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Renesas R7FA6M5AG3CFC#AA0

Part No.:
R7FA6M5AG3CFC#AA0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixR7FA6M5AG3CFC#AA0.pdf
Description:
IC MCU 32BIT 1.5MB FLSH 176LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:300

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Product details

Overview

R7FA6M5AG3CFC from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB dual-bank code flash, 8 KB data flash, 512 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 High-Speed, dual CAN FD, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.

For engineers reviewing the R7FA6M5AG3CFC datasheet, R7FA6M5AG3CFC pinout, R7FA6M5AG3CFC application, or R7FA6M5AG3CFC equivalent, this page delivers verified technical context, real-world use cases, validated alternatives, and supply-chain-ready availability details - all grounded in Renesas R01DS0366EJ0150 Rev.1.50 specifications for the -40°C to +105°C LQFP-176 variant.

Technical Context

The R7FA6M5AG3CFC implements Armv8-M with TrustZone security extension, supporting secure/non-secure execution environments via dual MPU instances (8 regions each) and hardware-isolated peripherals. Its memory subsystem includes dual-bank flash enabling background programming and SWAP operations without CPU interruption.

Connectivity integrates Ethernet MAC (RMII), USB 2.0 HS/FS, two CAN FD controllers (16 TX/RX buffers per channel), SDHI, QSPI, OSPI, and ten SCI channels with UART, SPI, I²C, smart card, and Manchester modes - all managed via Event Link Controller (ELC) for CPU-free peripheral coordination.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 @ 200 MHz max; supports TrustZone, dual MPU, and SysTick timers for secure real-time scheduling.
Memory 1.5 MB dual-bank code flash (background/SWAP), 8 KB data flash (100k P/E cycles), 512 KB SRAM with ECC/parity protection.
Operating Temp -40°C to +105°C; qualified for extended industrial and harsh-environment deployment without derating.
Package 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch); 132 I/O pins, 17 with 5-V tolerance, N-ch open-drain outputs.
Security Secure Crypto Engine (SCE9): AES/RSA/ECC/SHA256 acceleration, tamper detection, 128-bit unique ID, lifecycle management.
Peripherals Dual CAN FD, USB 2.0 HS/FS, ETHERC/EDMAC, SDHI, QSPI/OSPI, 2× ADC12 (5 Msps interleaved), 2× DAC12, CTSU, RTC with VBATT.

Pinout & Package

176-pin LQFP package (PLQP0176KB-C), 24 mm × 24 mm, 0.5 mm pitch, -40°C to +105°C operation. Features 132 general-purpose I/O pins, 17 with 5-V tolerance, N-ch open-drain capability, and dedicated pins for RMII Ethernet, USB HS/FS, CAN FD, QSPI/OSPI, and secure debug (SWDIO/SWCLK).

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Core logic power (2.7–3.6 V); decoupling required per datasheet layout guidelines.
XTAL / EXTAL Main clock oscillator interface Supports 8–24 MHz crystal; enables precise timing for USB, Ethernet, and real-time control loops.
MD / RES Mode select / Reset input Configures boot mode (SCI/USB); active-low reset with internal pull-up ensures reliable startup.
ETXD0–3 / ERXD0–3 Ethernet PHY interface (RMII) Direct connection to external PHY; supports 10/100 Mbps with DMA-accelerated packet handling.
USBDP / USBDM USB 2.0 High-Speed differential pair Integrated transceiver supports HS/FS device/host; requires 3.3 V VBUS sensing and ESD protection.
CANFD0_TX / CANFD0_RX CAN FD Channel 0 interface Complies with ISO 11898-1; supports classical CAN and FD frames up to 5 Mbps with flexible bit rate switching.

Key Features

Feature Design Value
Dual-bank flash with SWAP Enables seamless firmware updates in field-deployed systems without service interruption or external memory.
Secure Crypto Engine (SCE9) Hardware-accelerated AES-256, RSA-2048, ECC-P256, SHA256, and tamper-resistant key storage for root-of-trust boot.
Event Link Controller (ELC) Direct peripheral-to-peripheral triggering (e.g., ADC conversion → DMA transfer → GPT capture) eliminates CPU polling overhead.
RMII Ethernet + USB HS Simultaneous wired connectivity for industrial IoT gateways requiring local device management and cloud uplink.
CTSU + Analog Suite Capacitive touch sensing with noise immunity plus dual 12-bit ADCs (5 Msps interleaved) and dual DACs for HMI and sensor fusion.

Applications

Industrial Gateway Secure Edge Node

Use Scenario: Aggregating Modbus RTU, CAN FD, and analog sensor data from factory-floor equipment into a unified MQTT/HTTP stream over Ethernet and USB.

IC Role / Device Role: Central protocol translator and secure data concentrator with real-time scheduling and encrypted TLS offload via SCE9.

Use Value: Dual CAN FD interfaces and RMII Ethernet enable deterministic multi-protocol bridging while maintaining <100 µs latency for time-critical control loops.

Use Scenario: Tamper-resistant remote monitoring of environmental sensors (temperature, humidity, vibration) in unattended outdoor substations.

IC Role / Device Role: Secure boot-capable edge node performing local anomaly detection, encrypted logging, and periodic OTA firmware validation.

Use Value: TrustZone isolation and SCE9 accelerate cryptographic operations by >10× vs. software-only, enabling full SHA256+AES-256 on every 10-second telemetry packet.

Human-Machine Interface Motor Control Gateway

Use Scenario: Touch-enabled operator panel for HVAC and building automation systems with capacitive sliders, buttons, and status LEDs.

IC Role / Device Role: Integrated CTSU driver and RGB LED PWM controller managing up to 20 touch electrodes and 12 LED channels.

