Renesas R7FA6M5AG3CBM#BC0

Overview

R7FA6M5AG3CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, 256 KB SRAM with ECC, integrated Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.

For engineers reviewing the R7FA6M5AG3CBM#BC0 datasheet, R7FA6M5AG3CBM#BC0 pinout, R7FA6M5AG3CBM#BC0 application, or R7FA6M5AG3CBM#BC0 equivalent, key selection considerations include its -40°C to +105°C extended temperature rating, 144-pin BGA (7 mm × 7 mm, 0.50 mm pitch) package, dual CAN 2.0B support, hardware-accelerated AES/RSA/ECC cryptography, and integrated Ethernet MAC requiring external PHY.

Technical Context

The R7FA6M5AG3CBM#BC0 implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution states via separate MPU regions (8 each), dual SysTick timers, and CoreSight ETM-M33 trace. Its memory subsystem includes parity/ECC-protected SRAM and dual-bank flash enabling live firmware updates without interruption.

Connectivity is centered on deterministic real-time interfaces: two CAN controllers compliant with ISO 11898-1, an IEEE 802.3-compliant Ethernet MAC linked to EDMAC for zero-CPU packet handling, USBFS with internal transceiver supporting host/device roles, and QSPI/OSPI controllers for high-bandwidth external memory expansion - all coordinated via Event Link Controller (ELC) for autonomous peripheral triggering.

Key Specifications

Pinout & Package

Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0144KB-A footprint (7 mm × 7 mm, 0.50 mm pitch), designed for thermal performance and high I/O density in space-constrained industrial modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Compared with R7FA6M5AG3CBM#BC0, R7FA6M4AF3CBM offers identical security and real-time features at lower cost but omits OSPI for high-bandwidth memory expansion, while STM32H743VI delivers higher clock speed but increases BOM complexity and reduces out-of-box security assurance.

Availability

R7FA6M5AG3CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, automotive diagnostics tools, and medical IoT data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R7FA6M5AG3CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RA6M4 group - including R7FA6M5AG3CBM#BC0 - is engineered for secure, connected, real-time embedded systems demanding integrated Ethernet, dual CAN, hardware crypto acceleration, and functional safety readiness (IEC 61508 SIL2).

FAQ

What is the maximum operating frequency of the R7FA6M5AG3CBM#BC0?

The R7FA6M5AG3CBM#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved with the on-chip PLL driven by the main clock oscillator (8–24 MHz crystal) or high-speed on-chip oscillator (HOCO). The core maintains full performance across its rated temperature range of -40°C to +105°C, with voltage regulation supported between 2.7 V and 3.6 V.

Does the R7FA6M5AG3CBM#BC0 include an integrated Ethernet PHY?

No, the R7FA6M5AG3CBM#BC0 integrates only the Ethernet MAC layer (ETHERC) and DMA controller (EDMAC); it requires an external PHY IC (e.g., LAN8742A or DP83848) connected via RMII or MII interface. The MCU provides all necessary control signals (TX_EN, TXD[1:0], RXD[1:0], CRS_DV, REF_CLK) and management interface (MDIO/MDC) to fully implement IEEE 802.3-compliant Ethernet connectivity.

How many CAN interfaces does the R7FA6M5AG3CBM#BC0 support?

The R7FA6M5AG3CBM#BC0 supports two independent Controller Area Network (CAN) 2.0B modules, each compliant with ISO 11898-1. Each module provides up to 32 configurable mailboxes for transmit/receive operations, supports both standard (11-bit) and extended (29-bit) identifiers, and requires an external CAN transceiver (e.g., TJA1042 or SN65HVD230) for physical layer signaling.

What security features are implemented in the R7FA6M5AG3CBM#BC0?

The R7FA6M5AG3CBM#BC0 integrates Arm TrustZone for hardware-enforced secure/non-secure world separation, a Secure Crypto Engine 9 (SCE9) with AES-128/256, RSA-2048/4096, ECC-P256/P384, SHA224/256, and GHASH acceleration, plus tamper detection pins and secure key injection. These features enable secure boot, encrypted firmware updates, TLS offload, and device identity binding - all verified against Renesas' RA Security Development Standard.

Is the R7FA6M5AG3CBM#BC0 pin-compatible with other RA6M4 variants?

Yes, the R7FA6M5AG3CBM#BC0 shares the same 144-pin FBGA (PLBG0144KB-A) package and pinout with other RA6M4 devices in the BM package variant, including R7FA6M4AF3CBM and R7FA6M4AE3CBM. Pin functions, power domains, and peripheral mappings are consistent across this package family, enabling hardware reuse and migration paths within the RA6M4 series.