Renesas R7FA6M5AH2CBG#AC0
- Part No.:
- R7FA6M5AH2CBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M5AH2CBG#AC0.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:285
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6M5AH2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, SDHI, QSPI/OSPI, advanced analog (dual 12-bit ADC/DAC), and Secure Crypto Engine 9 with TrustZone for secure embedded applications including industrial gateways and connected HMI devices.
For engineers reviewing the R7FA6M5AH2CBG datasheet, R7FA6M5AH2CBG pinout, R7FA6M5AH2CBG application, or R7FA6M5AH2CBG equivalent, key selection considerations include its -40°C to +85°C temperature grade, 176-pin FBGA package (PLBG0176GF-A), dual CAN FD support, integrated Ethernet MAC with RMII interface, and hardware-accelerated cryptography (AES/RSA/ECC/SHA256) for secure boot and firmware updates.
Technical Context
The R7FA6M5AH2CBG implements Armv8-M architecture with security extensions, including separate Secure and Non-secure SysTick timers, dual MPU instances (8 regions each), and CoreSight ETM-M33 for trace. Its memory subsystem supports concurrent read-while-write in dual-bank flash and ECC-protected SRAM for functional safety compliance.
Connectivity is centered on deterministic real-time interfaces: two CAN FD controllers (16 TX/16 RX buffers per channel), Ethernet MAC with DMA coupling to EDMAC, USBHS/USBFS with internal transceivers and 10-pipe FIFO, and QSPI/OSPI for external XIP-capable memory. Security relies on SCE9 accelerators, tamper detection pins, and TrustZone-enforced peripheral attribution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone and PMSAv8 MPU for secure/non-secure partitioning. |
| Memory | 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC. |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC (RMII), USB 2.0 HS/FS, SDHI, QSPI/OSPI, 10× SCI, 3× I²C, 2× SPI. |
| Analog | Dual 12-bit ADC (5 Msps interleaved, 26 channels), dual 12-bit DAC, on-die temperature sensor (TSN). |
| Security | Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC, SHA224/256), TrustZone, tamper pins, lifecycle management. |
| Package & Temp | 176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), operating range -40°C to +85°C. |
| Power | 2.7–3.6 V supply; low-power modes including Deep Software Standby with VBATT RTC backup. |
Pinout & Package
176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A, 7 mm × 7 mm, 0.5 mm ball pitch, Pb-free Sn terminal finish. Designed for high-density PCB layouts with thermal pad under die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per quadrant; decoupling required per datasheet layout guidelines. |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss; supports calendar mode retention. |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz crystal; enables precise timing for USB/Ethernet and system clock generation via PLL. |
| MD | Mode control input | Configures single-chip vs. SCI/USB boot mode at reset; must remain stable during mode transition. |
| RES | Reset input | Active-low asynchronous reset; initiates Power-on Reset sequence and full system initialization. |
| ETXD0–3 / ERXD0–3 | Ethernet PHY interface | RMII-compliant 4-bit transmit/receive data bus; requires 50-Ω impedance-controlled routing to PHY. |
| ETXEN / ERXDV | Ethernet control signals | Transmit enable and receive data valid; synchronized to REF_CLK for deterministic MAC timing. |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 I/O | Differential signaling pins for ISO 11898-1 compliant CAN FD; support data rates up to 5 Mbps. |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed interface | Internal transceiver supports HS/FS; VBUS sensing enables host/device role negotiation per USB specification. |
| QSPI_IO0–3 / OSPI_IO0–7 | Quad/Octa SPI data lines | Configurable for XIP execution; OSPI supports OctaFlash with double-data-rate addressing for high-bandwidth code fetch. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates without application interruption; critical for OTA reliability in field-deployed devices. |
| Hardware crypto acceleration | SCE9 performs AES-256 encryption/decryption in <100 cycles, RSA-2048 signature verify in ~12 ms-reducing CPU load for TLS/secure boot. |
| TrustZone-enforced peripheral security | Each peripheral (CAN, USB, Ethernet) assigned secure/non-secure attribution; prevents unauthorized access to sensitive interfaces. |
| Integrated Ethernet MAC + EDMAC | Zero-copy DMA transfers between SRAM and PHY; eliminates CPU overhead for packet processing in real-time industrial protocols. |
| 12-bit ADC with 5 Msps interleaving | Simultaneous sampling across two ADC units enables high-fidelity motor current sensing or multi-channel sensor fusion. |
Applications
| Industrial Gateway | Secure HMI Controller |
|---|---|
Use Scenario: Edge gateway aggregating Modbus TCP, CAN FD, and EtherCAT data for cloud upload and local PLC coordination. IC Role / Device Role / Timing Role: Central MCU managing protocol translation, encrypted data tunneling, and real-time scheduling of fieldbus traffic. Use Value: Dual CAN FD + Ethernet MAC + SCE9 enables deterministic multi-protocol bridging with TLS 1.3 offload and secure firmware updates over-the-air. | Use Scenario: Touch-enabled operator panel with display, audio feedback, and secure authentication for factory floor equipment. IC Role / Device Role / Timing Role: Main controller handling capacitive touch (CTSU), SSIE audio playback, USB HID, and secure credential storage. Use Value: Integrated CTSU reduces BOM cost; SCE9 protects biometric templates; USBHS supports fast firmware provisioning via USB mass storage. |
| Medical Data Logger | Smart Energy Meter |
