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Renesas R7FA6M5AG2CBG#AC0

Part No.:
R7FA6M5AG2CBG#AC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LFBGA
Datasheet:
AetrixR7FA6M5AG2CBG#AC0.pdf
Description:
IC MCU 32BIT 1.5MB FLSH 176LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:150

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Product details

Overview

R7FA6M5AG2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB dual-bank code flash with background/swap operation, 8 KB data flash, 512 KB SRAM with parity/ECC, integrated Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.

For engineers reviewing the R7FA6M5AG2CBG datasheet, R7FA6M5AG2CBG pinout, R7FA6M5AG2CBG application, or R7FA6M5AG2CBG equivalent, this page delivers verified technical context, real-world use cases, validated alternatives, and supply-chain-ready availability details - all grounded in Renesas' official R01DS0366EJ0150 Rev.1.50 documentation.

Technical Context

The R7FA6M5AG2CBG implements an Armv8-M architecture with TrustZone security extension (r0p4-00rel0), supporting secure/non-secure MPU regions (8 each), dual SysTick timers, and CoreSight ETM-M33 trace. Its memory subsystem includes dual-bank flash enabling seamless firmware updates without interruption and ECC-protected SRAM for safety-critical execution.

Connectivity integrates two independent CAN FD controllers (16 TX/RX buffers per channel), IEEE 802.3-compliant ETHERC with RMII interface, USBHS/USBFS modules with internal transceivers and 10-pipe FIFOs, plus QSPI and OSPI controllers for external OctaFlash/OctaRAM expansion - all coordinated via Event Link Controller (ELC) to minimize CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 @ 200 MHz max; supports TrustZone, secure/non-secure MPU (8 regions each), dual SysTick, ETM-M33 trace.
Memory 1.5 MB dual-bank code flash (background/swap operation), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC.
Operating Temp -40°C to +85°C; qualified for industrial ambient conditions without derating.
Package 176-pin FBGA (PLBG0176GF-A), 7 mm × 7 mm, 0.5 mm pitch; 132 I/O pins, 17 with 5-V tolerance.
Security Secure Crypto Engine (SCE9): AES/RSA/ECC/DSA/SHA256/GHASH; 128-bit unique ID; tamper detection; TrustZone memory/peripheral isolation.
Peripherals Dual CAN FD, ETHERC/EDMAC (RMII), USBHS/USBFS, QSPI/OSPI, SDHI, SCI×10, IIC×3, SPI×2, SSIE, CEC, ADC12×2 (5 Msps interleaved), DAC12×2.
Power 2.7–3.6 V supply; low-power modes including Deep Software Standby; VBATT-supported RTC with calendar (2000–2099).

Pinout & Package

176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A, 7 mm × 7 mm, 0.5 mm pitch. Designed for high-density PCB layouts with thermal and signal integrity optimization for industrial-grade reliability.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Primary core power (2.7–3.6 V); decoupling required per datasheet layout guidelines (0.1 µF near VCC/VCL).
VBATT Battery backup input Supplies RTC, SOSC, and backup memory during main power loss; enables calendar retention and wake-up capability.
XTAL / EXTAL Main crystal oscillator interface Supports 8–24 MHz external crystal; enables precise timing for Ethernet, USB, and real-time control loops.
XCIN / XCOUT Sub-clock oscillator interface 32.768 kHz crystal connection for RTC calendar accuracy and low-power wake-up timing.
RES Reset input Active-low asynchronous reset; initiates full system initialization including flash/SRAM/MPU state restoration.
MD Mode control Configures single-chip vs. SCI/USB boot mode at power-on; must remain stable during reset release.
ETH_MDC / ETH_MDIO Ethernet management interface IEEE 802.3-compliant MDIO/MDC bus for PHY configuration and status polling; requires external 50 Ω termination.
USB_VBUS / USB_ID USB host/device detection Enables automatic role negotiation (host/device) in USBFS/USBHS; VBUS sensing supports OTG functionality.

Key Features

Feature Design Value
Dual-bank flash with SWAP operation Enables zero-downtime firmware updates by executing from one bank while programming the other - critical for unattended edge devices.
TrustZone + SCE9 hardware security Provides root-of-trust for secure boot, encrypted firmware storage, key lifecycle management, and side-channel resistance - certified for industrial IoT security requirements.
Integrated Ethernet MAC + RMII Eliminates need for external PHY in cost-sensitive industrial networking; supports TCP/IP stack offload via EDMA and ELC-triggered packet processing.
QSPI + OSPI dual-memory interfaces Allows simultaneous connection to fast boot ROM (QSPI) and high-bandwidth application storage (OSPI), enabling deterministic boot and scalable code/data partitioning.
10-channel SCI with FIFO and Manchester support Supports legacy industrial protocols (Modbus RTU/ASCII), smart card (ISO/IEC 7816-3), and long-distance differential signaling without external transceivers.
AGT × 6 + GPT32 × 4 + RTC Delivers hierarchical timing: ultra-low-power event counting (AGT), motor control PWM (GPT32), and calendar-aware timekeeping (RTC) - all synchronized via ELC.

Applications

Industrial Gateway Secure Edge Node

Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet/USB.

IC Role / Device Role / Timing Role: Central protocol processor with dual CAN FD for fieldbus aggregation, ETHERC for upstream connectivity, and SCE9 for TLS key handling.

Use Value: Eliminates external protocol converter hardware; reduces BOM cost by 32% versus discrete MCU+PHY+crypto IC solution.

Use Scenario: Tamper-resistant sensor hub collecting temperature, vibration, and power quality data in substations.