Use Value: On-die CTSU eliminates external touch ICs; GPT32 timers generate precise 100 Hz PWM for flicker-free LED dimming with synchronized touch scan.

Use Scenario: BLDC motor gateway controlling three-phase inverters via PWM, reading hall sensors, and communicating fault status over CAN FD.

IC Role / Device Role: Real-time motor controller with six-channel GPT32 for 3-phase complementary PWM, AGT for hall-edge timing, and CAN FD for diagnostics.

Use Value: Hardware dead-time insertion and synchronized ADC sampling (via ELC) ensure safe commutation timing within ±2 ns jitter across all phases.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration Arm Cortex-M33 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6M5AH3CFC 2 MB code flash (vs. 1.5 MB), same package, temperature grade, and peripheral set. Required when firmware image size exceeds 1.5 MB or future-proofing for feature expansion is needed. Select R7FA6M5AH3CFC if additional flash headroom is critical; otherwise, R7FA6M5AG3CFC offers optimal cost/performance balance.
R7FA6M5BG3CFC 1 MB code flash, same 176-pin LQFP-105°C package, identical peripheral complement except reduced flash capacity. Suitable for cost-sensitive designs with smaller firmware footprints and no need for background flash operations. Choose R7FA6M5BG3CFC only when flash usage remains below 900 KB and dual-bank update capability is not required.

Compared with R7FA6M5AG3CFC, R7FA6M5AH3CFC provides 500 KB more flash for larger firmware or secure bootloader partitions, while R7FA6M5BG3CFC reduces flash cost but eliminates SWAP functionality - making R7FA6M5AG3CFC the balanced choice for production-ready industrial firmware with field-upgrade requirements.

Availability

R7FA6M5AG3CFC is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, human-machine interfaces, motor control gateways, and Ethernet-connected IoT endpoints requiring stable component supply across long product lifecycles.

Supply support for R7FA6M5AG3CFC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RA6M5 Group - including R7FA6M5AG3CFC - is engineered for secure, high-performance industrial IoT edge devices, integrating Arm TrustZone, cryptography acceleration, and rich connectivity to simplify development of certified, scalable embedded systems.

FAQ

What is the maximum operating frequency and core architecture of the R7FA6M5AG3CFC?

The R7FA6M5AG3CFC features an Arm Cortex-M33 core running at a maximum frequency of 200 MHz. It implements the Armv8-M architecture with TrustZone security extensions, dual Memory Protection Units (MPU_S and MPU_NS), and CoreSight ETM-M33 for trace debugging. This architecture enables secure, real-time deterministic execution in industrial and connected applications where both performance and isolation are critical. The R7FA6M5AG3CFC leverages these capabilities to support concurrent secure/non-secure firmware stacks without software overhead.

Does the R7FA6M5AG3CFC support dual-bank flash operation and background programming?

Yes, the R7FA6M5AG3CFC supports dual-bank flash architecture with background programming and SWAP functionality. Its 1.5 MB code flash is organized into two independent banks, allowing one bank to execute code while the other is being reprogrammed - essential for zero-downtime firmware updates in deployed systems. This capability is hardware-accelerated and does not require external memory or bootloader intervention. The R7FA6M5AG3CFC implements this per Renesas R01DS0366EJ0150 Rev.1.50, enabling robust field upgrades in industrial gateways and edge nodes.

What security features are integrated into the R7FA6M5AG3CFC?

The R7FA6M5AG3CFC integrates Renesas' Secure Crypto Engine (SCE9) with hardware-accelerated AES-256, RSA-2048, ECC-P256, and SHA256, plus tamper detection, power analysis resistance, and 128-bit unique ID. Combined with Arm TrustZone, it provides secure boot, isolated execution environments, and lifecycle management. These features are validated in the R7FA6M5AG3CFC's silicon and documented in R01DS0366EJ0150 Rev.1.50. Unlike software-only implementations, SCE9 offloads crypto operations with deterministic latency - critical for secure OTA updates and TLS handshake acceleration in the R7FA6M5AG3CFC.

Which communication interfaces does the R7FA6M5AG3CFC support for industrial connectivity?

The R7FA6M5AG3CFC supports Ethernet (RMII), USB 2.0 High-Speed and Full-Speed, dual CAN FD (ISO 11898-1 compliant), SDHI, QSPI, OSPI, ten SCI channels (UART/SPI/I²C/Manchester), three I²C buses, two SPI ports, SSIE, CEC, and serial sound interfaces. All are accessible on the 176-pin LQFP package. These interfaces enable simultaneous wired connectivity - for example, CAN FD for fieldbus integration, Ethernet for backhaul, and USB for local configuration - without external bridge ICs. The R7FA6M5AG3CFC's ELC and DMAC ensure low-latency, CPU-free data movement between these peripherals.

What is the operating temperature range and package type of the R7FA6M5AG3CFC?

The R7FA6M5AG3CFC is rated for operation from -40°C to +105°C and is supplied in a 176-pin LQFP package (PLQP0176KB-C), measuring 24 mm × 24 mm with 0.5 mm pitch. This industrial-grade temperature range and rugged package make it suitable for deployment in harsh environments such as factory automation, energy infrastructure, and transportation systems. The R7FA6M5AG3CFC's 132 GPIOs include 17 with 5-V tolerance and N-ch open-drain capability - directly supporting legacy industrial signaling standards without level-shifting components.

R7FA6M5AG3CFC#AA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LQFP
Series:
RA6M5
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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All R7FA6M5AG3CFC#AA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5AG3CFC#AA0 meets industry standards.

7.What is the process for return or replacement of R7FA6M5AG3CFC#AA0?

All R7FA6M5AG3CFC#AA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5AG3CFC#AA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M5AG3CFC#AA0 part is unused and in its original packaging.

Return procedure for R7FA6M5AG3CFC#AA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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