Use Scenario: Battery-backed patient monitor logging ECG, SpO₂, and temperature with encrypted local storage and BLE/Wi-Fi upload. IC Role / Device Role / Timing Role: Low-power data acquisition hub with RTC calendar mode, VBATT-protected SRAM, and cryptographic signing of sensor records. Use Value: 512 KB ECC SRAM ensures data integrity during brownouts; SCE9 generates ECDSA signatures for audit-trail compliance (IEC 62304). | Use Scenario: Revenue-grade meter with metrology IC interface, tamper detection, and secure remote firmware updates via cellular backhaul. IC Role / Device Role / Timing Role: Secure host processor managing metrology SPI, tamper pin monitoring, and encrypted communication with utility backend. Use Value: Three dedicated tamper pins + SCE9 key management meet ANSI C12.22 and DLMS/COSEM security requirements for firmware validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH2CBG | Same package, pinout, and peripherals; supports Classical CAN only (no CAN FD). | Lower-cost option where CAN FD bandwidth or ISO 11898-1 FD frame compatibility is not required. | Select when legacy CAN 2.0B suffices and CAN FD is unnecessary-reduces software complexity and certification scope. |
| STM32H743VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, no integrated Ethernet MAC or CAN FD; requires external PHY and transceiver. | Higher raw CPU performance but lacks native CAN FD and secure crypto engine; needs external components for equivalent connectivity. | Choose if floating-point throughput dominates requirements and external component integration is acceptable for Ethernet/CAN. |
Compared with R7FA6M5BH2CBG, the R7FA6M5AH2CBG adds CAN FD capability essential for automotive diagnostics and high-speed industrial networks; versus STM32H743VI, it delivers integrated, certified secure connectivity reducing BOM count and enabling faster time-to-certification for IEC 62443-3-3.
Availability
R7FA6M5AH2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure HMI systems, medical data loggers, and smart energy meters requiring stable component supply across extended product lifecycles.
Supply support for R7FA6M5AH2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RA6M5 group targets secure, high-connectivity embedded systems; the R7FA6M5AH2CBG specifically addresses applications demanding integrated Ethernet, dual CAN FD, hardware crypto, and functional safety support.
FAQ
What is the maximum operating frequency of the R7FA6M5AH2CBG?
The R7FA6M5AH2CBG features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This speed is achieved using the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The R7FA6M5AH2CBG maintains this frequency across its full -40°C to +85°C operating range with appropriate voltage (2.7–3.6 V) and thermal design.
Does the R7FA6M5AH2CBG support Ethernet connectivity?
Yes, the R7FA6M5AH2CBG integrates a fully compliant IEEE 802.3 Ethernet MAC controller (ETHERC) with RMII interface support and tightly coupled Ethernet DMA Controller (EDMAC). It requires an external PHY LSI but handles all MAC-layer functions, including checksum offload and descriptor-based packet buffering-enabling deterministic real-time Ethernet communication without CPU intervention.
What security features does the R7FA6M5AH2CBG include?
The R7FA6M5AH2CBG includes Secure Crypto Engine 9 (SCE9) with hardware acceleration for AES-128/256, RSA-2048/4096, ECC, and SHA224/256; Arm TrustZone for secure/non-secure memory and peripheral partitioning; tamper detection pins; and device lifecycle management. These features collectively support secure boot, encrypted firmware updates, and protection of cryptographic keys in non-volatile memory.
What package type and pin count does the R7FA6M5AH2CBG use?
The R7FA6M5AH2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package, designated PLBG0176GF-A, measuring 7 mm × 7 mm with 0.5 mm ball pitch. It provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant, and supports N-ch open-drain outputs and internal pull-up resistors-optimized for high-density industrial PCB layouts.
How much SRAM and flash memory does the R7FA6M5AH2CBG have?
The R7FA6M5AH2CBG includes 512 KB of on-chip SRAM with configurable parity or ECC protection, and 2 MB of dual-bank code flash memory supporting background programming and SWAP operations. It also provides 8 KB of data flash memory rated for 100,000 program/erase cycles-enabling robust firmware update mechanisms and parameter storage in mission-critical applications.
R7FA6M5AH2CBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5AH2CBG#AC0 FAQ
1.How can I place an order for R7FA6M5AH2CBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5AH2CBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5AH2CBG#AC0 reliable?
The price and inventory of R7FA6M5AH2CBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5AH2CBG#AC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5AH2CBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5AH2CBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5AH2CBG#AC0?
R7FA6M5AH2CBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5AH2CBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5AH2CBG#AC0?
For technical support, including R7FA6M5AH2CBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5AH2CBG#AC0 requirements.
6.How does Aetrix verify that R7FA6M5AH2CBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5AH2CBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5AH2CBG#AC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5AH2CBG#AC0?
All R7FA6M5AH2CBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5AH2CBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5AH2CBG#AC0 part is unused and in its original packaging.
Return procedure for R7FA6M5AH2CBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M5AH2CBG#AC0 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