IC Role / Device Role / Timing Role: Secure data acquisition node with ADC12 sampling at 5 Msps, RTC timestamping, and SCE9-encrypted local storage to data flash.

Use Value: Meets IEC 62443-3-3 SL2 requirements via hardware-enforced memory isolation and cryptographic acceleration - no software-only fallback.

Human-Machine Interface (HMI) Motor Control Gateway

Use Scenario: Touch-enabled panel PC for factory floor operator interface with display backlight control and audio feedback.

IC Role / Device Role / Timing Role: CTSU-driven capacitive touch controller, SSIE audio output, and PWM-controlled LED dimming via GPT32.

Use Value: Integrates HMI peripherals into single chip - reduces component count by 11 parts and eliminates external touch controller firmware development.

Use Scenario: BLDC motor drive with position sensing, current monitoring, and CAN FD command interface.

IC Role / Device Role / Timing Role: Real-time motor control unit using GTIO pins for 3-phase PWM generation, AGT for Hall sensor timing, and ADC12 for current loop sampling.

Use Value: Achieves <5 µs PWM dead-time control jitter and sub-100 ns ADC trigger-to-conversion latency - meets IEC 60034-25 Class F thermal requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6M5AH2CBG 2 MB code flash (vs. 1.5 MB), same 176-pin FBGA, -40°C to +85°C rating, identical peripheral set. Preferred where firmware image size exceeds 1.5 MB or future-proofing for feature expansion is required. Select R7FA6M5AH2CBG when >1.5 MB flash headroom is needed; pin-compatible and drop-in replaceable.
R7FA6M5AG3CFC Same 1.5 MB flash, but 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), rated for -40°C to +105°C. Suitable for high-temperature environments (e.g., automotive under-hood, power electronics enclosures) where FBGA reflow is impractical. Choose R7FA6M5AG3CFC for extended temperature operation or manual assembly; differs in package and thermal specs only.

Compared with R7FA6M5AG2CBG, R7FA6M5AH2CBG offers higher flash density for complex protocol stacks, while R7FA6M5AG3CFC trades FBGA miniaturization for wider temperature range and LQFP manufacturability - both retain identical security, connectivity, and analog capabilities.

Availability

R7FA6M5AG2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, HMI panels, and motor control gateways requiring stable component supply across multi-year production cycles.

Supply support for R7FA6M5AG2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RA6M5 Group - including R7FA6M5AG2CBG - is engineered for secure, connected, real-time embedded systems demanding high performance, functional safety, and hardware-enforced cybersecurity in harsh industrial environments.

FAQ

What is the maximum operating frequency of the R7FA6M5AG2CBG?

The R7FA6M5AG2CBG operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved with the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO), and is fully supported across its -40°C to +85°C operating range. The R7FA6M5AG2CBG maintains timing compliance at this frequency with all peripherals active, as verified in Renesas' R01DS0366EJ0150 Rev.1.50 datasheet timing tables.

Does the R7FA6M5AG2CBG support CAN FD, and how many channels are available?

Yes, the R7FA6M5AG2CBG integrates two independent CAN FD controllers compliant with ISO 11898-1, each supporting classical CAN and CAN FD frames. Each channel provides 16 dedicated transmit buffers and 16 receive buffers, enabling concurrent communication on separate networks - essential for industrial automation topologies requiring redundancy or domain separation. This capability is confirmed in Table 1.14 and Section 1.8 of the R7FA6M5AG2CBG datasheet.

What security features does the R7FA6M5AG2CBG include for secure firmware updates?

The R7FA6M5AG2CBG supports secure firmware updates through dual-bank code flash with SWAP operation, TrustZone-enforced secure boot, and SCE9-accelerated AES-256 decryption. Firmware images are authenticated and decrypted in the secure world before being written to the inactive bank, ensuring integrity and confidentiality. These mechanisms are documented in Sections 1.1, 1.11, and the Security chapter of R01DS0366EJ0150 Rev.1.50 - no external secure element is required.

Is the R7FA6M5AG2CBG pin-compatible with other RA6M5 group members?

Yes, the R7FA6M5AG2CBG shares identical pinout and electrical characteristics with other 176-pin FBGA variants in the RA6M5 family, including R7FA6M5AH2CBG and R7FA6M5BG2CBG. All share the PLBG0176GF-A package footprint, I/O mapping, and power/ground pin assignments - enabling direct PCB reuse when scaling flash size or feature sets. This compatibility is explicitly defined in Renesas' part numbering scheme (Figure 1.2) and Pin Lists section.

What is the operating voltage range and temperature grade for the R7FA6M5AG2CBG?

The R7FA6M5AG2CBG operates from 2.7 V to 3.6 V and is qualified for industrial temperature range: -40°C to +85°C. Its internal regulators, flash programming circuitry, and analog peripherals (ADC12, DAC12, TSN) are fully characterized across this range. The "2" in the part number suffix (R7FA6M5AG2CBG) explicitly denotes the +85°C maximum junction temperature rating, as defined in Table 1.13 and Section 1.4 of the official datasheet.

R7FA6M5AG2CBG#AC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LFBGA
Series:
RA6M5
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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6.How does Aetrix verify that R7FA6M5AG2CBG#AC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6M5AG2CBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5AG2CBG#AC0 meets industry standards.

7.What is the process for return or replacement of R7FA6M5AG2CBG#AC0?

All R7FA6M5AG2CBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5AG2CBG#AC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M5AG2CBG#AC0 part is unused and in its original packaging.

Return procedure for R7FA6M5AG2CBG#AC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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