardware-accelerated peripherals: ETHERC/EDMAC enables zero-CPU packet handling; USBFS supports host/device roles with internal transceiver; QSPI/OSPI controllers interface directly with external OctaFlash and serial NOR; and dual CAN modules comply with ISO 11898-1 with 32 configurable mailboxes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz with TrustZone and dual Systick timers |
| Memory | 1 MB dual-bank code flash (background/swap), 8 KB data flash, 256 KB SRAM with parity/ECC |
| Operating Temp | -40°C to +105°C - qualified for industrial edge and automotive under-hood applications |
| Package | 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch) - 41 I/O pins, 9 with 5-V tolerance |
| Security | Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC, SHA224/256) + TrustZone memory/peripheral isolation |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS (host/device), dual CAN 2.0A/B, QSPI/OSPI, SDHI, 10× SCI, 2× I²C, 2× SPI, SSIE |
| Analog | Dual 12-bit ADC (5 Msps interleaved), dual 12-bit DAC, on-die temperature sensor (TSN) |
Pinout & Package
64-pin LQFP (PLQP0064KB-C), 10 mm × 10 mm, 0.5 mm pitch. Pin count matches R7FA6M4AF3CFM#BA0's documented 41 I/O pins, 1 input-only pin, 42 pull-up resistors, 41 N-ch open-drain outputs, and 9 5-V tolerant pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power and ground pairs with local 0.1-µF decoupling required per VCC pin |
| VBATT | Battery backup supply | Enables RTC and backup SRAM retention during main power loss; connects to coin cell or supercap |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise system clock generation and PLL reference |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar accuracy and low-power wake-up timing |
| MD | Mode control | Hardwired to VSS or VCC at reset to select single-chip or SCI/USB boot mode - must remain static post-reset |
| RES | Reset input | Active-low asynchronous reset pin; internal pull-up ensures reliable startup without external RC network |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for configuring external PHY registers in RMII topology |
| USB_DP / USB_DM | USB differential data lines | On-chip full-speed transceiver eliminates need for external PHY; requires 1.5-kΩ pull-up on DP for device enumeration |
| CRX0 / CTX0, CRX1 / CTX1 | CAN transceiver interfaces | Two independent CAN channels compliant with ISO 11898-1; each requires external CAN transceiver (e.g., TJA1042) |
| QSPI_IO0–IO3 / OSPI_IO0–IO7 | Quad/Octa SPI data lanes | Hardware-controlled high-speed interface to external flash; OSPI supports x8 DDR mode for >200 MB/s read throughput |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables seamless firmware updates: new image written to inactive bank while active bank executes; atomic bank swap on next reset |
| Ethernet MAC + DMA (ETHERC/EDMAC) | Offloads TCP/IP stack processing by enabling direct memory access for frame transmission/reception without CPU intervention |
| Secure Crypto Engine 9 (SCE9) | Hardware-accelerated cryptographic operations reduce firmware signing latency by >10× vs. software-only AES-256 and enable secure key injection via JTAG debug port lockdown |
| Capacitive Touch Sensing Unit (CTSU) | Supports up to 7 touch electrodes with noise immunity for HMI panels - operates independently of CPU during sleep modes |
| Event Link Controller (ELC) | Configurable hardware routing between peripherals (e.g., ADC trigger → GPT capture → DMA transfer) eliminates interrupt latency and CPU polling overhead |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi. IC Role / Device Role / Timing Role: Central MCU managing dual CAN for legacy equipment, Ethernet for LAN backhaul, and SCE9 for TLS 1.3 handshake acceleration. Use Value: Dual-bank flash allows OTA firmware updates without downtime; TrustZone isolates secure boot and TLS keys from application firmware. | Use Scenario: Tamper-resistant sensor aggregator in smart metering with encrypted data logging and remote firmware validation. IC Role / Device Role / Timing Role: Trusted execution environment hosting secure bootloader, SCE9-managed key storage, and RTC-backed time-stamped event logging. Use Value: Tamper detection pins trigger immediate key erasure; 128-bit unique ID enables device-specific certificate binding for PKI enrollment. |
| Automotive Body Control | Medical Data Logger |
Use Scenario: In-vehicle gateway consolidating LIN, CAN, and USB diagnostics across lighting, HVAC, and infotainment domains. IC Role / Device Role / Timing Role: Real-time scheduler coordinating 10× SCI UARTs for LIN masters, dual CAN for vehicle bus communication, and USBFS for service tool connectivity. Use Value: AGT timers provide precise 1-ms wakeup intervals for periodic sensor polling; -40°C to +105°C rating ensures reliability in engine bay proximity. | Use Scenario: Portable ECG monitor capturing analog biopotentials, performing real-time FFT analysis, and storing encrypted waveform data to SD card. IC Role / Device Role / Timing Role: High-fidelity signal acquisition using dual 12-bit ADCs at 5 Msps interleaved rate, SDHI for high-throughput storage, and CTSU for user interface buttons. Use Value: On-die temperature sensor (TSN) compensates ADC offset drift; 256 KB SRAM buffers 30 seconds of raw waveform before encryption and write. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CBM#AA0 | 144-pin BGA package, 109 I/O pins, supports external bus interface (16-bit), higher pin count enables more parallel peripherals | Suitable for designs requiring RMII Ethernet + external SDRAM + QSPI simultaneously - not feasible in 64-pin LQFP | Select when board layout accommodates BGA and system demands expanded peripheral concurrency beyond R7FA6M4AF3CFM#BA0's 41 I/O limit |
