Renesas R7FA6M5AG2CBM#BC0

Overview

R7FA6M5AG2CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB dual-bank code flash, 8 KB data flash, 512 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 High-Speed, dual CAN FD, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone support. It targets industrial IoT gateways requiring secure, real-time connectivity and deterministic control.

For engineers reviewing the R7FA6M5AG2CBM#BC0 datasheet, R7FA6M5AG2CBM#BC0 pinout, R7FA6M5AG2CBM#BC0 application, or R7FA6M5AG2CBM#BC0 equivalent, key selection criteria include its -40°C to +85°C temperature grade, 144-pin BGA package (7 mm × 7 mm, 0.5 mm pitch), dual CAN FD interface, hardware-accelerated cryptography, and support for background flash programming and SWAP operations.

Technical Context

The R7FA6M5AG2CBM#BC0 implements Armv8-M architecture with TrustZone security extension, enabling strict isolation between secure and non-secure firmware execution environments. Its dual-bank flash supports seamless firmware updates via background operation and SWAP mode without system interruption.

It integrates a full-featured Ethernet MAC (RMII only), USB 2.0 High-Speed host/device controller, two independent CAN FD controllers (16 TX/RX buffers each), and advanced analog peripherals including dual 12-bit ADCs (5 Msps interleaved) and dual 12-bit DACs - all synchronized via Event Link Controller (ELC) for low-latency peripheral coordination without CPU intervention.

Key Specifications

Pinout & Package

144-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm body, 0.5 mm ball pitch, RoHS-compliant Sn (Tin) termination. Package code: BM. Operating temperature range: -40°C to +85°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R7FA6M5AG2CBM#BC0, R7FA6M5AH2CBM offers 500 KB more flash for complex protocol stacks or dual-image redundancy, while R7FA6M5AG3CBM extends thermal capability to +105°C - both retain identical pinout, peripherals, and security features, enabling drop-in replacement in compatible layouts.

Availability

R7FA6M5AG2CBM#BC0 is available at Aetrix Electronics and suitable for industrial automation, smart energy infrastructure, and networked HMI applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R7FA6M5AG2CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with deep expertise in microcontrollers, analog, and power technologies.

The RA6M5 Group is designed for secure, high-performance industrial and IoT edge applications demanding real-time responsiveness, rich connectivity, and hardware-enforced security - exemplified by the R7FA6M5AG2CBM#BC0's integration of TrustZone, SCE9, and dual CAN FD.

FAQ

What is the maximum operating frequency of the R7FA6M5AG2CBM#BC0?

The R7FA6M5AG2CBM#BC0 features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This clock speed is achieved using the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The 200 MHz performance enables real-time execution of complex protocol stacks, motor control algorithms, and cryptographic operations without external acceleration.

Does the R7FA6M5AG2CBM#BC0 support USB 2.0 High-Speed functionality?

Yes, the R7FA6M5AG2CBM#BC0 integrates a dedicated USB 2.0 High-Speed (480 Mbps) module (USBHS) that operates in both host and device modes. It includes an internal transceiver, 10-pipe FIFO buffer, and full support for control, bulk, interrupt, and isochronous transfers per USB 2.0 specification. This eliminates the need for an external PHY in most designs, reducing BOM cost and board space.

What security features are implemented in the R7FA6M5AG2CBM#BC0?

The R7FA6M5AG2CBM#BC0 integrates Renesas' Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES-128/256, RSA-2048/4096, ECC P-256/P-384, SHA224/256, and GHASH. Combined with Arm TrustZone, it provides secure boot, tamper detection, power analysis resistance, and hardware-isolated secure/non-secure memory regions - meeting requirements for PSA Certified Level 3 and IEC 62443-3-3 compliance.

What is the flash memory configuration of the R7FA6M5AG2CBM#BC0?

The R7FA6M5AG2CBM#BC0 contains 1.5 MB of on-chip code flash memory organized in dual-bank architecture, plus 8 KB of data flash memory rated for 100,000 program/erase cycles. Dual-bank operation enables background programming and SWAP functionality - allowing firmware updates to be written to one bank while the application executes from the other, ensuring uninterrupted operation.

Which package type and pin count does the R7FA6M5AG2CBM#BC0 use?

The R7FA6M5AG2CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 7 mm × 7 mm with 0.5 mm ball pitch (package code BM). It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, and supports -40°C to +85°C industrial temperature operation. This compact BGA footprint enables high-density PCB layouts for space-constrained edge devices.