| R7FA6M4AE3CFM#BA0 | 768 KB code flash (vs. 1 MB), identical 64-pin LQFP package, same peripheral set and temperature grade | Cost-optimized variant for applications with smaller firmware footprints where dual-bank update headroom is not required | Choose when firmware size remains below 600 KB and background flash programming is unnecessary - reduces BOM cost without sacrificing I/O or features |
Compared with R7FA6M4AF3CFM#BA0, the R7FA6M4AF3CBM#AA0 offers greater I/O and external bus capability at the cost of BGA assembly complexity, while the R7FA6M4AE3CFM#BA0 trades 256 KB flash capacity for lower unit cost in space-constrained, firmware-light deployments.
Availability
R7FA6M4AF3CFM#BA0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, and automotive body control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M4AF3CFM#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M4 Group, including R7FA6M4AF3CFM#BA0, was designed for secure, high-performance edge computing - integrating TrustZone, SCE9, and rich connectivity to accelerate development of certified IoT endpoints and industrial controllers.
FAQ
What is the maximum operating frequency of the R7FA6M4AF3CFM#BA0?
The R7FA6M4AF3CFM#BA0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved via the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The core sustains this frequency across its full -40°C to +105°C operating range, with voltage regulation maintained between 2.7 V and 3.6 V VCC.
Does the R7FA6M4AF3CFM#BA0 include an integrated Ethernet PHY?
No, the R7FA6M4AF3CFM#BA0 includes only the Ethernet MAC layer (ETHERC) and DMA controller (EDMAC); it requires an external PHY IC (e.g., LAN8742A) for physical layer signaling. The RMII interface is implemented with dedicated pins (ETH_REF_CLK, ETH_RXD[1:0], ETH_TXD[1:0], ETH_CRS_DV, ETH_TX_EN), and the MDIO/MDC bus manages PHY configuration.
How does the dual-bank flash architecture benefit firmware updates on the R7FA6M4AF3CFM#BA0?
The R7FA6M4AF3CFM#BA0's dual-bank flash enables true background firmware updates: while the active bank runs the current application, the inactive bank receives the new image via QSPI or USB. Upon successful verification, the SWAP operation atomically redirects execution to the updated bank at the next reset - eliminating downtime and preventing bricking during power loss.
What security features are implemented in hardware on the R7FA6M4AF3CFM#BA0?
The R7FA6M4AF3CFM#BA0 integrates Arm TrustZone for memory and peripheral isolation, a Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES-128/256, RSA-2048/4096, ECC, and SHA224/256, plus tamper detection pins and secure key injection. These features collectively support secure boot, encrypted firmware storage, and TLS offload - all without software-based crypto libraries.
Can the R7FA6M4AF3CFM#BA0 support both USB host and device modes simultaneously?
No, the R7FA6M4AF3CFM#BA0's USB 2.0 Full-Speed module (USBFS) supports either host or device mode per runtime configuration - not concurrent operation. Mode selection is controlled by the USBPHYTYPE register during initialization. While it can switch modes across resets, hardware resources (endpoint buffers, pipe allocation) are shared, preventing simultaneous host/device enumeration.
R7FA6M4AF3CFM#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RA6M4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 41
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M4AF3CFM#BA0 FAQ
1.How can I place an order for R7FA6M4AF3CFM#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M4AF3CFM#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M4AF3CFM#BA0 reliable?
The price and inventory of R7FA6M4AF3CFM#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M4AF3CFM#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA6M4AF3CFM#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M4AF3CFM#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M4AF3CFM#BA0?
R7FA6M4AF3CFM#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M4AF3CFM#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M4AF3CFM#BA0?
For technical support, including R7FA6M4AF3CFM#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M4AF3CFM#BA0 requirements.
6.How does Aetrix verify that R7FA6M4AF3CFM#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M4AF3CFM#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M4AF3CFM#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M4AF3CFM#BA0?
All R7FA6M4AF3CFM#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M4AF3CFM#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M4AF3CFM#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M4AF3CFM#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M4AF3CFM#BA0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
